QFP 144 PACKAGE
Abstract: QFP 144 package tray
Text: TRAY CONTAINER UNIT : mm 335±1.0 19.9±0.5 295.2±0.5 23±0.5 32.8±0.1 33.5±0.1 PPE A' 23 134±0.5 180±1.0 A NEC LA-3523A-1 HEAT PROOF 23 SECTION A – A' 23 5.8 6.4 8.8 19.8 Applied Package 144-pin Plastic QFP Fine Pitch (1.4mm thick) 176-pin Plastic QFP(Fine Pitch)(1.4mm thick)
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LA-3523A-1
144-pin
176-pin
SSD-A-H5753-1
QFP 144 PACKAGE
QFP 144 package tray
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code M.H
Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray Name LA-3519A-1 LA-0519A-1 144 pin QFP 20 x 20 Terminal Spacing Linear = 0.5 A B 108 109 73 72 F Q R S D C detail of lead end 144 1 37 36 G H I J M M P K N NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of
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LA-3519A-1
LA-0519A-1
S144GJ-50-JE
S144GJ-50-JEU,
code M.H
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NEC 2701
Abstract: 144 pin qfp 2701 NEC B108 JEDEC tray dimension NEC 596 S144GJ-50-3EN-3
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3519A-1 LA-0519A-1 MQFP 20x20 2.7mm 144 pin QFP 20 × 20 Terminal Spacing Linear = 0.5 A B 108 109 73 72 detail of lead end S C D R Q 144 1 37 36 F G H I J M K P S N S L NOTE 1. Controlling dimension millimeter.
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LA-3519A-1
LA-0519A-1
S144GJ-50-3EN-3
SC-596-A*
NEC 2701
144 pin qfp
2701 NEC
B108
JEDEC tray dimension
NEC 596
S144GJ-50-3EN-3
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QFP 144 tray
Abstract: No abstract text available
Text: UNIT : mm 335±1.0 19.9±0.5 295.2±0.5 23±0.5 32.8±0.1 134±0.5 180±1.0 33.5±0.1 PPE A' 25.3 A NEC LA-3519A-1 135°C MAX 25.3 SECTION A-A' 25.3 5.95 8.8 5.8 19.59 Applied Package Quantity pcs 120-pin • Plastic QFP (Fine Pitch) (2.7mm thick) 144-pin · Plastic QFP (Fine Pitch) (2.7mm thick)
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LA-3519A-1
120-pin
144-pin
QFP 144 tray
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144 pin qfp
Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3523A-1 TQFP 20x20 1.4mm 144 pin QFP 20 × 20 Terminal Spacing Linear = 0.5 A B 108 109 73 72 detail of lead end C D S R Q 144 1 37 36 F G H I M J K P M N NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of
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LA-3523A-1
S144GJ-50-8EU-2
144 pin qfp
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QFP JEDEC tray
Abstract: JEDEC TRAY QFP QFP 144 tray QFP 144 package tray
Text: HEAT PROOF 23.4 A' 17.55 25.2 MQFP 20x20 2.7mm A PPE 7 100.8 135.9 UNIT : mm 23.4 25.4 17.8 279.4 315 322.6 SECTION A – A' 23.4 3.92 6.35 7.62 19.55 Applied Package Quantity pcs 144-pin Plastic QFP (Fine Pitch)(2.7mm thick) MAX. 60 Tray Material Heat Proof Temp.
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144-pin
QFP JEDEC tray
JEDEC TRAY QFP
QFP 144 tray
QFP 144 package tray
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a04a
Abstract: No abstract text available
Text: UNIT : mm 335±1.0 304±0.5 16±0.1 18±0.5 15.5±0.5 16±0.1 A' 144±0.5 180±1.0 A 9.55 NEC LA - A04A - 1 HEAT PROOF 9.55 SECTION A–A' 9.55 5.8 6.4 8.8 6.7 Applied Package Quantity pcs 48-pin • Plastic QFP (Fine Pitch)(2.2mm thick) MAX. 200 Tray LA-A04A-1
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48-pin
LA-A04A-1
a04a
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3523A
Abstract: LA-3523A-1 QFP 144 package tray
Text: UNIT : mm 335±1.0 19.9±0.5 295.2±0.5 23±0.5 32.8±0.1 33.5±0.1 PPE A' 23 134±0.5 180±1.0 A NEC LA-3523A-1 HEAT PROOF 23 SECTION A – A' 23 8.8 5.8 6.4 19.8 Applied Package Quantity pcs 144-pin Plastic QFP(Fine Pitch)(1.4mm thick) MAX. 50 Tray LA-3523A-1
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LA-3523A-1
144-pin
3523A
LA-3523A-1
QFP 144 package tray
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R50-E2Y2-24
Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.
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PC-ZIP/DIP20-01
PC-ZIP/DIP28-01
PC-ZIP/DIP28-02
PC-ZIP20/DIP18-01
R50-E2Y2-24
sk 8085
84 pin plcc ic base
Aromat TQ2E-24V
UT1553BCRTM
INTEL 486 dx2
soic40
plcc44 pinout numbers
XE4006E
68hc001
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xc912dg128
Abstract: MC9S12D64 xc912bc32 MC3PHAC XC68HC705B32 MC908AB32CFU MC9S12DP MC68 MC68376 MC908AZ60
Text: MICROCONTROLLERS QUARTER 3, 2002 SG1006/D REV 1 WWW.MOTOROLA.COM/SEMICONDUCTORS What’s New! Product MC68HC908QT1 MC68HC908QT2 Description Introducing the Nitron Family of HC08s. This family of 8- and 16-pin microcontrollers includes six different devices featuring 1.5K to 4K bytes of FLASH, a 2-ch
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SG1006/D
MC68HC908QT1
MC68HC908QT2
HC08s.
16-pin
16-bit
MC68HC908QT4
MC68HC908QY1
MC68HC908QY2
xc912dg128
MC9S12D64
xc912bc32
MC3PHAC
XC68HC705B32
MC908AB32CFU
MC9S12DP
MC68
MC68376
MC908AZ60
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daewon tray
Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA
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AN-071-5
Hand-0444
daewon tray
Daewon T0809050
daewon tray 1F1-1717-AXX
strapack s-669
DAEWON tray 48
DAEWON JEDEC TRAY
DAEWON FBGA
KS-88085
1F1-1717-AXX
tray bga
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S1L50552
Abstract: tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon
Text: ASICs Gate Arrays / Embedded Arrays / Standard Cells 2010 Our goal in the Epson Semiconductor Operations Division is to be a true partner for you, by looking to give you an edge in product development through our concept of "+less design". Gate Arrays / Embedded Arrays / Standard Cells
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S1L60173F00A000
S1L50552
tcon mini-lvds
EPSON tcon
S1X65263
tcon 17 epson
s1k500
SMART ASIC 197
S1K60000
S1L50062
UXGA tcon
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xcm916
Abstract: motorola mc68 908 97 mfu DIODE xc912dg128 908az60 MC68S711E MCM916 MC912 MC908AS60A PV 100 USB
Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: DSP56F807VF80
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DSP56F807VF80
SPSSG1006/D
MC68HC08Aotorola
xcm916
motorola mc68 908
97 mfu DIODE
xc912dg128
908az60
MC68S711E
MCM916
MC912
MC908AS60A
PV 100 USB
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MPXY8600
Abstract: MPC5674 MPC5603 MPC56xx MPC5668G MPC55XX JTAG MPXY8600A MC33730 MPC5516E MPC5517E
Text: Automotive Quarter 4, 2009 SG187Q42009 Rev 37 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: i.MX and MPC5668G product families; S12XE, MPC551x, MPC560xS, MPC563xM, MPC560xB, MPC5533, MPC5534 and MPC5553 products in 208 MAPBGA packages.
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SG187Q42009
MPC5668G
S12XE,
MPC551x,
MPC560xS,
MPC563xM,
MPC560xB,
MPC5533,
MPC5534
MPC5553
MPXY8600
MPC5674
MPC5603
MPC56xx
MPC55XX JTAG
MPXY8600A
MC33730
MPC5516E
MPC5517E
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PCB footprint cqfp 132
Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
Text: Packages and Thermal Characteristics August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336
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XC7236A
XC7272A
XC7318
XC7336
XC7336Q
XC7354
XC7372
XC73108
XC73144
XC9536
PCB footprint cqfp 132
schematic impulse sealer
xc4010e-pq208
footprint pga 84
TSOP 54 PIN footprint 14mm x 20 mm
.65mm bga land pattern
QFP PACKAGE thermal resistance die down
XC4013E-PQ240
XC7272A
XC7318
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mp 9141 es
Abstract: MC33662 MPXY8600 MPC5673F MPC56xx fet e300 MPC5606B MC33905 mpxy8500 MPC5643L
Text: Automotive Quarter 4, 2010 SG187Q42010 Rev 40 FREESCALE SEMICONDUCTOR ANALOG AND MIXED SIGNAL PRODUCTS The product categories range from Power Actuation and Network Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad range of
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SG187Q42010
mp 9141 es
MC33662
MPXY8600
MPC5673F
MPC56xx
fet e300
MPC5606B
MC33905
mpxy8500
MPC5643L
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strapack s-669
Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,
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footprint jedec MS-026 TQFP 128
Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
Text: Packages and Thermal Characteristics June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336
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XC7236A
XC7272A
XC7318
XC7336
XC7336Q
XC7354
XC7372
XC73108
XC73144
XC9536
footprint jedec MS-026 TQFP 128
schematic impulse sealer
footprint jedec MS-026 TQFP
JEDEC Package Code MS-026-AED
BGA 11x11 junction to board thermal resistance
QFP Package 128 lead .5mm
.65mm bga land pattern
MS-026-BGA
Shipping Trays 16x16
XC4010E-PQ208
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MO-83-AF
Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
Text: Packages and Thermal Characteristics August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336
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XC7236A
XC7272A
XC7318
XC7336
XC7336Q
XC7354
XC7372
XC73108
XC73144
XC9536
MO-83-AF
PQFP moisture sensitive handling and packaging
footprint jedec MS-026 TQFP
schematic impulse sealer
BGA 11x11 junction to board thermal resistance
EIA standards 481
JEDEC MS-026 footprint
eftec 64
EFTEC-64
footprint jedec MS-026 TQFP 128
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camtex trays
Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP
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PLCC 84 PINS
Abstract: camtex trays MIL-I-8835A
Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP
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9s08dz32
Abstract: 9s12xeq384 144 QFP 908QY1 9S12XDT256 manual 9S12XHZ256 9s08sg32 9S08DZ128 NEXUS iso MC33810 MC33882
Text: Automotive Quarter 4, 2007 SG187Q42007 Rev 29 FREESCALE SEMICONDUCTOR ANALOG AND MIXED SIGNAL PRODUCTS The product categories range from Power Actuation and Network Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad
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SG187Q42007
9s08dz32
9s12xeq384 144 QFP
908QY1
9S12XDT256 manual
9S12XHZ256
9s08sg32
9S08DZ128
NEXUS iso
MC33810
MC33882
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PDF
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PCB design for very fine pitch csp package
Abstract: 0.3mm pitch csp package oki pitch wcsp reliability 0.4mm pitch BGA 2asic oki packaging gps watch ceramic QFP Package 100 lead
Text: Oki’s ASIC Wafer Level Chip Size Packaging Technology Overview March 2004 1 ASIC W-CSP 02/04 The Market’s Requirement for New ASIC Packaging Technology • The need for increased functionality, smaller device size and lower costs are major challenges for today’s ASIC design engineers
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MIL-I-8835A
Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
Text: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from
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