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    QFP 160 Search Results

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    SM34020APCM40 Texas Instruments SM34020APCM40 144-QFP Visit Texas Instruments
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    Dataman DIL48/QFP160 ZIF-CS PLD-3

    |Dataman DIL48/QFP160 ZIF-CS PLD-3
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark DIL48/QFP160 ZIF-CS PLD-3 Bulk 1
    • 1 $725
    • 10 $725
    • 100 $725
    • 1000 $725
    • 10000 $725
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    Dataman DIL48/QFP160 ZIF-CS PLD-1

    The Dataman Dil48/Qfp160 Zif-Cs Pld-1 Is A Device Specific Adapter For Xilinx Xc9500 In Pqfp160. |Dataman DIL48/QFP160 ZIF-CS PLD-1
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark DIL48/QFP160 ZIF-CS PLD-1 Bulk 1
    • 1 $829.4
    • 10 $806.2
    • 100 $759.8
    • 1000 $759.8
    • 10000 $759.8
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    Dataman DIL48/QFP160 ZIF-CS PLD-5

    The Dataman Dil48/Qfp160 Zif-Cs Pld-5 Is A Device Specific Adapter For Altera Epm7192S In Pqfp160. |Dataman DIL48/QFP160 ZIF-CS PLD-5
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark DIL48/QFP160 ZIF-CS PLD-5 Bulk 1
    • 1 $829.4
    • 10 $806.2
    • 100 $759.8
    • 1000 $759.8
    • 10000 $759.8
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    Dataman DIL48/QFP160-11.03 ZIF-CS MB91

    The Dataman Dil48/Qfp160-11.03 Zif-Cs Mb91-1 Is A Device Specific Adapter For Cypress/Fujitsu/Spansion Mb91360G Series In Qfp160. |Dataman DIL48/QFP160-11.03 ZIF-CS MB91
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark DIL48/QFP160-11.03 ZIF-CS MB91 Bulk 1
    • 1 $829.4
    • 10 $806.2
    • 100 $759.8
    • 1000 $759.8
    • 10000 $759.8
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    Microchip Technology Inc MECH-SAMPLE-LQFP160

    MECH-SAMPLE-LQFP160, Projected EOL: 2049-05-02
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Microchip Technology Inc MECH-SAMPLE-LQFP160 28 Weeks
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    QFP 160 Datasheets Context Search

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    nec 44 pin LQFP

    Abstract: nec 44-pin qfp nec 44-pin LQFP P100G transistor 3s4 P160G P100GF-65-3LA-2 65122 P64G-80-22-2 jbt1
    Text: : Available, : Under development Plastic QFP Nominal Dimensions mm 10 x 10 12 × 12 Lead Pitch Classification (mm) 0.65 QFP 0.8 QFP 0.65 LQFP QFP 0.65 LQFP 14 × 14 0.8 QFP 1.0 QFP 0.8 QFP 1.0 QFP 0.65 QFP 0.8 QFP 32 × 32 0.65 QFP 40 × 40 0.65 QFP 0.65


    Original     		P80GF-80-3L9-2 S94GJ-80-5BG-3 P100G-65-12-2 P100GF-65-3BA1-3 S100GF-65-3BA-3 P100GF-65-3LA-2 S100GF-65-8ET S100GF-65-JBT-1 P120GD-80-5BB-3 P120GD-80-LBB, nec 44 pin LQFP nec 44-pin qfp nec 44-pin LQFP P100G transistor 3s4 P160G P100GF-65-3LA-2 65122 P64G-80-22-2 jbt1 PDF

    A2 diode

    Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
    Text: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5


    Original     		S176GM-50-3EU, S176GM-50-8EU-2 S208GD-50-5ML-2 S208GD-50-5EL-1 P208GD-50-LML, S208GD-50-8EU-2 S216GM-40-8EV P240GN-50-LMU, S256GD-40-LMV, S272GP-50-LMU, A2 diode transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4 PDF

    PA-QFE160SC-C-S-01

    Abstract: No abstract text available
    Text: 1 20 39 47 64 81 98 115 123 142 142 123 115 98 80 97 114 122 141 160 160 141 122 114 81 64 47 39 20 1 97 80 63 46 38 19 Pin 1 19 38 46 63 Top View- QFP QFP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 Bottom View- Base Base QFP Base QFP Base QFP


    Original     		PA-QFE160SC-C-S-01 PDF

    ASE QFP

    Abstract: No abstract text available
    Text: QFP Carrier & Development Socket Features • ■ ■ ■ ■ General Description Q u ad flat pack QFP carriers protect fragile leads on QFP devices d u rin g shipping and device handling. QFP developm ent sockets allow on-board electrical and m echanical


    OCR Scan     		304-pin ASE QFP PDF

    ND-1420-2

    Abstract: QFP JEDEC tray 304-Pin 304 QFP
    Text: QFP Carrier & Development Socket June 1996, ver. 10 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical


    Original     		304-pin 100-Pin ND-1420-2 QFP JEDEC tray 304 QFP PDF

    TO-220 JEDEC

    Abstract: ND-1420-2 QFP Package 80 lead 4-0308 4040 data sheet 9 pin socket nd-3232-3.4 parts detail of 5.1 sound pcb QFP 100 pin QFP Shipping Trays
    Text: QFP Carrier & Development Socket August 1999, ver. 13 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical


    Original     		304-pin 100-Pin TO-220 JEDEC ND-1420-2 QFP Package 80 lead 4-0308 4040 data sheet 9 pin socket nd-3232-3.4 parts detail of 5.1 sound pcb QFP 100 pin QFP Shipping Trays PDF

    QFP JEDEC tray

    Abstract: ND-3232-3 ND-2828-3 304-pin dimensions
    Text: QFP Carrier & Development Socket January 1998, ver. 12 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical


    Original     		304-pin QFP JEDEC tray ND-3232-3 ND-2828-3 304-pin dimensions PDF

    QFP Shipping Trays

    Abstract: ND-1420-2 QFP 100 pin QFP PACKAGE mass 64 leads qfp QFP JEDEC tray
    Text: QFP Carrier & Development Socket August 1999, ver. 13 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical


    Original     		304-pin 100-Pin QFP Shipping Trays ND-1420-2 QFP 100 pin QFP PACKAGE mass 64 leads qfp QFP JEDEC tray PDF

    QFP JEDEC tray

    Abstract: No abstract text available
    Text: QFP Carrier & Development Socket June 1996, ver. 10 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical


    Original     		304-pin QFP JEDEC tray PDF

    YAMAICHI ic357

    Abstract: IC51-1284-1702 IC51-0644-1972 IC357-0484-078 IC357 ic51-1284-1702-2 IC500-1444-002P-2 YAMAICHI ic500 IC51-2084-1052-36 IC500-1004-004
    Text: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:


    Original     		10mA/20mV Dep51-820-2 KS-9376 YAMAICHI ic357 IC51-1284-1702 IC51-0644-1972 IC357-0484-078 IC357 ic51-1284-1702-2 IC500-1444-002P-2 YAMAICHI ic500 IC51-2084-1052-36 IC500-1004-004 PDF

    cxd 158

    Abstract: ot 239 IC51-128 OT 306 IC51-2564-1668-6 IC51-0444-467 IC51-1764 socket Yamaichi ic234 IC51-1764-1505-10 IC217-1444-003
    Text: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Speci cations Insulation Resistance: Dielectric Withstanding Voltage:


    Original     		10mA/20mV cxd 158 ot 239 IC51-128 OT 306 IC51-2564-1668-6 IC51-0444-467 IC51-1764 socket Yamaichi ic234 IC51-1764-1505-10 IC217-1444-003 PDF

    823B

    Abstract: DL201 motorola handbook 84 pin plcc ic base Reliability and quality handbook
    Text: MOTOROLA SEMICONDUCTOR GENERAL INFORMATION Packaging & Case Information 84-Pin PLCC CASE 780A-01 ISSUE A FN SUFFIX 181-Pin PGA CASE 795A–02 ISSUE A HI SUFFIX 128-Pin QFP CASE 862A-02 ISSUE B DD SUFFIX 208-Pin QFP CASE 872A-01 ISSUE TBD DK SUFFIX 160-Pin QFP


    Original     		84-Pin 80A-01 181-Pin 128-Pin 62A-02 208-Pin 72A-01 160-Pin 64A-03 224-Pin 823B DL201 motorola handbook 84 pin plcc ic base Reliability and quality handbook PDF

    Untitled

    Abstract: No abstract text available
    Text: Part No. 96-160M65 - QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. •Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. •Pins are mechanically fastened and soldered to board


    Original     		96-160M65 QQ-B-626. -or96-160M65-P PDF

    IC51-1284-1433

    Abstract: IC51-807 IC51-0484-806 IC51-1444-1354-7 IC51-0644-1240 IC51-2564-1668-6 OT 306 IC51-128 IC217-2404-007 cxd 158
    Text: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:


    Original     		10mA/20mV IC51-0644-820-4 IC51-820-2 KS-9376 IC51-1284-1433 IC51-807 IC51-0484-806 IC51-1444-1354-7 IC51-0644-1240 IC51-2564-1668-6 OT 306 IC51-128 IC217-2404-007 cxd 158 PDF

    Untitled

    Abstract: No abstract text available
    Text: Part No. 96-160M65 - QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board


    Original     		96-160M65 3660M65 -or96-160M65-P 160-PGM15043-30 PDF

    Untitled

    Abstract: No abstract text available
    Text: Part No. 96-160M65 - QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board


    Original     		96-160M65 C36000 ASTM-B16-00. -or96-160M65-P 160-PGM15043-30 PDF

    Untitled

    Abstract: No abstract text available
    Text: 160-306045-10 160 PIN QFP TO 160 PIN QFP THRU HOLE SOCKET PCB FOOTPRINT FEATURES: • A cost effective means of replacing unreliable 160 QFP socket without changing your PCB Layout. • Converts to all soldered connections. GENERAL SPECIFICATIONS: • Board material is .062 thick FR-4 with 1 oz Copper traces,


    Original     		C36000 ASTM-B16-85. MIL-P81728 QQ-N-290. PDF

    Untitled

    Abstract: No abstract text available
    Text: Part No. 96-160M65 - QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board


    Original     		96-160M65 360M65 -or96-160M65-P 160-PGM15043-30 PDF

    ASTM-B16-85

    Abstract: No abstract text available
    Text: Part No. 96-160M65 - QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board


    Original     		96-160M65 96-160M65 -or96-160M65-P 160-PGM15043-30 ASTM-B16-85 PDF

    ASTM-B16-85

    Abstract: MIL-T-10727
    Text: Part No. 96-160M65 - QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board


    Original     		96-160M65 96-160M65 -or96-160M65-P 160-PGM15043-30 ASTM-B16-85 MIL-T-10727 PDF

    Untitled

    Abstract: No abstract text available
    Text: Part No. 96-160M65 - QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board


    Original     		96-160M65 C36000 ASTM-B16-85. MIL-T-10727 -or96-160M65-P 160-PGM15043-30 PDF

    AMS-QQ-N-290

    Abstract: 15X15
    Text: P/N 96-160M65 160-Position, 0.0256 [0.65] Pitch QFP-to-PGA Adapter FEATURES • Convert surface-mount QFP packages to a 15x15 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,


    Original     		96-160M65 160-Position, 15x15 C36000, B16/B16M B579-73 96-160M65-P 15x15 AMS-QQ-N-290 PDF

    Untitled

    Abstract: No abstract text available
    Text: P/N 96-160M65 160-Position, 0.0256 [0.65] Pitch QFP-to-PGA Adapter FEATURES • Convert surface-mount QFP packages to a 15x15 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,


    Original     		96-160M65 160-Position, 15x15 C36000, B16/B16M B579-73 AMS-QQ-N-290 96-160M65-P PDF

    18020

    Abstract: No abstract text available
    Text: P/N 96-160M65 160-Position, 0.0256 [0.65] Pitch QFP-to-PGA Adapter FEATURES • Convert surface-mount QFP packages to a 15x15 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,


    Original     		96-160M65 160-Position, 15x15 C36000, B16/B16M B579-73 AMS-QQ-N-290 96-160M65-P 18020 PDF