QFP 20X20 PACKAGE Search Results

QFP 20X20 PACKAGE Result Highlights (5)

Part	Manufacturer	Description
TPH9R00CQH	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N)
TPH2R408QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance
XPH2R106NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF)
XPH3R206NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF)
TPH4R008QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N)

QFP 20X20 PACKAGE Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
TQFP IC-Socket Abstract: ICP-080-5 qfp 20x20 Package ICP-080-3 ICP-080-4 ICP-080-6 ICP-080-7 TQFP 80 socket Text: IC149 Series SMT QFP/TQFP - 80 Pins (20x20) 0.5mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles: Solvent Durability: Allowable Torque (max.):	Original	IC149 20x20) 100Veff 700Veff IC149 TQFP IC-Socket ICP-080-5 qfp 20x20 Package ICP-080-3 ICP-080-4 ICP-080-6 ICP-080-7 TQFP 80 socket	PDF
ICP-080-3 Abstract: ICP-080-4 ICP-080-5 ICP-080-6 ICP-080-7 qfp 20x20 Package Text: IC149 Series SMT QFP/TQFP - 80 Pins (20x20) 0.5mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles: Solvent Durability: Allowable Torque (max.):	Original	IC149 20x20) 100Veff 700Veff UL94V-0 ICP-080-3 ICP-080-4 ICP-080-5 ICP-080-6 ICP-080-7 qfp 20x20 Package	PDF
qfp 20x20 Package Abstract: 128 QFP 20x20 SF-QFE128SF-L-01 Text: Emulates QFP package 20x20 mm body size 22x22 mm tip to tip PAD DETAIL 20.98mm [0.826"] sqr. 0.508mm 0.020" Ø 0.25mm [Ø 0.010"] 0.305mm 0.012" 19.20mm [0.756"] sqr. 0.50mm typ. [0.020"] Top View A 15.50mm [0.610"] 0.46mm [0.018"] compatible target board	Original	20x20 22x22 508mm 305mm FR4/G10 SF-QFE128SF-L-01 qfp 20x20 Package 128 QFP 20x20	PDF
ICP-080-6 Abstract: ICP-080-7 qfp 20x20 Text: CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW IC149 Series SMT QFP/TQFP - 80 Pins (20x20) 0.5mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles:	Original	IC149 20x20) 100Veff 700Veff IC149 UL94V-0 IC149-80- 12-B5 ICP-080-6 ICP-080-7 qfp 20x20	PDF
IC149-80-117-B5 Abstract: ICP-080-6 ICP-080-4 21-B5 80151 Text: Click here to go back to socket part number overview IC149 Series SMT QFP/TQFP - 80 Pins (20x20) 0.5mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.:	Original	IC149 20x20) 100Veff 700Veff IC149 ICP-080-3 IC149-80-012-B5 IC149-80-112-B5 UL94V-0 IC149-80- IC149-80-117-B5 ICP-080-6 ICP-080-4 21-B5 80151	PDF
FPQ 208 0.5 10 Abstract: FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64 FPQ-44-0 Text: QFP QUAD FLAT PACKAGE ORDERING PROCEDURE FPQ □□□ □. □□ □□ Design NO. Pitch Pin Count Socket Series SPECIFICATIONS Contact resistance: Initial 30mΩ At 10 mA Maximum voltage: AC700V RMS (for 1 minute) Below 0.5mm Pitch	Original	AC700V AC500V FPQ-44-0 FPQ-44-0. FPQ 208 0.5 10 FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64	PDF
1.27mm pitch zif socket 3M 21X21 Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432 Text: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •	Original	SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432	PDF
AK32D300-QFP5X5 Abstract: AK32D600-QFP5X5 AK32D300-QFP7X7 AK32D600-QFP7X7 AK32D600-QFP7X7-A1-1 AK44D600-QFP .65mm AK44D600-QFP .8mm 10x10 AK44D900-QFP 1.0mm AK48D600-QFP .5mm 7x7 AK48D900-QFP .8mm 12x12 Text: ACCUTEK Quad Flat Package QFP DIP or PGA Adapters MICROCIRCUIT CORPORATION DIP or PGA ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek QFP Adapter Modules converts surface	Original	AK208PGA-208QFP QFP-08) QFP-09) AK32D300-QFP5X5 AK32D600-QFP5X5 AK32D300-QFP7X7 AK32D600-QFP7X7 AK32D600-QFP7X7-A1-1 AK44D600-QFP .65mm AK44D600-QFP .8mm 10x10 AK44D900-QFP 1.0mm AK48D600-QFP .5mm 7x7 AK48D900-QFP .8mm 12x12	PDF
Untitled Abstract: No abstract text available Text: Quad Flat Package QFP DIP or PGA Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP or PGA ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek QFP Adapter Modules converts surface	Original	AK208PGA-208QFP QFP-08) QFP-09)	PDF
QFP JEDEC tray Abstract: JEDEC TRAY QFP QFP 144 tray QFP 144 package tray Text: HEAT PROOF 23.4 A' 17.55 25.2 MQFP 20x20 2.7mm A PPE 7 100.8 135.9 UNIT : mm 23.4 25.4 17.8 279.4 315 322.6 SECTION A – A' 23.4 3.92 6.35 7.62 19.55 Applied Package Quantity pcs 144-pin Plastic QFP (Fine Pitch)(2.7mm thick) MAX. 60 Tray Material Heat Proof Temp.	Original	144-pin QFP JEDEC tray JEDEC TRAY QFP QFP 144 tray QFP 144 package tray	PDF
fcBGA PACKAGE thermal resistance Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304 Text: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America	Original		PDF
68HC11L6 Abstract: 68hc11ka4 68HC11PH8 68HC11a1 527 MOSFET TRANSISTOR motorola D65C 68HC05N4 nippon denso 68HC05B6 128 QFP 14x20 Text: CMRQS/D REV 10 MOTOROLA MICROCONTROLLER TECHNOLOGIES GROUP RELIABILITY AND QUALITY MONITOR REPORT Quarter 1, 1997 Semiconductor Product Sector Test results contained herein are for information only. This report does not alter MotorolaÕs standard warranty or product speciÞcations.	Original		PDF
68hc11pa8 Abstract: 68hc11kg4 68B09E 68HC11PH8 HC711KG4 68HC11KA4 68HC57 68HC11L6 HC705B16 motorola 68hc11kg4 Text: MCTG RELIABILITY AND QUALITY 1996 ANNUAL REPORT MRQSY96/D Microcontroller Technologies Group Reliability and Quality 1996 Annual Report To Our Valued Customers: Thank you for selecting Motorola as your preferred supplier of Microcontroller products. We in Motorola’s	Original	MRQSY96/D 68hc11pa8 68hc11kg4 68B09E 68HC11PH8 HC711KG4 68HC11KA4 68HC57 68HC11L6 HC705B16 motorola 68hc11kg4	PDF
HLQFP 176 Package Abstract: FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20 Text: IC Package Line-up As of July, 2009 ● : In mass production ○ : Under development Package name DIP SDIP Package dimensions mm mil 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) 8.9x28 (400) 13x36.72 (600)	Original	13x36 13x45 14x37 17x56 17x57 O-92L OT-25 10x10 15x15 HLQFP 176 Package FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20	PDF

ADV0217 Abstract: ALTERA PART MARKING JESD46C JESD46-C altera date code format ALTERA BGA packages PART MARKING marking RY altera marking altera Date Code Formats FULL LASER MARKING Text: Revision: 1.1.0 CUSTOMER ADVISORY ADV0217 UPDATE FULL LASER MARKING INTRODUCTION Change Description This is an update to ADV0217. See the revision history table for information specific to this update. In January 2003, Altera introduced a full topside laser mark on all Altera plastic body packages.	Original	ADV0217 ADV0217. ADV0217 JESD46-C, 20X20 ALTERA PART MARKING JESD46C JESD46-C altera date code format ALTERA BGA packages PART MARKING marking RY altera marking altera Date Code Formats FULL LASER MARKING	PDF
FPQ-208-0.5-10 Abstract: qfp 20x20 package P1112A IC51-2084-1052-4 fpq-208-0.5-02 IC51-2084-1052 FPQ Package P1114A FPQ-208 FPQ-208-0.5-06 Text: 0.250" 0.175" P1112A 0.250" P1114A QF XMG/20PGA240 SB 2.050" 1993 I.E. © 1993 I.E. 0.100" typ. 0.033" 2.508" Top View Bottom View 2.400" DUT Adaptor Part # 0.972" 0.757" DT-QFE208SA1-P-Z-01 0.080" 1 DT-QFE208SB1-P-Z-01 DT-QFE208SC1-P-Z-01 0.124" ZIF socket used*	Original	P1112A P1114A XMG/20PGA240 DT-QFE208SA1-P-Z-01 DT-QFE208SB1-P-Z-01 DT-QFE208SC1-P-Z-01 QP1-208050-125 FPQ-208-0 IC51-2084-1052-4 FPQ-208-0.5-10 qfp 20x20 package P1112A IC51-2084-1052-4 fpq-208-0.5-02 IC51-2084-1052 FPQ Package P1114A FPQ-208 FPQ-208-0.5-06	PDF
V850E/IA1 Abstract: uPD70F3235 nomenclatura uPD70F3157 uPD70F3237 uPD70F3231 NEC V850 FG2 UPD703128GJ V853A uPD70F3233 Text: V850 32-bit Microcontroller Issue 1/2003 – Devices Device Nickname V853A V850/SA1 V850/SB1 V850/SF1 AVALON V850/SC3 V850ES/SA2 V850ES/SA3 V850ES/KF1 V850ES/KG1 V850ES/KJ1 VENUS V850ES/PM1 V850ES/FE2 V850ES/FF2 V850ES/FG2 V850ES/FJ2 V850ES/SG2 V850ES/SJ2	Original	32-bit V853A V850/SA1 V850/SB1 V850/SF1 V850/SC3 V850ES/SA2 V850ES/SA3 V850ES/KF1 V850ES/KG1 V850E/IA1 uPD70F3235 nomenclatura uPD70F3157 uPD70F3237 uPD70F3231 NEC V850 FG2 UPD703128GJ V853A uPD70F3233	PDF
68hc26 Abstract: 68HC05C4 68hc705p9 68HC05B6 JPC3400 68hc805b6 68705r3 68HC05C12 68HC705B5 68HC68SE Text: CSIC Microcontroller Division Reliability and Quality Quarter 2, 1996 Report MOTOROLA INC., 1996 CSIC MICROCONTROLLER DIVISION RELIABILITY AND QUALITY REPORT TECHNICAL INFORMATION . 1-1 RELIABILITY DATA BY TECHNOLOGY. 2-1	Original		PDF
Untitled Abstract: No abstract text available Text: QFP Open Top CHARACTERISTICS Insulation Resistance Withstanding Voltage Contact Resistance Operating Temperature Contact Force IC200, IC201, IC218 Series 1,000M Q m inim um at 500V D C 500V A C R M S fo r one m inute: IC 200-2084-009, IC 200-2084-010. IC 2 0 1-1004-008	OCR Scan	IC200, IC201, IC218 700VAC IC200-1284-001 1C51-467. KS-11247 IC51-0644-807 KS-9376 IC51-0804-819-1	PDF
Untitled Abstract: No abstract text available Text: Q.F.P. SMT YAM AICHIIC149 Series SPECIFICATIONS • Better for Emulation probe purposes • Footprint designed for socket, can accept QFP packages without board design change CHARACTERISTICS Insulation Resistance Breakdown Voltage Contact Resistance Operating Temp. Range	OCR Scan	AICHIIC149 700MQ UL94V-0 IC149 DC100V 10mA/20V AC100V	PDF
MO-069 Abstract: No abstract text available Text: YAMAICHI Q.F.P., P.QJ1R & L.C.C Test & Burn-In • SPECIFICATIONS • Any kind ofSMT type or IC package type SOP & QFP available. • High reliability, durability and temperature range. • Custom made also available for high pin count and fine-pilch IC packages.	OCR Scan	73x73 15x15 MO-069	PDF
Untitled Abstract: No abstract text available Text: !C PACKAGES ip * yjjj TCP Tape Carrier Package /COB (Chip on Board)/CDF ( • TCP Keeping with the trend toward smaller and lighter equipment incorporating even more advanced functions, surface-mount 1C packages have recently come to the forefront with the aim of achieving higher pin counts, finer pin pitches, and reduced dimensions. TCP (Tape	OCR Scan		PDF
ICP-100-4 Abstract: No abstract text available Text: YAMAICHI ELECTRONICS INC bflE D m clcm S 5 3 b D0DDS7t 765 • Q.F.P. sm d _ YAMAICHI IC149 Series SPECIFICATIONS • Better for Emulation probe purposes • Footprint designed for socket, can accept QFP packages without board design change CHARACTERISTICS	OCR Scan	IC149 700MQ UL94V-0 IC149-Q64-QM-S5 IC149-064-001-S5 20x20 28x28 ICP-064-2 ICP-080-2 ICP-080-4 ICP-100-4	PDF
0 280 130 069 Abstract: No abstract text available Text: YA MA IC HI E L E C T R O N I C S INC bfiE D • T ì M S S B b 0 0 0 G S5 7 D^b PQFP / TQFP MATCHm oPÁCKm um zü l*KOf fins Body Sue Pitch A B C » IC51-0324-805 IC51-0324-1498 IC51-0444-1195-3 32 32 44 5x5 7X 7 10x10 7.0 9.0 12.6 7.0 9.0 12.6 5.0 7.0 10.0	OCR Scan	IC51-0324-805 IC51-0324-1498 IC51-0444-1195-3 10x10 IC51-0444-825 IC51-467JCS-11247 IC51-0444-798 30mfi 0 280 130 069	PDF

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QFP 20X20 PACKAGE Search Results

QFP 20X20 PACKAGE Result Highlights (5)

QFP 20X20 PACKAGE Datasheets Context Search

TQFP IC-Socket

ICP-080-3

qfp 20x20 Package

ICP-080-6

IC149-80-117-B5

FPQ 208 0.5 10

1.27mm pitch zif socket 3M 21X21

AK32D300-QFP5X5

Untitled

QFP JEDEC tray

fcBGA PACKAGE thermal resistance

68HC11L6

68hc11pa8

HLQFP 176 Package

ADV0217

FPQ-208-0.5-10

V850E/IA1

68hc26

Untitled

Untitled

MO-069

Untitled

ICP-100-4

0 280 130 069