QFP-48A
Abstract: No abstract text available
Text: Package MITSUMI Packages QFP Series Units : mm QFP-32A QFP-44B QFP-48A QFP-56B QFP-64B QFP-64E 0.15+0.10 -0.06 33 48 49 52 14.0±0.20 17.9±0.40 32 64 32 0.8±0.20 33 14.0±0.2 16.0±0.3 51 0.6±0.2 0.15+0.10 -0.05 20 17 64 19 1 0.15 M 0~10° 16 14.0±0.2
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QFP-32A
QFP-44B
QFP-48A
QFP-56B
QFP-64B
QFP-64E
QFP-80B
QFP-80D
QFP-48A
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ka8511
Abstract: KS8804b KT8557 KT8593
Text: FUNCTION GUIDE LINEAR ICs 4. TELECOMMUNICATION APPLICATION Application Device Package Continued Circuit Function 1 Chip CLP ÎT KA8510 ff KA8511 ff KA8522 t f KA8523 64 DIP/64 QFP 64 DIP/64 QFP Included dual conversion receiver, transmitter, compandor and PLL
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KA8510
KA8511
KA8522
KA8523
DIP/64
KA8510/22
KA8511/23:
24MHz)
KS8803B:
KS8804b
KT8557
KT8593
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC To Top / Package Lineup / Package Index FPT-64C-A02 64-pin ceramic QFP Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal FPT-64C-A02 64-pin ceramic QFP (FPT-64C-A02)
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FPT-64C-A02
64-pin
FPT-64C-A02)
F64012SC-2-2
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PDF
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC To Top / Package Lineup / Package Index FPT-64C-A01 64-pin ceramic QFP Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal FPT-64C-A01 64-pin ceramic QFP (FPT-64C-A01)
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FPT-64C-A01
64-pin
FPT-64C-A01)
F64002SC-2-3
conte010)
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PDF
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC FPT-64C-A01 64-pin ceramic QFP Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal FPT-64C-A01 64-pin ceramic QFP (FPT-64C-A01) 17.91(.705) TYP 16.00(.630) 14.00±0.25
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FPT-64C-A01
64-pin
FPT-64C-A01)
F64002SC-2-3
chang010)
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PDF
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64-PIN
Abstract: 5510-10
Text: QUAD FLAT L-LEADED PACKAGE 64 PIN CERAMIC FPT-64C-A01 64-pin ceramic QFP Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal FPT-64C-A01 64-pin ceramic QFP (FPT-64C-A01) 0.51(.020) TYP 17.91(.705) TYP 16.00(.630) 14.00±0.25 TYP (.551±.010)
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FPT-64C-A01
64-pin
FPT-64C-A01)
F64002SC-2-3
5510-10
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PDF
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC FPT-64C-A02 64-pin ceramic QFP Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal FPT-64C-A02 64-pin ceramic QFP (FPT-64C-A02) 0.51(.020) TYP 9.40(.370)TYP 17.91(.705)
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FPT-64C-A02
64-pin
FPT-64C-A02)
F64012SC-2-2
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PDF
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FPT-64P-M09
Abstract: QFP064-P-1212-1
Text: QUAD FLAT L-LEADED PACKAGE 64 PIN PLASTIC FPT-64P-M09 EIAJ code : ∗QFP064-P-1212-1 Lead pitch 0.65mm Package width x package length 12 × 12mm Lead shape Gullwing Sealing method Plastic mold 64-pin plastic QFP FPT-64P-M09 64-pin plastic QFP (FPT-64P-M09)
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FPT-64P-M09
QFP064-P-1212-1
64-pin
FPT-64P-M09)
F64018S-1QFP064-P-1212-1
FPT-64P-M09
QFP064-P-1212-1
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE 64 PIN CERAMIC FPT-64C-A02 Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal 64-pin ceramic QFP FPT-64C-A02 64-pin ceramic QFP (FPT-64C-A02) 0.51(.020) TYP 9.40(.370)TYP 17.91(.705) TYP 16.00(.630) 14.00±0.25 TYP
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FPT-64C-A02
64-pin
FPT-64C-A02)
F64012SC-2-2
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PDF
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Untitled
Abstract: No abstract text available
Text: 64-304518-10 Adapter for using 64 Pin QFP in Place of 64 Shrink Dip Package Hitachi HD6475208 and Others FEATURES: • A cost effective means of upgrading to QFP without changing your PCB layout. • Pin for Pin Layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper
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HD6475208
C36000
ASTM-B-16-85.
MIL-P-81728
QQN-290.
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PDF
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HD6475208
Abstract: HD647520
Text: 64-304518-10 Adapter for using 64 Pin QFP in Place of 64 Shrink Dip Package Hitachi HD6475208 and Others FEATURES: • A cost effective means of upgrading to QFP without changing your PCB layout. • Pin for Pin Layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper
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HD6475208
C36000
ASTM-B-16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
HD647520
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PDF
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Untitled
Abstract: No abstract text available
Text: 64-304518-10 Adapter for using 64 Pin QFP in Place of 64 Shrink Dip Package Hitachi HD6475208 and Others FEATURES: • A cost effective means of upgrading to QFP without changing your PCB layout. • Pin for Pin Layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper
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Original
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HD6475208
C36000
ASTM-B-16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
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PDF
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Untitled
Abstract: No abstract text available
Text: 64-304518-10 Adapter for using 64 Pin QFP in Place of 64 Shrink Dip Package Hitachi HD6475208 and Others FEATURES: • A cost effective means of upgrading to QFP without changing your PCB layout. • Pin for Pin Layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper
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Original
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HD6475208
C36000
ASTM-B-16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
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PDF
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Untitled
Abstract: No abstract text available
Text: 64-304518-10 Adapter for using 64 Pin QFP in Place of 64 Shrink Dip Package Hitachi HD6475208 and Others FEATURES: • A cost effective means of upgrading to QFP without changing your PCB layout. • Pin for Pin Layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper
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Original
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HD6475208
C36000
ASTM-B-16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
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PDF
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frequency hopping spread spectrum
Abstract: spread spectrum receiver circuity TDD synchronizer cordless phone "control signals" cordless phone Transceiver IC direct sequence spread spectrum P115 Z87000 Z87001 Z87010
Text: PRELIMINARY CUSTOMER PROCUREMENT SPECIFICATION 1 Z87001/Z87L01 1 ROMLESS SPREAD SPECTRUM CORDLESS PHONE CONTROLLER FEATURES Device ROM * KWords Z87001 Z87L01 64 64 RAM I/O (Words) Lines 512 512 32 32 Package Information • 144-Pin QFP 144-Pin QFP Note: *Maximum accessible external ROM
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Z87001/Z87L01
Z87001
Z87L01
144-Pin
and001010
frequency hopping spread spectrum
spread spectrum receiver circuity
TDD synchronizer
cordless phone "control signals"
cordless phone Transceiver IC
direct sequence spread spectrum
P115
Z87000
Z87001
Z87010
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64QFP
Abstract: No abstract text available
Text: 82078 64 PIN 12.1 Package Outline for the 64 QFP Part The 82078 addresses the current need of the smaller and thinner packages, for the current market. The size of the part is becoming increasingly important in the portable computer market. The QFP part considerably
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64-Lead
820rminal
64QFP
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PDF
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A2 diode
Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
Text: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5
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S176GM-50-3EU,
S176GM-50-8EU-2
S208GD-50-5ML-2
S208GD-50-5EL-1
P208GD-50-LML,
S208GD-50-8EU-2
S216GM-40-8EV
P240GN-50-LMU,
S256GD-40-LMV,
S272GP-50-LMU,
A2 diode
transistor A2
3eb data
lmu a2
TQFP 32 PACKAGE
272-pin
TQFP 100 Pitch 0,4
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132 pin PGA socket
Abstract: No abstract text available
Text: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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95-132I25
UNSor95-132I25-P
132-PGM13072-30
132 pin PGA socket
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PDF
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Untitled
Abstract: No abstract text available
Text: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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95-100I25
Allr95-100I25-P
100-PGM13069-30
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PDF
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100-PGM13069-30
Abstract: No abstract text available
Text: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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95-100I25
UNr95-100I25-P
100-PGM13069-30
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PDF
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ASTM-B16-85
Abstract: No abstract text available
Text: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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95-100I25
95-100I25
-or95-100I25-P
100-PGM13069-30
ASTM-B16-85
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PDF
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132 pin PGA socket
Abstract: No abstract text available
Text: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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Original
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95-132I25
360configurations
-or95-132I25-P
132-PGM13072-30
132 pin PGA socket
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PDF
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Untitled
Abstract: No abstract text available
Text: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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95-132I25
All32I25
-or95-132I25-P
132-PGM13072-30
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PDF
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95-132I25
Abstract: ASTM-B16-85
Text: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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95-132I25
95-132I25
-or95-132I25-P
132-PGM13072-30
ASTM-B16-85
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PDF
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