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Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A87A-1 TQFP 28x28 1.4mm 208 pin QFP 28 × 28 Terminal Spacing Linear = 0.5 A B 156 157 105 104 detail of lead end C D S Q 53 52 208 1 F G H I J M K P M N NOTE L ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of
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LA-3A87A-1
S208GD-50-8EU-2
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3525a
Abstract: OT-001T-01 LA-0525A-1 LA-3525A-1
Text: Mounting Pad Packing NEC Tray Name LA-3525A-1 LA-0525A-1 JEDEC Tray OT-001T-01 208 pin QFP 28 x 28 Terminal Spacing Linear = 0.5 A B 156 157 105 104 F Q R S C D detail of lead end 208 1 G 53 52 H I J M M P K N NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of
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LA-3525A-1
LA-0525A-1
OT-001T-01
S208GD-50-5ML-2
SC-598-C*
3525a
OT-001T-01
LA-0525A-1
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3525a
Abstract: LA-0525A-1 LA-3525A-1 0502N
Text: Mounting Pad Packing NEC Tray Name LA-3525A-1 LA-0525A-1 JEDEC Tray OT-001T-01 208 pin QFP 28 x 28 Terminal Spacing Linear = 0.5 A B 156 157 105 104 F 208 1 G R Q S D C detail of lead end 53 52 H I M J M P K N L NOTE ITEM Each lead centerline is located within 0.08 mm (0.003 inch) of
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LA-3525A-1
LA-0525A-1
OT-001T-01
SC-598-D*
S208GD-50-5EL-1
3525a
LA-0525A-1
0502N
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QFP JEDEC tray
Abstract: MAX. 50 Tray
Text: Packing NEC Tray Name LA-3508A-1 Mounting Pad JEDEC Tray OT-001T-01 208 pin QFP 28 x 28 Terminal Spacing Linear = 0.5 A B 156 157 105 104 detail of lead end S C D Q 208 1 R 53 52 F G H I J M P K N S S L M NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.12 mm (0.005 inch) of
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LA-3508A-1
OT-001T-01
P208GD-50-LML,
QFP JEDEC tray
MAX. 50 Tray
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strapack s-669
Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,
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QFP Shipping Trays
Abstract: ND-1420-2 QFP 100 pin QFP PACKAGE mass 64 leads qfp QFP JEDEC tray
Text: QFP Carrier & Development Socket August 1999, ver. 13 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical
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304-pin
100-Pin
QFP Shipping Trays
ND-1420-2
QFP 100 pin
QFP PACKAGE mass
64 leads qfp
QFP JEDEC tray
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ND-1420-2
Abstract: QFP JEDEC tray 304-Pin 304 QFP
Text: QFP Carrier & Development Socket June 1996, ver. 10 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical
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304-pin
100-Pin
ND-1420-2
QFP JEDEC tray
304 QFP
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QFP JEDEC tray
Abstract: No abstract text available
Text: QFP Carrier & Development Socket June 1996, ver. 10 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical
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304-pin
QFP JEDEC tray
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TO-220 JEDEC
Abstract: ND-1420-2 QFP Package 80 lead 4-0308 4040 data sheet 9 pin socket nd-3232-3.4 parts detail of 5.1 sound pcb QFP 100 pin QFP Shipping Trays
Text: QFP Carrier & Development Socket August 1999, ver. 13 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical
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304-pin
100-Pin
TO-220 JEDEC
ND-1420-2
QFP Package 80 lead
4-0308
4040 data sheet
9 pin socket
nd-3232-3.4
parts detail of 5.1 sound pcb
QFP 100 pin
QFP Shipping Trays
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QFP JEDEC tray
Abstract: ND-3232-3 ND-2828-3 304-pin dimensions
Text: QFP Carrier & Development Socket January 1998, ver. 12 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical
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304-pin
QFP JEDEC tray
ND-3232-3
ND-2828-3
304-pin dimensions
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7404
Abstract: jedec do 35 QFP JEDEC tray
Text: UNIT : mm HEAT PROOF 7 PPE A' 32.8 37.02 74.04 30.93 MQFP 28 x 28 3.2mm 135.9 A 32.8 37.02 27.93 259.14 315 322.6 SECTION A-A' 32.8 Applied Package 120-pin Plastic QFP 3.2mm thick 208-pin Plastic QFP (Fine Pitch) (3.2mm thick) Quantity (pcs) MAX. 24 Tray
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120-pin
208-pin
7404
jedec do 35
QFP JEDEC tray
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7404
Abstract: MQFP Tray 28 QFP JEDEC tray 32MM
Text: UNIT : mm HEAT PROOF 7 PPE A' 32.8 37.02 74.04 30.93 MQFP 28 x 28 3.2mm 135.9 A 32.8 37.02 27.93 259.14 315.0 322.6 SECTION A-A' 32.8 3.82 6.35 7.62 27.3 Applied Package 208-pin Plastic QFP (Fine Pitch) (3.2mm thick) 256-pin Plastic QFP (Fine Pitch) (3.2mm thick)
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208-pin
256-pin
7404
MQFP Tray 28
QFP JEDEC tray
32MM
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MIL-I-8835A
Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
Text: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from
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QFP28
Abstract: 7404 QFP JEDEC tray JEDEC TRAY QFP
Text: TRAY CONTAINER UNIT : mm 3 x 8=24 NEC 135° C MAX. A' 34.20 37.02 27.93 34.20 74.04 30.93 37.02 QFP28×28×3.2A 135.9 PPE A 259.14 315.0 322.6 SECTION A-A' 34.20 (3.77) (6.35) 7.62 27.35 Applied Package Quantity (pcs) 120-pin Plastic QFP (3.2mm thick) 160-pin Plastic QFP (3.2mm thick)
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QFP28
208-pin
256-pin
120-pin
160-pin
SSD-A-H7605
7404
QFP JEDEC tray
JEDEC TRAY QFP
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daewon tray
Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA
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AN-071-5
Hand-0444
daewon tray
Daewon T0809050
daewon tray 1F1-1717-AXX
strapack s-669
DAEWON tray 48
DAEWON JEDEC TRAY
DAEWON FBGA
KS-88085
1F1-1717-AXX
tray bga
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NEC A39A
Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES
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C10943XJ6V0IF00
IEI-635,
IEI-1213)
ED-7411
NEC A39A
NEC A39A 240
SOP28 330 mil land pattern
NEC A39A 8 PIN
mjh 106
120-PIN 282 185 01
smd TRANSISTOR code b6
ED-7500
transistor a39a
SIP 400B
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LGA 1156 PIN OUT diagram
Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)
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DIP8-P-300-2
DIP14-P-300-2
DIP16-P-300-2
DIP18-P-300-2
MIL-M-38510
MIL-STD-883
LGA 1156 PIN OUT diagram
QSJ-44403
LGA 1150 Socket PIN diagram
LGA 1155 Socket PIN diagram
IC107-26035-20-G
LGA 1151 PIN diagram
REFLOW lga socket 1155
IC107-3204-G
TB 2929 H alternative
LGA 1155 pin diagram
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IC 50061
Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing
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IC51-128
Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
Text: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials
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camtex trays
Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP
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PLCC 84 PINS
Abstract: camtex trays MIL-I-8835A
Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP
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HT 1200-4
Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher
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March/98
intern844-347360
HT 1200-4
IC51-2084-1052-11
IC51-0242-1341
YAMAICHI ic234
transistor fpq 630
IC51-0404-1511
fpq-144-0.5-03
648-0482211-A01
IC189 Series Open Top SOP, SSOP, TSOP Type I a
HLQFP 176 Package drawing
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removal tool from EPLD socket
Abstract: No abstract text available
Text: QFP Carrier & Development Socket M a rc h 1995, ver. 7 Features D ata S h ee t • ■ ■ ■ General Description Q uad flat pack QFP carriers protect fragile leads on Altera QFP devices during shipping and device handling. Development sockets allow on-board electrical and mechanical
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OCR Scan
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304pin
removal tool from EPLD socket
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PDF
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ASE QFP
Abstract: No abstract text available
Text: QFP Carrier & Development Socket Features • ■ ■ ■ ■ General Description Q u ad flat pack QFP carriers protect fragile leads on QFP devices d u rin g shipping and device handling. QFP developm ent sockets allow on-board electrical and m echanical
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OCR Scan
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304-pin
ASE QFP
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PDF
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