Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC FPT-208C-A01 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-208C-A01 208-pin ceramic QFP (FPT-208C-A01) 31.64±0.30SQ (1.246±.012) 28.00±0.30SQ
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FPT-208C-A01
208-pin
FPT-208C-A01)
F208009SC-1-3
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-A01 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-208C-A01 208-pin ceramic QFP (FPT-208C-A01)
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FPT-208C-A01
208-pin
FPT-208C-A01)
F208009SC-1-3
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M04 208-pin plastic QFP FPT-208P-M04 208-pin plastic QFP (FPT-208P-M04) Lead pitch 0.50 mm Package width x package length 28.0 × 28.0 mm Lead shape Gullwing Sealing method Plastic mold
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FPT-208P-M04
208-pin
FPT-208P-M04)
F208020S-c-3-4
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FPT-208C-C02
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC FPT-208C-C02 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina FPT-208C-C02 208-pin ceramic QFP
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FPT-208C-C02
208-pin
FPT-208C-C02)
F208007SC-3-3
FPT-208C-C02
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208-PIN
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-A01 208-pin ceramic QFP Lead pitch 0.50mm Lead shape Gullwing Sealing method Metal seal FPT-208C-A01 208-pin ceramic QFP (FPT-208C-A01) 31.64±0.30SQ (1.246±.012) 28.00±0.30SQ (1.102±.012) 25.50(1.004)
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FPT-208C-A01
208-pin
FPT-208C-A01)
F208009SC-1-3
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FPT-208C-C02
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-C02 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina FPT-208C-C02 208-pin ceramic QFP (FPT-208C-C02)
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FPT-208C-C02
208-pin
FPT-208C-C02)
F208007SC-3-3
FPT-208C-C02
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nitride
Abstract: Aluminum nitride QFP method 208
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-C03 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-208C-C03 208-pin ceramic QFP (FPT-208C-C03)
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FPT-208C-C03
208-pin
FPT-208C-C03)
F208013SC-2-3
nitride
Aluminum nitride QFP
method 208
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nitride
Abstract: Aluminum nitride QFP C1995
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-C04 Lead pitch 0.5 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.5 mm Base ceramic material Aluminum nitride 208-pin ceramic QFP FPT-208C-C04 208-pin ceramic QFP (FPT-208C-C04)
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FPT-208C-C04
208-pin
FPT-208C-C04)
FFPT-208C-C04
nitride
Aluminum nitride QFP
C1995
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QFP20
Abstract: QFP208-P-2828-1
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN PLASTIC FPT-208P-M01 EIAJ code : ∗QFP208-P-2828-1 208-pin plastic QFP Lead pitch 0.50mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold FPT-208P-M01 208-pin plastic QFP (FPT-208P-M01)
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FPT-208P-M01
QFP208-P-2828-1
208-pin
FPT-208P-M01)
QFP20
QFP208-P-2828-1
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208-PIN
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-C04 208-pin ceramic QFP Lead pitch 0.5 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.5 mm Base ceramic
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FPT-208C-C04
208-pin
FPT-208C-C04)
F208014SC-1-3
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FPT-208C-C02
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-C02 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic
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FPT-208C-C02
208-pin
FPT-208C-C02)
F208007S
F208007SC-3-3
FPT-208C-C02
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-C03 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic
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FPT-208C-C03
208-pin
FPT-208C-C03)
F208013SC-2-3
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC FPT-208C-C04 208-pin ceramic QFP Lead pitch 0.5 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.5 mm Base ceramic material Alumina nitride FPT-208C-C04
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FPT-208C-C04
208-pin
FPT-208C-C04)
F208014SC-1-3
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M04 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type
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FPT-208P-M04
208-pin
FPT-208P-M04)
F208020S-1C-1
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC FPT-208C-C03 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina nitride FPT-208C-C03
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FPT-208C-C03
208-pin
FPT-208C-C03)
F208013SC-2-3
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QFP208-P-2828-1
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC To Top / Package Lineup / Package Index FPT-208P-M01 EIAJ code :∗QFP208-P-2828-1 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing
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FPT-208P-M01
QFP208-P-2828-1
208-pin
FPT-208P-M01)
F208001S-3C-3
QFP208-P-2828-1
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QFP208-P-2828-2
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC To Top / Package Lineup / Package Index FPT-208P-M02 EIAJ code :∗QFP208-P-2828-2 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing
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FPT-208P-M02
QFP208-P-2828-2
208-pin
FPT-208P-M02)
F208012S-2C-4
QFP208-P-2828-2
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QFP PACKAGE thermal resistance
Abstract: 208-PIN
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN PLASTIC FPT-208P-M04 208-pin plastic QFP Lead pitch 0.50mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type available FPT-208P-M04
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FPT-208P-M04
208-pin
FPT-208P-M04)
F208020S-1C-1
QFP PACKAGE thermal resistance
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QFP208-P-2828-1
Abstract: FPT-208P-M01
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M01 EIAJ code :∗QFP208-P-2828-1 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold FPT-208P-M01
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FPT-208P-M01
QFP208-P-2828-1
208-pin
FPT-208P-M01)
F208001S-3C-3
QFP208-P-2828-1
FPT-208P-M01
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QFP208-P-2828-2
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN PLASTIC FPT-208P-M02 EIAJ code : ∗QFP208-P-2828-2 208-pin plastic QFP Lead pitch 0.50mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold Features Heat dissipation panel inserted
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FPT-208P-M02
QFP208-P-2828-2
208-pin
FPT-208P-M02)
QFP208-P-2828-2
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pin diagrams of basic gates
Abstract: BGA and QFP Package Nand gate Crystal Oscillator 272000 astro tool HQFP-208 MCM NAND qcm 5 sim 980 CE61
Text: To Top / Lineup / Index Product Line-up FUJITSU Semicustom Products Semicustom Products Gate arrays Sea-of-Gate CMOS Macro-embedded type cell arrays CMOS Standard cell CMOS Semicustom microcontrollers QCM series* ASTRO NT Bi-CMOS SIM/PLL SERIES Bi-CMOS SAW PLL
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VL82C486-FC2
Abstract: CXD1160AQ VL82C486 VL82C315 XC3042-100PQ100C XC3020-70-PQ100C NCR53C700 NCR53C720 xc3042-100pq CXD1160
Text: Issued March 1999 232-5109 Data Pack H Surface mount test clips Manufacturers device number to RS stock number cross reference Data Sheet N.B. Some devices have the same basic type numbers but are available in several package styles. Before selecting a test clip ensure that the package type matches that of the device to be tested.
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A1280
A1425
A1460
ATT1C05
CL-GD6440
CL-SII260-15QC-D
VL82C486-FC2
CXD1160AQ
VL82C486
VL82C315
XC3042-100PQ100C
XC3020-70-PQ100C
NCR53C700
NCR53C720
xc3042-100pq
CXD1160
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CXD1160aq
Abstract: VL82C486-FC2 VL82C486FC NCR53C720 vl82c486 cxd1160 74HC125 EPM7128 d75304gf A1280
Text: Issued March 1997 232-5109 Data Pack H Surface mount test clips Manufacturers device number to RS stock number cross reference Data Sheet N.B. Some devices have the same basic type numbers but are available in several package styles. Before selecting a test clip ensure that the package type matches that of the device to be tested.
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A1240-2
A1240A-2
A1280
A1425
A1460
CXD1160aq
VL82C486-FC2
VL82C486FC
NCR53C720
vl82c486
cxd1160
74HC125
EPM7128
d75304gf
A1280
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VL82C486-FC2
Abstract: NCR53C720 XCS3201FN SN74ACT8818 NCR53C700 cxd1160 VL82C316 CL-GD6440 xc3042-100pq100c CXD1160AQ
Text: Issued November 1994 018-994 Data Pack H Surface mount test clips Manufacturers device number to RS stock number cross reference Data Sheet N.B. Some devices have the same basic type numbers but are available in several package styles. Before selecting a test clip ensure that the package type matches that of the device to be tested.
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A1240-2
A1240A-2
A1280
A1425
A1460
VL82C486-FC2
NCR53C720
XCS3201FN
SN74ACT8818
NCR53C700
cxd1160
VL82C316
CL-GD6440
xc3042-100pq100c
CXD1160AQ
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