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    QFP128 TRAY DIMENSION Search Results

    QFP128 TRAY DIMENSION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D6417709SHF200BV Renesas Electronics Corporation 32-bit Microcontrollers, HFQFP, /Tray Visit Renesas Electronics Corporation
    JM38510/12203BGA Renesas Electronics Corporation Amplifiers, CAN, /Tray Visit Renesas Electronics Corporation
    DF38122WV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), TFQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HWV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation

    QFP128 TRAY DIMENSION Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    t06 sot23

    Abstract: TQFN-56 TQFN-64 ZL42 SC70-5 w08 SOT23-5 w08 TQFN56 TQFN-72 LQFP64 reel size ZG12
    Text: Plastic IC Package Information Tape & Reel Tape and Reel packing system protects Pericom’s products from mechanical and electrical damage and is designed for automatic pick-and-place equipment. Pericom’s tape and reel specifications are in compliance with Electronics Industries Association standards for embossed carrier taping of sur face mount components for Automatic Handling EIA-481, current


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    PDF EIA-481, 13-inch t06 sot23 TQFN-56 TQFN-64 ZL42 SC70-5 w08 SOT23-5 w08 TQFN56 TQFN-72 LQFP64 reel size ZG12

    JEDEC TRAY DIMENSIONS

    Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
    Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors


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    PDF manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package

    SOT411

    Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
    Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which


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    sdc 603

    Abstract: SDC-602 plcc 52 SOCKET sdc603 MX-500P-21 sdc 606 sdc606 STTC-136 132 qfp extraction tool METCAL SP200
    Text: soldering desoldering & rework systems contents and preface Contents 1 Introducing the QX2 2 QX2 system elements and functions 3 QX2 system elements and functions 4 Part numbers for the QX2 5 The power of SmartHeat 6 The power of SmartHeat 7 MX rework systems


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    Hitachi DSA002710

    Abstract: BF 331 TRANSISTORS 1117 S
    Text: H8S/2633 Series, H8S/2633 F-ZTAT Hardware Manual ADE-602-165 Rev. 1.0 3/23/99 Hitachi, Ltd. Notice When using this document, keep the following in mind: 1. This document may, wholly or partially, be subject to change without notice. 2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the


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    PDF H8S/2633 ADE-602-165 TFP-120 FP-128 Hitachi DSA002710 BF 331 TRANSISTORS 1117 S