teletext
Abstract: QFP64 SAA5246A teletext decoder SAA5249 caption QFP64 package DIP40 DIP48 SAA5252
Text: INTEGRATED CIRCUITS DATA SHEET Selection table for teletext and closed caption 1996 Sep 19 File under Integrated Circuits, IC22 1996 Sep 19 2 − All WST All WST By region FCC compliant By region All WST LANGUAGE/REGION QFP64 or DIP48 PACKAGE QFP64 or DIP40
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SAA5254
SAA5281
SAA5252
QFP64
DIP48
DIP40
DIP24
80C51
SAA5249
teletext
SAA5246A
teletext decoder
SAA5249
caption
QFP64 package
DIP40
DIP48
SAA5252
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PDF
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QFP64
Abstract: QFP-64
Text: Philips Semiconductors Package outlines QFP64: plastic quad flat package; 64 leads lead length 1.95mm ; body 14 x 20 x 2.8 mm 1995 Feb 04 3092 SOT319-2
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QFP64:
OT319-2
QFP64
QFP-64
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PDF
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QFP64
Abstract: QFP-64
Text: Philips Semiconductors Package outlines QFP64: plastic quad flat package; 64 leads lead length 2.35 mm ; body 14 x 20 x 2.75 mm 1995 Feb 04 5-22 SOT208-1
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QFP64:
OT208-1
QFP64
QFP-64
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PDF
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qfp64
Abstract: QFP-64 sot208-1 14X20
Text: Philips Semiconductors Package outlines QFP64: plastic quad flat package; 64 leads lead length 2.35 mm ; body 14 x 20 x 2.75 mm 1995 Feb 04 SOT208-1
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QFP64:
OT208-1
qfp64
QFP-64
sot208-1
14X20
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PDF
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QFP64-P-1414
Abstract: No abstract text available
Text: QFP64-P1414-0.80-BK 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.87 TYP. 5/Sept.21,1999
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QFP64-P1414-0
80-BK
QFP64-P-1414
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PDF
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Untitled
Abstract: No abstract text available
Text: QFP64-P-1414-0.80-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.87 TYP. 6/Feb. 23, 2001
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QFP64-P-1414-0
80-BK
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PDF
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Untitled
Abstract: No abstract text available
Text: QFP64-P-1420-1.00-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.25 TYP. 4/Nov. 28, 1996
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QFP64-P-1420-1
00-BK
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PDF
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QFP64 package
Abstract: QFP64-B2
Text: PACKAGE DIMENSIONS QFP64-B2 17.2±0.4 ~ 10º 14.0±0.3 49 32 64 17 1 17.2 ±0.4 33 14.0 ±0.3 48 0.15 M 16 0.35±0.1 +0.1 0.15 - 0.05 3.05MAX 0.8 0.8±0.2 0.15 +0.1 0.1 - 0.05 Mold Base UNIT : mm
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QFP64-B2
05MAX
QFP64 package
QFP64-B2
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PDF
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QFP64 package
Abstract: D1 Package
Text: PACKAGE DIMENSIONS QFP64-D1 12.0±0.4 0 ~ 10º 10.0±0.3 32 64 17 10.0±0.3 49 16 0.2±0.05 0.15 1.75±0.1 0.5 M 2.05M AX 1 +0.1 0.15 - 0.05 12.0±0.4 33 48 0.5±0.2 0.1±0.1 Mold Base UNIT : mm
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QFP64-D1
QFP64 package
D1 Package
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PDF
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QFP64 package
Abstract: QFP64-C1
Text: PACKAGE DIMENSIONS QFP64-C1 25.6±0.4 20.0±0.3 64 20 1 19.6 ±0.4 32 2.7±0.1 52 14.0±0.3 33 3.0MAX 51 ~ 10º 19 0.4 +0.15 -0.1 0.12 M 0.15 +0.1 - 0.05 1.0 1.6±0.2 0.15 0.1±0.1 Mold Base UNIT : mm
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QFP64-C1
QFP64 package
QFP64-C1
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HC49
Abstract: QFP64 GOAL SEMICONDUCTOR
Text: VMX1020-C16/I16 VERSA MIX System Design Notes Description This application note is intended to provide hands-on information about the hardware requirements for a VERSA MIX based system. VMX1020 Pin configuration The VMX1020 is available in standard QFP64 package.
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VMX1020-C16/I16
VMX1020
QFP64
VMX1020.
VMX1020
16MHz
HC49
GOAL SEMICONDUCTOR
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PDF
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diode b3
Abstract: QFP64 package QFP64-B3
Text: PACKAGE DIMENSIONS QFP64-B3 0 ~ 12° 16.8±0.4 14.0±0.3 48 32 64 17 14.0±0.3 49 1 16.8±0.4 33 16 0.35±0.15 0.16 M +0.1 0.15 - 0.05 3.0MAX 0.8 0.6±0.3 0.15 +0.1 0.1 - 0.05 Mold Base UNIT : mm
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QFP64-B3
diode b3
QFP64 package
QFP64-B3
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PDF
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QFP64 package
Abstract: 1414 QFP64 QFP64-P QFP64-P-1414-0
Text: QFP64-P-1414-0.80-BK Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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QFP64-P-1414-0
80-BK
QFP64 package
1414
QFP64
QFP64-P
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PDF
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QFP64-P-1420-1
Abstract: QFP-64P
Text: QFP64-P-1420-1.00-BK Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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QFP64-P-1420-1
00-BK
QFP-64P
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PDF
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QFP64 package
Abstract: QFP64-C2
Text: PACKAGE DIMENSIONS QFP64-C2 23.9±0.4 20.0±0.3 64 20 1 17.9±0.4 32 2.7±0.1 52 14.0±0.3 33 3.0M AX 51 ~ 10º 19 +0.15 0.4 - 0.1 +0.1 0.15 - 0.05 1.0 0.12 M 0.8±0.2 0.15 0.1±0.1 Mold Base UNIT : mm
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QFP64-C2
QFP64 package
QFP64-C2
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP64 package SOT393-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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QFP64
OT393-1
OT393-1
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PDF
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Untitled
Abstract: No abstract text available
Text: Adapters - Phyton, Inc. Page 1 of 1 Device Programmers and Development Tools for Microcontrollers Home Quick Links Help Desk Products E-Shop Support Contact News Site Map AE-Q64-XMEGA Downloads All Programmers DIP40/QFP64 specialized adapter for Atmel AVR microcontrollers.
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AE-Q64-XMEGA
DIP40/QFP64
ChipProg-48
ChipProg-40
Dip40
QFP-64
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PDF
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diode k1
Abstract: No abstract text available
Text: PACKAGE DIMENSIONS QFP64-K1 12.0 ±0.2 0 ~ 10ﾟ 10.0TYP 32 64 17 10.0TYP 49 12.0 ± 0.2 33 48 16 1 0.2 ± 0.10 0.08 M 0.17 ± 0.05 1.70MAX 0.5 0.5 ±0.2 GD-Q06401Y-1 Ver.2005-11-22 0.1 ± 0.1 Mold Base UNIT : mm
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QFP64-K1
70MAX
GD-Q06401Y-1
diode k1
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PDF
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Untitled
Abstract: No abstract text available
Text: Adapters - Phyton, Inc. Page 1 of 1 Device Programmers and Development Tools for Microcontrollers Home Quick Links Help Desk Products E-Shop Support Contact News Site Map AE-Q64-HCS08-2 Downloads All Programmers DIP40/QFP64 specialized adapter for Motorola/Freescale microcontrollers.
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AE-Q64-HCS08-2
DIP40/QFP64
ChipProg-48
DIP-40
QFP-64
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PDF
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Untitled
Abstract: No abstract text available
Text: Adapters - Phyton, Inc. Page 1 of 1 Device Programmers and Development Tools for Microcontrollers Home Quick Links Help Desk Products E-Shop Support Contact News Site Map AE-Q64-HCS08-1 Downloads All Programmers DIP40/QFP64 specialized adapter for Motorola/Freescale microcontrollers.
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AE-Q64-HCS08-1
DIP40/QFP64
ChipProg-48
DIP-40
QFP-64
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PDF
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QFP64-H1
Abstract: QFP64 package
Text: PACKAGE DIMENSIONS QFP64-H1 PRELIMINARY 12.0±0.2 0 ~ 10° 10.0±0.2 32 64 17 10.0±0.2 0.2±0.1 0.08 1.4±0.2 +0.1 0.15- 0.05 M Mold Base 0.1 11.0±0.2 +0.15 0.1- 0.1 1.25TYP 0.5 0.5±0.2 16 1 1.85MAX 1.25TYP 49 12.0±0.2 33 48 UNIT : mm
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QFP64-H1
25TYP
85MAX
QFP64-H1
QFP64 package
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PDF
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QFP80-P-1420-0
Abstract: TMP96C031Z QFP80-P
Text: TOSHIBA 64 Pin FP Flat Package Package : For TMP96C031Z Package Name :QFP64-P-1420-1.00A o X Unit r\ n mm (VI 270289 PKG900-2 TOSHIBA Package 80 Pin QFP (Flat Package) Package Name: QFP80-P-1420-0.80B CM PKG900-1
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OCR Scan
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TMP96C031Z
QFP64-P-1420-1
PKG900-2
QFP80-P-1420-0
PKG900-1TOSHIBA
PKG900-1
QFP80-P
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PDF
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QFP80-P-1420-0
Abstract: 80H-F
Text: TOSHIBA 8 0 h f> Q F P Flat Package mm QFP80-P-1420-0.80B (N PKG900-1 TOSHIBA /\"7 > r - v - ! 64 tf > QFP (Flat Package) QFP64-P-1420-1.00A : mm o o o 4. n o (N PKG900-2
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OCR Scan
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QFP80-P-1420-0
PKG900-1
QFP64-P-1420-1
PKG900-2TOSHIBA
PKG900-2
80H-F
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PDF
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Untitled
Abstract: No abstract text available
Text: TO SH IB A TMP93CS32 Low Voltage / Low Power CMOS 16-bit Microcontrollers TMP93CS32F 1. Outline and Device Characteristics The TMP93CS32 is high-speed, advanced 16-bit microcontroller developed for controlling medium to large-scale equipment. The TMP93CS32 is housed in 64-pin flat package P-QFP64-1414-0.80A .
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OCR Scan
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16-bit
TMP93CS32
TMP93CS32F
TMP93CS32
64-pin
P-QFP64-1414-0
900/L
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PDF
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