Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS - XA Example: Philips 80C51 extended Architecture P51XA G3 7 K B A J Derivative Nam e- - — J ; Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) BD = Thin Quad Rat Pack (TQFP)
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80C51
P51XA
25MHz
30MHz
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN CERAMIC To Top / Package Lineup / Package Index QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50 mil Package width x package length 650 × 650 mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01
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QFJ-44C-C01
44-pin
QFJ-44C-C01)
J44001SC-4-2
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QFJ-32C-C01
Abstract: No abstract text available
Text: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC QFJ-32C-C01 32-pin ceramic QFJ Lead pitch 50 mil Package width x package length 450 × 550 mil Lead shape J bend Sealing method Cerdip QFJ-32C-C01 32-pin ceramic QFJ (QFJ-32C-C01)
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QFJ-32C-C01
32-pin
QFJ-32C-C01)
J32001SC-3-2
QFJ-32C-C01
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PDF
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC To Top / Package Lineup / Package Index QFJ-32C-C01 32-pin ceramic QFJ Lead pitch 50 mil Package width x package length 450 × 550 mil Lead shape J bend Sealing method Cerdip QFJ-32C-C01
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QFJ-32C-C01
32-pin
QFJ-32C-C01)
J32001
J32001SC-3-2
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PDF
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QFJ-44C-C01
Abstract: No abstract text available
Text: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN CERAMIC QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50 mil Package width x package length 650 × 650 mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01 44-pin ceramic QFJ (QFJ-44C-C01)
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QFJ-44C-C01
44-pin
QFJ-44C-C01)
J44001SC-4-2
QFJ-44C-C01
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PDF
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quad flat j-leaded package
Abstract: QFJ-44C-C01
Text: QUAD FLAT J-LEADED PACKAGE 44 PIN CERAMIC QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50mil Package width x package length 650 × 650mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01 44-pin ceramic QFJ (QFJ-44C-C01) 17.53±0.13SQ (.690±.005) +0.25
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Original
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QFJ-44C-C01
50mil
650mil
44-pin
QFJ-44C-C01)
J44001SC-4-2
quad flat j-leaded package
QFJ-44C-C01
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PDF
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SM84PG-ACTEL
Abstract: A1240XL SM-10 SM68P-ACTEL SM160PQ-ACTEL SM132CQ-ACTEL A42MX36 1200XL SM176TQ-ACTEL A1010DXV
Text: Silicon Sculptor - Adapter Module Selector Guide Page 1 of 3 BACK Adapter Module Selector Guide Package Types: BG - Plastic Ball Grid Array CQ - Ceramic Quad Flat Pack PG - Ceramic Pin Grid Array PL - Plastic J-Leaded Chip Carrier Device Type A1010B A1010B
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A1010B
A1010DXV
A1020B
SM84PG-ACTEL
A1240XL
SM-10
SM68P-ACTEL
SM160PQ-ACTEL
SM132CQ-ACTEL
A42MX36
1200XL
SM176TQ-ACTEL
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PDF
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QFJ-32C-C01
Abstract: No abstract text available
Text: QUAD FLAT J-LEADED PACKAGE 32 PIN CERAMIC QFJ-32C-C01 Lead pitch 50mil Package width x package length 450 × 550mil Lead shape J bend Sealing method Cerdip 32-pin ceramic QFJ QFJ-32C-C01 32-pin ceramic QFJ (QFJ-32C-C01) 3.44±0.35 (.135±.014) 2.11(.083)REF
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Original
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QFJ-32C-C01
50mil
550mil
32-pin
QFJ-32C-C01)
J32001SC-3-2
QFJ-32C-C01
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PDF
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Untitled
Abstract: No abstract text available
Text: M _a cl t PIN N U M B ER REF. O N LY D E TA IL G / / 0.1 c 2.2 2.0 i /4\ | ^ | q.05Tc j FREESCALE SEMICONDUCTOR, ALL RIGHTS RESERVED. TITLE: n SEATING PLAN 0.05 DETAIL G INC. MECHANICAL OUTLINE POWER QUAD FLAT NON-LEADED PACKAGE PWR QFN 23 TERMINAL, 0.9 PITCH(1 2X12X2.1 )
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2X12X2
98ENG03008D
5M-1994.
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PDF
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52887
Abstract: 44 pins CQFPJ 81F64842B Qr Code young
Text: 28 pins CQFPJ Ceramic Quad Flat Pack J Leaded CQFPJ Package Outlines Code:QI Date: 17/04/97 Rev. B – 23-Aug-01 1 CQFLJ 44 pins CQFPJ Code:QL Date: 18/10/96 2 Rev. B – 23-Aug-01 52 pins CQFPJ Code:Q3 Date: 29/11/91 3 CQFLJ Rev. B – 23-Aug-01 CQFLJ 68 pins CQFPJ
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23-Aug-01
52887
44 pins CQFPJ
81F64842B
Qr Code
young
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PDF
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p80c32
Abstract: p80c32 16 P80C52
Text: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: P 8 X C X X X E B P N - T 0 = ROMLESS 5 = Bond-Out emulation 3 = ROM 7 = O T P -E P R O M 9 = FEEPROM (FLASH) J T T T , | | ] | j r Philips North America Package Code A = Plastic Leaded Chip Carrier (PLCC)
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P80C31,
P80C32
P90C87,
P80C52
33MHz,
P51XA
80C51
125cC
16MHz
20MHz
p80c32
p80c32 16
P80C52
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PDF
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P80C32
Abstract: P80C52 ROMless P80C31 80C51 P-80C31 p80c32 16 p80c32 philips
Text: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: P8 X CX X X E B P N Philips North America Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) FA = Hermetic Cerdip (window) KA = CerQuad (window) N = Plastic Dual In-Line
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P80C31,
P80C32
P80C87,
P80C52
12MHz
16MHz
20MHz
32kHz
12MH12
P80C32
P80C52
ROMless
P80C31
80C51
P-80C31
p80c32 16
p80c32 philips
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PDF
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Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: 5 3 7 9 = = = = = P8 X C X X X E B P N Philips North America Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) FA = Hermetic Cerdip (window) KA = CerQuad (window)
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OCR Scan
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P80C31,
P80C32
P80C87,
P80C52
24MHz,
33MHz,
P51XA
80C51
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PDF
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footprint plcc 208
Abstract: PLASTIC QUAD FLAT PACK 160 PINS DIMENSION LXT304A LXT305A LXT307 LXT310 LXT317 LXT318 LXT325 A 3120 8 Pins ICs
Text: Fall 1998 Communication ICs Data Book Table 1: Telecom Product/Packages Product Table 1: Telecom Product/Packages Product Package Package SXT6051 208 QFP SXT6251 208 QFP SXT6282 144-Pin LQFP LXT300Z/301Z 28-Pin DIP and 28-Pin PLCC LXT304A 28-Pin DIP and 28-Pin PLCC
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SXT6051
SXT6251
SXT6282
144-Pin
LXT300Z/301Z
28-Pin
LXT304A
footprint plcc 208
PLASTIC QUAD FLAT PACK 160 PINS DIMENSION
LXT304A
LXT305A
LXT307
LXT310
LXT317
LXT318
LXT325
A 3120 8 Pins ICs
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PDF
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sqfp 14x20
Abstract: 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes
Text: Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 FEATURES GENERAL DESCRIPTION • Wide temperature range The TDA1308 is an integrated class AB stereo headphone driver contained in an SO8 or a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has
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30MHz
80C51
sqfp 14x20
74ALSXX
P51XA-G3
OTP-e
PC 74 HCT 32 P
sQFP 14X14
TDA1308 equivalent
SG 2368
tqfp 14x14 tray
TDA1308 application notes
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PDF
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Untitled
Abstract: No abstract text available
Text: GLOSSARY OF PACKAGING ABBREVIATIONS CLCC Ceramic Leaded Chip Carrier. Solder sealed, mul tilayer ceramic. COB Chip on Board. CQFP Glass sealed Ceramic Quad Flat Pack with gull wing leads. Also called CERQUAD or CQUAD. CQUAD Same as CQFP. DPAK Small power transistor package for surface mount.
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O-220)
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PDF
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motorola case 711-03
Abstract: No abstract text available
Text: General Release Specification — MC68HC05C4A Section 14. M echanical Specifications 14.1 Contents 14.2 Introduction. . 131 14.3 40-Pin Plastic Dual In-Line DIP Package (Case 711-03). . 132
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MC68HC05C4A
40-Pin
42-Pin
44-Lead
24A-01)
MC68HC05C4A
motorola case 711-03
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PDF
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Z8PE003PZ010SC
Abstract: 124 008r
Text: Packaging Product Specification PS007203-0101 ZiLOG Worldwide Headquarters • 910 E. Hamilton Avenue • Campbell, CA 95008 Telephone: 408.558.8500 • Fax: 408.558.8300 • www.ZiLOG.com This publication is subject to replacement by a later edition. To determine whether
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PS007203-0101
Z8PE003PZ010SC
124 008r
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PDF
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Untitled
Abstract: No abstract text available
Text: Sony Package Product Name . . Features P a c k a g e name D e s c r ip t io n Symbol Material* DUAL I I P «ifi* IN LI NK PACKAGE P 2. 54m m I10UMIL) C SINGLE IN L I N E S I P 2.54mm P ÍJ 0 0 M Í L ) PACKAGE 2.54mm ZIG ZAG Z Standard 1 P IN L I N E
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I10UMIL)
I100MIL)
778mlat
V50MIL)
50MIL
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PDF
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16v8 PLD
Abstract: 48C101 7c63000a 7C128 2061A B1225 CERAMIC QUAD FLATPACK CQFP
Text: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256L 7C245L 7C09389V 7C4292V 7B991 C = CMOS B = BiCMOS SUFFIX -45 D M B -70 S C -35 P C -15 J C -25 AS C -5 J C FAMILY CMOS SRAM - FAST
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7C128
62256L
7C245L
7C09389V
7C4292V
7B991
MIL-STD-883C
48C101,
W42C31,
231XNZ
16v8 PLD
48C101
7c63000a
2061A
B1225
CERAMIC QUAD FLATPACK CQFP
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PDF
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7C245
Abstract: b1225 CERAMIC QUAD FLATPACK CQFP 22V10 PAL CMOS device 228X 16R8 7B991 PAL20 7C404 7C128
Text: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256 7C245 7C006 7C404 7B991 C = CMOS B = BiCMOS SUFFIX -45 D L-70 S L-35 P V-15 J -25 D -5 J MB C C C MB C FAMILY CMOS SRAM - FAST CMOS SRAM - SLOW
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7C128
7C245
7C006
7C404
7B991
MIL-STD-883C
T229X,
W42C31,
231XNZ
WB1330,
7C245
b1225
CERAMIC QUAD FLATPACK CQFP
22V10 PAL CMOS device
228X
16R8
7B991
PAL20
7C404
7C128
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PDF
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p80c652ifp
Abstract: A11P p2U marking S87C652 p80c652
Text: Phlips Semiconductors Product spécification CMOS single-chip 8-bit microcontrollers PIN CONFIGURATIONS DESCRIPTION The P80C652/83C652 Single-Chip 8-Bit Microcontroller is manufactured in an advanced CMOS process and is a derivative of the 80C51 microcontroller family. The
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OCR Scan
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80C652/83C652
P80C652/83C652
80C51
80C652/83C652
80C51.
83C652
80C652
87C652
8XC652
p80c652ifp
A11P
p2U marking
S87C652
p80c652
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PDF
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LND150N8
Abstract: LND250K1 LNE150K1 MS-012AA H1 SOT-89 LND150
Text: Package Outlines 0.770 +0.005 –0.010 ΦD 0.285 ± 0.015 0.065 ± 0.015 F A Seating Plane 0.040 ± 0.002 0.450 ± 0.030 Φb L 0.500 ± 0.010 DIA. 0.215 ± 0.005 e1 S 0.173 ± 0.005 R TYP. G r2 2 Mounting Holes 0.156 ± 0.005 0.430 ± 0.005 r1 ΦP e 0.665 ± 0.005
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100-Lead
O-220
LND150N8
LND250K1
LNE150K1
MS-012AA
H1 SOT-89
LND150
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PDF
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NATIONAL SEMICONDUCTOR MARKING CODE sot
Abstract: national marking code NATIONAL SEMICONDUCTOR MARKING CODE DEVICE MARKING CODE table sot-23 MARKING CODE ZA On semiconductor date Code dpak YEAR A national top marking codes national marking date code national marking code sot sot23 mark code KS
Text: Device Marking Conventions National Semiconductor marks devices sold in order to provide device identification and manufacturing traceablility information. The method of presenting the information marked on the device is dependent on the size of the device package
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Original
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CSP-9-111S2)
CSP-9-111S2.
NATIONAL SEMICONDUCTOR MARKING CODE sot
national marking code
NATIONAL SEMICONDUCTOR MARKING CODE
DEVICE MARKING CODE table
sot-23 MARKING CODE ZA
On semiconductor date Code dpak YEAR A
national top marking codes
national marking date code
national marking code sot
sot23 mark code KS
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PDF
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