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    Text: Recommended P.C.B Layout 12.80 8 —0O.92±O.1 2.00 m : Q2D1 22MRQ08 □ D 197LJ 1 2 1. No. of pins. 2. Selective plating ’S1,—05u" Min. gold in contact area/ 100u" Min. Tin in solder area. ’S2,—Gold flash in contact area/ 100u'’ Min. Tin in solder area.


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    22MRQ08 197LJ R008SX19ZU 08XXXâ PDF