H150X
Abstract: SC100
Text: Bulletin I0499J rev. C 03/07 SC100.5. Series SCHOTTKY DIE 105 x 105 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 (14 ± 0.4) c C d b D A NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). Ø 2. CONTROLLING DIMENSION: (MILS).
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I0499J
SC100.
S1025
SC100R015x5x
SC100S020x5x
SC100S030x5x
SC100S045x5x
SC100S060x5x
SC100H045x5x
SC100H100x5x
H150X
SC100
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Untitled
Abstract: No abstract text available
Text: Bulletin I0405J rev. C 03/07 SC021.5. Series SCHOTTKY DIE 21 x 45 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 c (14 ± 0.4) A d b C D NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS)
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I0405J
SC021.
S1025
SC021
R015x5x
SC021S020x5x
SC021S030x5x
SC021S045x5x
SC021S060x5x
SC021H045x5x
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H150X
Abstract: S1025 SC200 SC-200
Text: Bulletin I0505J rev. E 03/07 SC200.5. Series SCHOTTKY DIE 200 x 200 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 (14 ± 0.4) c C d b D A NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). Ø 2. CONTROLLING DIMENSION: (MILS).
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I0505J
SC200.
S1025
SC200
R015x5x
12-Mar-07
H150X
SC-200
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semitec
Abstract: No abstract text available
Text: Bulletin I0405J rev. C 03/07 SC021.5. Series SCHOTTKY DIE 21 x 45 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 c (14 ± 0.4) A d b C D NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS)
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PDF
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I0405J
SC021.
S1025
SC021
R015x5x
SC021S020x5x
SC021S030x5x
SC021S045x5x
SC021S060x5x
SC021H045x5x
semitec
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Untitled
Abstract: No abstract text available
Text: Bulletin I0499J rev. C 03/07 SC100.5. Series SCHOTTKY DIE 105 x 105 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 (14 ± 0.4) c C d b D A NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). Ø 2. CONTROLLING DIMENSION: (MILS).
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Original
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PDF
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I0499J
SC100.
S1025
SC100R015x5x
SC100S020x5x
SC100S030x5x
SC100S045x5x
SC100S060x5x
SC100H045x5x
SC100H100x5x
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SC125
Abstract: S1025 VR 317 ST
Text: Bulletin I0507J rev. F 03/07 SC125.5. Series SCHOTTKY DIE 125 x 125 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 c (14 ± 0.4) C d b D A NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). Ø 2. CONTROLLING DIMENSION: (MILS).
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I0507J
SC125.
S1025
SC125R015x5x
12-Mar-07
SC125
VR 317 ST
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SC060H100
Abstract: S1025 SC060
Text: Bulletin I0502J rev. F 03/07 SC060.5. Series SCHOTTKY DIE 60 x 60 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 c (14 ± 0.4) C d b D A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS)
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I0502J
SC060.
S1025
SC060
R015x5x
SC060S020x5x
SC060S030x5x
12-Mar-07
SC060H100
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S1025
Abstract: SC170.5. Series
Text: Bulletin I0506J rev. E 05/03 SC170.5. Series SCHOTTKY DIE 170 x 115 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 (14 ± 0.4) c A d b C D NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). Ø Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS).
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I0506J
SC170.
S1025
SC170R015x5x
12-Mar-07
SC170.5. Series
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