Radian Heatsinks
Abstract: Chomerics T710 heatsink CS2290 IXF1110 Intricast Company
Text: 25mm Round Pin BGA Heatsink / 5-Pack home > shop > additional heatsinks > cs2290 Submit Query 25mm Round Pin BGA Heatsink / 5-Pack CS2290 Thermal Resistance °C/W Heatsink Size Weight (W x L x H) oz. 200 lfm 400 lfm 600 lfm 25.0 mm x 25.0 mm x 9.8 mm (0.2)
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cs2290
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10-port
CS2290:
com/cs2290
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Radian Heatsinks
Chomerics T710
heatsink
CS2290
Intricast Company
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LOCTITE 384
Abstract: ECCOBOND 281 melcor 705TC Emerson Cuming tellurex abletherm E629 E710 mastersil
Text: ATE-A2 Cooling High Density, High Power Pin Electronics TEST AND MEASUREMENT PRODUCTS Overview With IC’s ever-increasing speeds and pin counts, the power density inside Automated Test Equipment is also increasing. Keeping the high-speed pin drivers and other
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Radian Heatsinks
Abstract: Intricast Company Electrocube
Text: Stacked-Ceramic Caps Brave High Temperatures By Scott Harris, Advanced Products Marketing Manager, AVX, Myrtle Beach, South Carolina A series of stacked-ceramic capacitors specially designed for SMPSs features the thermal performance of conventional ceramics without
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TB-093
Abstract: Heat Technology
Text: Technical Brief High-Speed Board Design Advisor Thermal Management Introduction This document contains a step-by-step tutorial and checklist with a best-practice set of step-by-step guidelines to support users to design and review their thermal design with Stratix II GX FPGAs.
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T5 LAMP SCHEMATIC
Abstract: Thermagon thermaflo 21D0 design ideas BL-2000 C2511B acrylic Led light schematic silver band gap Aavid Thermalloy 6063
Text: APPLICATION NOTE 02 Bright Lights. Bright Ideas. TM THERMAL MANAGEMENT OF LAMINA HIGH BRIGHTNESS LIGHT ENGINES Solid state lighting, in the form of light emitting diodes LEDs , has many advantages over traditional light sources, such as longer life, new form factors, and higher efficiencies. These advantages make LEDs attractive for
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FC-BGA
Abstract: T0812012 daewon tray
Text: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.
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AN-659-1
FC-BGA
T0812012
daewon tray
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KS-886H
Abstract: Kostat tray
Text: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive
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AN-657-1
KS-886H
Kostat tray
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datasheet of Z40-12.7B heat sink
Abstract: UB35-25B Chomerics of Z40-12.7B heat sink Z3512 EP2S15 JESD51-9 T412 laird gasket JESD51-X
Text: Thermal Management for FPGAs December 2009 AN-358-2.0 Introduction As IC process geometries shrink and FPGA densities increase, managing power becomes increasingly difficult. The dilemma for design groups is how to fit in all the functions the market demands without exceeding power budgets. Although power
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AN-358-2
datasheet of Z40-12.7B heat sink
UB35-25B
Chomerics
of Z40-12.7B heat sink
Z3512
EP2S15
JESD51-9
T412
laird gasket
JESD51-X
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IPC-SM-780
Abstract: No abstract text available
Text: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.
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CERAMIC PIN GRID ARRAY wire lead frame
Abstract: IPC-SM-780 nickel corrosion electroplating
Text: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.
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CERAMIC PIN GRID ARRAY wire lead frame
IPC-SM-780
nickel corrosion electroplating
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UC3875 ZVS design
Abstract: resonant full bridge schematic U-136A Unitrode uc3875 transformer tank design calculation power transformer tank calculation transformer less power supply 12 volt 3A DESIGN WITH UC3875 UC3875 dc/dc converter UC3875
Text: U-136A APPLICATION NOTE PHASE SHIFTED, ZERO VOLTAGE TRANSITION DESIGN CONSIDERATIONS and the UC3875 PWM CONTROLLER BILL ANDREYCAK ABSTRACT This Application Note will highlight the design considerations incurred in a high frequency power supply using the Phase Shifted Resonant PWM control technique. An overview of this switching technique including
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U-136A
UC3875
00V/Div
100mV/Div
UC3875 ZVS design
resonant full bridge schematic
U-136A
Unitrode uc3875
transformer tank design calculation
power transformer tank calculation
transformer less power supply 12 volt 3A
DESIGN WITH UC3875
UC3875 dc/dc converter
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Loctite 3873
Abstract: T-PCM905C Loctite 3873 rework TPCM585 T-pcm585 datasheet of Z40-12.7B heat sink TPCM905C of Z40-12.7B heat sink Theta JC of FBGA JESD51-X
Text: Thermal Management for FPGAs Thermal Management for FPGAs AN-358-3.0 Application Note This application note provides guidance on thermal management of Altera devices and helps you determine the thermal performance for your application. The factors you must consider in evaluating heat dissipation include evaluating the
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Loctite 3873
T-PCM905C
Loctite 3873 rework
TPCM585
T-pcm585
datasheet of Z40-12.7B heat sink
TPCM905C
of Z40-12.7B heat sink
Theta JC of FBGA
JESD51-X
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C6000
Abstract: JESD51-2 JESD51-3 JESD51-7 TMS320C6000 grafoil heat spreading
Text: Application Report SPRAAL9 – May 2007 Thermal Considerations for TMS320DM64xx, TMS320DM64x, and TMS320C6000 Devices Kimberly Wells .
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TMS320DM64x,
TMS320C6000
TMS320C6000TM
C6000
JESD51-2
JESD51-3
JESD51-7
grafoil heat spreading
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UC3875 ZVS design
Abstract: resonant full bridge schematic U-136A Unitrode uc3875 DESIGN WITH UC3875 UC3875 dc/dc converter SEM-700 slope in uc3875 SLUA107 UC3875
Text: U-136A APPLICATION NOTE PHASE SHIFTED, ZERO VOLTAGE TRANSITION DESIGN CONSIDERATIONS and the UC3875 PWM CONTROLLER BILL ANDREYCAK ABSTRACT This Application Note will highlight the design considerations incurred in a high frequency power supply using the Phase Shifted Resonant PWM control technique. An overview of this switching technique including
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U-136A
UC3875
UC3875 ZVS design
resonant full bridge schematic
U-136A
Unitrode uc3875
DESIGN WITH UC3875
UC3875 dc/dc converter
SEM-700
slope in uc3875
SLUA107
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DM644x
Abstract: JESD51-2 JESD51-3 JESD51-7
Text: Application Report SPRAAE4A – April 2008 TMS320DM644x Thermal Considerations . Device Applications ABSTRACT As IC components become more integrated and more complex, the challenge of
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DM644x
DM644x
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fairchild AG33
Abstract: No abstract text available
Text: Intel FM2224 24-Port 10G Ethernet L2 Switch Chip Data Sheet July, 2008 Revision 2.3 Intel® FM2224 24-Port 10G Ethernet L2 Switch Chip Data Sheet Legal INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
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FM2224
24-Port
M5450
fairchild AG33
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Westinghouse SCR handbook
Abstract: n41 transformer core 171 100khz KF 13003 calculation of transformer differential relay RET 670 Allen-Bradley 1336 13001 TRANSISTOR thomas and betts wt117 KF 13003 F 230v to 5v circuit using 13003 transistor ALLEN-BRADLEY 1395 Burden RESISTOR
Text: 1336 IMPACT Adjustable Frequency AC Drive 0.37 - 597 kW 0.5 - 800 HP Version 1.xx - 4.xx User Manual Important User Information Solid state equipment has operational characteristics differing from those of electromechanical equipment. “Safety Guidelines for the Application,
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0xEDB88320
Abstract: No abstract text available
Text: Intel Ethernet Switch FM4000 24-Port 10G Ethernet L2/L3/L4 Switch/Router Datasheet May 2013 Revision 2.6 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
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FM4000
24-Port
VTT08:
VTT09:
VTT10:
VTT22:
VTT23:
VTT24:
FM4105
0xEDB88320
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Untitled
Abstract: No abstract text available
Text: Intel Ethernet Switch FM4000 24-Port 10G Ethernet L2/L3/L4 Switch/Router Datasheet April 7, 2011 Revision: 2.4 Intel® Ethernet Switch FM4000 24-Port 10G Ethernet L2/L3/L4 Switch/Router Table of Contents 1. Introduction . 13
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VTT21:
VTT19:
VTT22:
VTT20:
VTT23:
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hecs 450
Abstract: hecs 50 transistor w5c Liquid Rotor Resistor Starter SGCT "symmetrical gate commutated thyristor" UPS wiring how to control firing angle in thyristor SCR firing inverter circuit LMT 393 N
Text: PowerFlex 7000 Medium Voltage AC Drive Firmware Version 7.xxx Technical Data Important User Information Solid-state equipment has operational characteristics differing from those of electromechanical equipment. Safety Guidelines for the Application, Installation and
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7000-TD002B-EN-P
7000-TD002A-EN-P
hecs 450
hecs 50
transistor w5c
Liquid Rotor Resistor Starter
SGCT
"symmetrical gate commutated thyristor"
UPS wiring
how to control firing angle in thyristor
SCR firing inverter circuit
LMT 393 N
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Unitrode uc3875
Abstract: U-136A UC3875 ZVS design resonant full bridge schematic slope in uc3875 U136A phase shifted zero voltage UC 3875
Text: U-136A UNITRODE APPLICATION NOTE PHASE SHIFTED, ZERO VOLTAGE TRANSITION DESIGN CONSIDERATIONS and the UC3875 PWM CONTROLLER BILL ANDREYCAK ABSTRACT This Application Note will highlight the design considerations incurred in a high frequency power supply us
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U-136A
UC3875
10OV/Div
100mV/Div
Unitrode uc3875
U-136A
UC3875 ZVS design
resonant full bridge schematic
slope in uc3875
U136A
phase shifted zero voltage
UC 3875
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full bridge inverter 500khz square wave
Abstract: simple filter turns square waves into sine waves full bridge unipolar inverter pwm
Text: PWM LO W P A S S FIL T E R IN G APPLICATION NOTE 32 P U L S E WIDTH M ODULATION AM PLIFIER I I C I O T E C H I O l l i V h ttp ://WWW.APEXMICROTECH.COM 800 546-APEX (800) 546-2739 1.0 INTRODUCTION Pulse width modulation (PWM) amplifiers require low pass filtering
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546-APEX
150db
full bridge inverter 500khz square wave
simple filter turns square waves into sine waves
full bridge unipolar inverter pwm
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MC14499P application note
Abstract: wiring diagram audio amplifier ic 6283 era 555 MOTOROLA delta dvp plc communication cable wiring diagram siemens transistor manual 68000 MC68681 PROGRAMMING EXAMPLE DSP56200 SP5615 CORDED MOTOROLA CT2 Solid State Optoelectronics Data Book 1977
Text: Selection Guides Data Sheets Evaluation Kits Application Notes and Product Literature Glossary Handling and Design Guidelines Quality and Reliability Mechanical Data DATA CLASSIFICATION Product Preview This heading on a data sheet indicates that the device is in the formative stages or under
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induction cooker fault finding diagrams
Abstract: TC227 compressor catalogue Vernitron TRANSDUCER b2 str 1265 smps power supply circuit of tv ADC0804-1CD TC225 tesla MAa 741 SPICE model NTC Inrush Current Limiters Thermistor XR558CP
Text: BOOK IC11 LINEAR PRODUCTS page Selection guide Functional in dex. 5 Numerical in d e x .
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