Untitled
Abstract: No abstract text available
Text: Prototyping Board not in Europe-format RE233-LF - EPOXY fibre-glass FR4 1.60 mm double-sided 35 µm CU (pth) - hole spacing 2.54 mm x 2.54 mm - 40 x 60 tracks of bored holes - 40 x 56 square lands 2.00 mm² - hole dia 1.02 mm (0.40") - max. working temperature 150° C
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RE233-LF
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RE232-LF
Abstract: No abstract text available
Text: Laborkarte für Dual Inline ICs nicht im Europa-Format RE232-LF - Epoxyd FR4 Glasfaser 1,60 mm, einseitig 35 µm CU - heißverzinnt (HAL-leadfree) - Bestückungsdruck auf der Bauteileseite - Lochraster 2,54 x 2,54 mm - 40 x 60 Lochreihen - 3-Loch Lötinseln
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RE232-LF
RE232-LF
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RE232-LF
Abstract: No abstract text available
Text: Tarjeta experimental para DUAL INLINE ICs no en Euro-formato RE232-LF - fibra de vidrio epoxídica FR4 de 1,60 mm, por un lado 35 µm de CU - lado de soldadura estañado en caliente (HAL-leadfree) - Impresión de dotación por el lado de los componentes eléctricos
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RE232-LF
RE232-LF
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GRANDE
Abstract: cote
Text: Carte d´Expérimentation ne pas dans l´Euro-format RE231-LF - fibre de verre époxyde FR4 1,60 mm, deux faces 35 µm CU, sans métallisation des trous - étamés à chaud (HAL-leadfree) côté de composant - cadre de perforation 2,54 mm x 2,54 mm - 40 x 60 pistes de perforation
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RE231-LF
GRANDE
cote
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Untitled
Abstract: No abstract text available
Text: Carte d´Expérimentation ne pas dans l´Euro-format RE233-LF - fibre de verre époxyde FR4 1,60 mm, deux faces 35 µm CU, métallisation des trous - étamé à chaud (HAL-leadfree) - 40 x 60 pistes de perforation - 40 x 58 îlots de brasage quadratiques 2,00 mm²
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RE233-LF
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Untitled
Abstract: No abstract text available
Text: Prototyping Board not in Europe-format RE230-LF - EPOXY fibre-glass FR4 1.60 mm single-sided 35 µm CU - hot air leveling (HAL-leadfree) with soldering stop mask - hole spacing 2.54 mm x 2.54 mm (1/20") - 40 x 60 tracks of bored holes - 40 x 58 square lands 2.00 mm²
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RE230-LF
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Untitled
Abstract: No abstract text available
Text: HF Prototyping Board not in Europe-format RE231-LF - EPOXY fibre-glass FR4 1.60 mm double-sided 35 µm CU (npt) - solder side and component side hot air leveling (HAL-leadfree) - hole spacing 2.54 mm x 2.54 mm - 40 x 60 tracks of bored holes - 40 x 58 square lands 2.00 mm²
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RE231-LF
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Untitled
Abstract: No abstract text available
Text: R&E R&E International Preliminary Product Specification for RE230-RE233 Relay Driver / Timer Products General Description This specification defines functional and electrical requirements for a family of relay drivers designed for Worldtronics International. These products are intended for use in irons modules
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RE230-RE233
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Untitled
Abstract: No abstract text available
Text: Carte d´Expérimentation ne pas dans l´Euro-format RE230-LF - fibre de verre époxyde FR4 1,60 mm, simple face 35 µm CU - étamé à chaud (HAL-leadfree) recouvert avec un masque d´arrêt de soudure - pas 2,54 mm x 2,54 mm (1/20") - 40 x 60 pistes de perforation
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RE230-LF
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RE232-LF
Abstract: No abstract text available
Text: Carte d´Expérimentation ne pas dans l´Euro-format RE232-LF - fibre de verre époxyde FR4 1,60 mm, simple face 35 µm CU - étamé à chaud (HAL-leadfree) - impression des circuits sur le côté des composants - cadre de perforation 2,54 mm x 2,54 mm - 40 x 60 pistes de perforation
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RE232-LF
RE232-LF
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Untitled
Abstract: No abstract text available
Text: Tarjeta experimental no en Euro-formato RE230-LF - fibra de vidrio epoxídica FR4 de 1,60 mm, por un lado 35 µm de CU - lado de soldadura estañado en caliente (HAL-leadfree) y revestido con máscara inhibidora de soldadura (1/20") - trama de agujeros 2,54 mm x 2,54 mm
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RE230-LF
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ALCAN
Abstract: No abstract text available
Text: Tarjeta experimental de AF no en Euro-formato RE231-LF - fibra de vidrio epoxídica FR4 de 1,60 mm, por dos lados 35 µm de CU (npth) - lado de soldadura y de componentes estañado en caliente (HAL-leadfree) - trama de agujeros 2,54 mm x 2,54 mm - 40 x 60 hileras de agujeros
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RE231-LF
ALCAN
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CUI STACK
Abstract: RE23S
Text: RE23S M9 P0.75 2 7 Ø6.0 25.5 11.7 Ø 9.2 M9 13 3 2.5 9.5 0.5 travel 11.7 4 0.5 travel 8.2 Ø6 5 Panel Cutout/PCB Layout Panel Cutout 9.5 6 C U I Stack, Inc., 2002 RE23V 1 5-Ø1 4.3 8 15 L 18 L = 8, 12 8 6 9.8 RE23F 5 4 3 2 1 L 15 18.0 PC Board Panel Cutout/PCB Layout
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RE23S
RE23V
RE23F
RE23C
RE23X
RE23XXXXXXXX
CUI STACK
RE23S
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RE232-LF
Abstract: No abstract text available
Text: Prototyping Board for Dual Inline ICs not in Europe-format RE232-LF - EPOXY fibre-glass FR4 1.60 mm single-side 35 µm CU - hot air leveling (HAL-leadfree) - component printing on the component side - hole spacing 2.54 mm x 2.54 mm - 40 x 60 tracks of bored holes
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RE232-LF
RE232-LF
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Untitled
Abstract: No abstract text available
Text: HF-Laborkarte nicht in Europa-Format RE231-LF - Epoxyd FR4 Glasfaser 1,60 mm, zweiseitig 35 µm CU, (nicht durchkontaktiert) - Löt- und Bauteileseite heißverzinnt (HAL-leadfree) - Lochraster 2,54 x 2,54 mm - 40 x 60 Lochreihen - 40 x 58 quadratische Lötinseln 2,00 mm²
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RE231-LF
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Untitled
Abstract: No abstract text available
Text: Tarjeta experimental no en Euro-formato RE233-LF - fibra de vidrio epoxídica FR4 de 1,60 mm, por dos lados 35 µm de CU (pth) - lado de soldadura estañado en caliente (HASL) - trama de agujeros 2,54 mm x 2,54 mm - 40 x 60 hileras de agujeros - 40 x 58 nodos de soldadura cuadrados de 2,00 mm²
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RE233-LF
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Europa
Abstract: No abstract text available
Text: Laborkarte nicht in Europa-Format RE230-LF - Epoxyd FR4 Glasfaser 1,60 mm, einseitig 35 µm CU - heißverzinnt (HAL-leadfree) - Lochraster 2,54 x 2,54 mm - 40 x 60 Lochreihen - 40 x 58 quadratische Lötinseln 2,00 mm² - Lochdurchmesser 1,02 mm (0,40") - max. Betriebstemperatur 150° C
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RE230-LF
Europa
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SSD jumper pin
Abstract: SBC8360VEA 40 pin socket zip SBC8360 W83781D ess audio solo-1 RESET BIOS JUMPER DMI FUSE CT 69000
Text: SBC8360VEA 5.25" size All-in-One Ethernet DiskOnChip PCI/ISA CRT/LCD USB Flash BIOS Socket 370 Audio PC/104 IrDA Socket 370 Embedded SBC with Multi-media & Mechanical Backward Compatible Solutions CPU Fan Conn. LCD Conn. IDE 1 IDE 2 EISA Slot Intel® Power Conn.
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SBC8360VEA
PC/104
440BX
168-pin
RJ-45
PC/104
10/100M
32-bit
16-bit
SSD jumper pin
SBC8360VEA
40 pin socket zip
SBC8360
W83781D
ess audio
solo-1
RESET BIOS JUMPER
DMI FUSE
CT 69000
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MRC D6 16A
Abstract: No abstract text available
Text: Cover Marvell PXA270 Processor Developers Manual Doc. No. MV-S301039-00 , Rev. A April 2009 Marvell. Moving Forward Faster Released PXA270 Processor Developers Manual Document Conventions Note: Provides related information or information of special importance.
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PXA270
MV-S301039-00
PXA270
MV-S301039-00
MRC D6 16A
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LM3530TMX-40
Abstract: analog output Ambient light sensor vls252010 12-bump apds9
Text: LM3530 High Efficiency White LED Driver with Programmable Ambient Light Sensing Capability and I2C-Compatible Interface General Description Features The LM3530 current mode boost converter supplies the power and controls the current in up to 11 series white LED’s. The
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LM3530
839mA
LM3530TMX-40
analog output Ambient light sensor
vls252010
12-bump
apds9
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F300H
Abstract: FC44H BIT137
Text: CP3BT23 Reprogrammable Connectivity Processor with Bluetooth and Dual CAN Interfaces 1.0 General Description The CP3BT23 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip
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CP3BT23
CSP-9-111C2)
CSP-9-111S2)
CSP-9-111S2.
F300H
FC44H
BIT137
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Si24xx2G-DC
Abstract: DO214AA-NP cmc tp16 SOT23-BEC
Text: G l o b a l Vo i c e I S O m o d e m - E V B Evaluation Board for the Si2494/39/38/37/36/35/29/19/18/17 ISOModem Description Features The Global Voice ISOmodem EVB evaluation board provides the system designer with an easy way of evaluating the ISOmodem. The Voice ISOmodem EVB
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Si2494/39/38/37/36/35/29/19/18/17
24-pin
38-pin
16-pin
Si24xx2G-DC
DO214AA-NP
cmc tp16
SOT23-BEC
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PDF
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avago trace code on the box
Abstract: No abstract text available
Text: LM3530 High Efficiency White LED Driver with Programmable Ambient Light Sensing Capability and I2C-Compatible Interface General Description Features The LM3530 current mode boost converter supplies the power and controls the current in up to 11 series white LED’s. The
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LM3530
839mA
avago trace code on the box
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1N4004 MCC SMD
Abstract: 1N4004 MCC TEA1114A TEA1114AT re22 MGK810
Text: INTEGRATED CIRCUITS DATA SHEET TEA1114A Low voltage telephone transmission circuit with dialler interface and regulated strong supply Product specification Supersedes data of 1998 Jun 12 File under Integrated Circuits, IC03 1999 Sep 14 Philips Semiconductors
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TEA1114A
465002/03/pp24
1N4004 MCC SMD
1N4004 MCC
TEA1114A
TEA1114AT
re22
MGK810
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PDF
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