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    RECOMMENDED LAND PATTERN FOR 0805 Search Results

    RECOMMENDED LAND PATTERN FOR 0805 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    RECOMMENDED LAND PATTERN FOR 0805 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Ver 201305 Chip Bead For EMI Suppression CIB/CIM21 Series 2012/ EIA 0805 APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 0.8~1.2mm Perfect shape for automatic mounting, with no directionality.


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    CIB/CIM21 PDF

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    Abstract: No abstract text available
    Text: Ver. 201306 Multilayer Power Inductor CIG21L Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances


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    CIG21L CIG21LR47MNE CIG21L1R0MNE CIG21L1R2MNE PDF

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    Abstract: No abstract text available
    Text: Ver. 201306 Multilayer Power Inductor CIG21C Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Suit for small DC-DC converter and choke uses Magnetically shielded structure Free of all RoHS-regulated substances


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    CIG21C CIG21C2R2MNE CIG21C4R7MNE PDF

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    Abstract: No abstract text available
    Text: Ver. 201207 Chip Bead For High Current CIC21 Series 2012/ EIA 0805 APPLICATION Noise Suppression in power line FEATURES RECOMMENDED LAND PATTERN 0.8~1.2mm CIC series is used for high current. ) 0.9~1.6mm 0.6~1.2mm 0.6~1.2mm DIMENSION Type 21 Dimension [mm]


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    CIC21 100MHz CIC21P110 CIC21P300 CIC21P600 CIC21P800 CIC21P101 CIC21P11000 PDF

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    Abstract: No abstract text available
    Text: Ver. 201207 Multilayer Power Inductor CIG21C Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Suit for small DC-DC converter and choke uses Magnetically shielded structure Free of all RoHS-regulated substances


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    CIG21C CIG21C2R2MNE CIG21C4R7MNE PDF

    inductor 2r2

    Abstract: CIG21C2R2MNE
    Text: Ver. 201011 Multilayer Power Inductor CIG21C Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Suit for small DC-DC converter and choke uses Magnetically shielded structure Free of all RoHS-regulated substances


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    CIG21C CIG21C2R2MNE CIG21C4R7MNE inductor 2r2 PDF

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    Abstract: No abstract text available
    Text: Ver. 201306 Multilayer Power Inductor CIG21F Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Much lower Profile than any other series (0.5mm max) Low DC resistance Magnetically shielded structure


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    CIG21F CIG21FR47MNC CIG21F1R0MNC PDF

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    Abstract: No abstract text available
    Text: Ver. 201207 Multilayer Power Inductor CIG21F Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Much lower Profile than any other series (0.5mm max) Low DC resistance Magnetically shielded structure


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    CIG21F CIG21FR47MNC CIG21F1R0MNC PDF

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    Abstract: No abstract text available
    Text: Ver. 201007 Multilayer Power Inductor CIG21F Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Much lower Profile than any other series (0.5mm max) Low DC resistance Magnetically shielded structure


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    CIG21F CIG21FR47MNC CIG21F1R0MNC CIG21F1R5MNC CIG21F2R2MNC PDF

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    Abstract: No abstract text available
    Text: Ver. 201207 Multilayer Power Inductor CIG21W Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Low Profile (1.0mm max) Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances


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    CIG21W CIG21W1R0MNE CIG21W1R5MNE CIG21W2R2MNE PDF

    land pattern 0805

    Abstract: cig21w2r2mne
    Text: Ver. 201007 Multilayer Power Inductor CIG21W Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Low Profile (1.0mm max) Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances


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    CIG21W CIG21W1R0MNE CIG21W1R5MNE CIG21W2R2MNE CIG21W3R3MNE CIG21W4R7MNE land pattern 0805 PDF

    land pattern 0805

    Abstract: CIG21LR47MNE CIG21L4R7MNE CIG21LR47M CIG21L1R0MNE CIG21L3R3MNE land pattern 0805 inductor land pattern inductor 0805 CIG21L2R2MNE
    Text: Ver. 201007 Multilayer Power Inductor CIG21L Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Super Low DC resistance Low Profile (1.0mm max) Magnetically shielded structure Free of all RoHS-regulated substances


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    CIG21L CIG21LR47MNE CIG21L1R0MNE CIG21L1R5MNE CIG21L2R2MNE CIG21L3R3MNE CIG21L4R7MNE land pattern 0805 CIG21LR47M land pattern 0805 inductor land pattern inductor 0805 PDF

    Untitled

    Abstract: No abstract text available
    Text: Ver. 201207 Multilayer Power Inductor CIG21L Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Super Low DC resistance Low Profile (1.0mm max) Magnetically shielded structure Free of all RoHS-regulated substances


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    CIG21L CIG21LR47MNE CIG21L1R0MNE CIG21L1R2MNE 0805/2tics PDF

    Untitled

    Abstract: No abstract text available
    Text: Issue date : January 2014 3-terminal Filters For Power Line YFF-P Series Type: YFF15PC YFF18PC YFF18PH YFF18PW YFF21PC YFF31PC 1005 [0402 inch]* 1608 [0603 inch]* 1608 [0603 inch]* 1608 [0603 inch]* 2012 [0805 inch]* 3216 [1206 inch]* Feed through filter Feed through filter


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    YFF15PC YFF18PC YFF18PH YFF18PW YFF21PC YFF31PC 2002/95/EC, PDF

    220 uh inductors

    Abstract: marking 25
    Text: Inductors Chip Inductors &KLS ,QGXFWRUV 6HULHV 7\SH -DSDQ &KLS   ' & $ % 1'  &  (0805) (1008) )  (  (0402) (0603) $  %  (1210) (1812) 1RQ ZRXQG DQG ZLUH ZRXQG W\SH FKLS LQGXFWRUV IRU DXWRPDWLF DQG KLJKGHQVLW\ PRXQWLQJ


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    PDF

    1H101

    Abstract: YFF21SC1H102MT
    Text: Issue date : November 2013 3-terminal Filters For Signal Line YFF-SC Series Type: YFF15SC YFF18SC YFF21SC 1005 [0402 inch]* Feed through filter 1608 [0603 inch] Feed through filter 2012 [0805 inch] Feed through filter * Dimensions Code JIS[EIA] All specifications are subject to change without notice.


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    YFF15SC YFF18SC YFF21SC 2002/95/EC, 1H101 YFF21SC1H102MT PDF

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    Abstract: No abstract text available
    Text: Issue date : September 2014 3-terminal Filters For Signal Line YFF-SC Series Type: YFF15SC YFF18SC YFF21SC 1005 [0402 inch]* Feed through filter 1608 [0603 inch] Feed through filter 2012 [0805 inch] Feed through filter * Dimensions Code JIS[EIA] All specifications are subject to change without notice.


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    YFF15SC YFF18SC YFF21SC 2011/65/EC, PDF

    ERJA1

    Abstract: RESISTOR ARRAY 0402 land pattern
    Text: Surface Mount Resistors Packaging Method Taping Surface Mount Resistors Series Products Type Size mm (inch) 0402 (01005) 0603 ERJ1GN (0201) 1005 ERJ2GE (0402) 1608 ERJ3GE (0603) 2012 ERJ6GE Thick Film (0805) 3216 Chip Resistors ERJ8GE (1206) 3225 ERJ14 (1210)


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    ERJ14 ERJ12 ERJ12Z ERJ14N ERJ12N ERJ12S ERJA1 RESISTOR ARRAY 0402 land pattern PDF

    Untitled

    Abstract: No abstract text available
    Text: E M C C o m p o n e n t s July 2013 3-terminal Filters For signal line MEM series MEM2012S MEM2012SC MEM2012V MEM2012F MEM1608P 2012[0805 inch]* 2012[0805 inch] 2012[0805 inch] 2012[0805 inch] 1608[0603 inch] * Dimensions Code JIS[EIA] 2/15 E M C C o m p o n e n t s


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    MEM2012S MEM2012SC MEM2012V MEM2012F MEM1608P 60min. PDF

    Untitled

    Abstract: No abstract text available
    Text: E M C C o m p o n e n t s November 2013 3-terminal Filters For signal line MEM series MEM2012S MEM2012SC MEM2012V MEM2012F MEM1608P 2012[0805 inch]* 2012[0805 inch] 2012[0805 inch] 2012[0805 inch] 1608[0603 inch] * Dimensions Code JIS[EIA] 2/15 E M C C o m p o n e n t s


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    MEM2012S MEM2012SC MEM2012V MEM2012F MEM1608P 60min. PDF

    KF 520

    Abstract: No abstract text available
    Text: Chip Inductors • ND Type 2012 0805 ● Recommended Land Pattern in mm (not to scale) 1.25 0.9 to 1.3 1.0 1.25 ● Dimensions in mm (not to scale) (1.2) 1.0 to 1.2 3.0 to 3.8 0.4 2.0 ■ Standard Packing Quantity ● 3000 pcs./Reel ■ Standard Parts Inductnce


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    ELJND10NKF ELJND12NKF ELJND15NKF ELJND18NKF ELJND22NKF ELJND27NKF ELJND33NJ/KF ELJND39NJ/KF ELJND47NJ/KF ELJND56NJ/KF KF 520 PDF

    tu marking

    Abstract: R015 ERJB2 ERJA1
    Text: High Power Chip Resistors / Wide Terminal Type High Power Chip Resistors / Wide Terminal Type 2512, 2010, 1206, 0805 Type: ERJ A1, B1, B2, B3 • Features ■ Recommended Applications ● High solder-joint reliability by wide terminal construction ● Excellent heat dissipation characteristics by wide


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    PDF

    ERJB2

    Abstract: ERJA1
    Text: High Power Chip Resistors / Wide Terminal Type High Power Chip Resistors / Wide Terminal Type 2512, 2010, 1206, 0805 Type: ERJ A1, B1, B2, B3 • Features ■ Recommended Applications ● High solder-joint reliability by wide terminal construction ● Excellent heat dissipation characteristics by wide


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: VSM Series 0805, 1206, 1506, 2010, 2512 Vishay Foil Resistors Foil Wrap Around Surface Mount Chip Resistor with TCR of ± 2 ppm/°C and Load Life Stability of ± 0.01% FEATURES • • • • Top View INTRODUCTION Bulk Metal Foil (BMF) Technology out-performs all other


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    10K000 VSM0805 10K000 04-May-05 PDF