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    REFLOW SOLDERING GUIDE Search Results

    REFLOW SOLDERING GUIDE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    REFLOW SOLDERING GUIDE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Reflow Soldering Guide

    Abstract: berex
    Text: BeRex Reflow Soldering Guide Application Note RF MMIC Innovator www.berex.com Classification: Reflow Soldering Document Number: Reflow61110 Revision code: 0.1 Reflow Soldering Guide for Surface Mount Devices Name Writer Date Signature BY KIM JH Bae OK Dr. Yoo


    Original     		PDF Reflow61110 B61110 Reflow Soldering Guide berex

    "Solid State Relay"

    Abstract: No abstract text available
    Text: • Solid State Relay : Lead-free part soldering conditions DIP6pin SMD / DIP8pin(SMD) ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time.


    Original     		PDF

    phototriac

    Abstract: No abstract text available
    Text: • Phototriaccoupler : Lead-free part soldering conditions SOP4pin ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice.


    Original     		PDF

    JEDEC J-STD-020d.1

    Abstract: paste profile J-STD-020d.1 JEDEC SMT reflow profile Altera ROHS AN81 J-STD-020D J-STD-033
    Text: Reflow Soldering Guidelines for Lead-Free and RoHS-Compliant Packages AN-353-3.0 Application Note This application note describes the differences between conventional soldering and lead-free soldering and provides guidelines and recommendations for reflow


    Original     		PDF AN-353-3 JEDEC J-STD-020d.1 paste profile J-STD-020d.1 JEDEC SMT reflow profile Altera ROHS AN81 J-STD-020D J-STD-033

    SOP4

    Abstract: No abstract text available
    Text: • Photocoupler : Lead-free part soldering conditions DIP4pin SMD / DIP6pin(SMD) / DIP8pin(SMD) / DIP16pin(SMD) ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time.


    Original     		PDF DIP16pin SOP4

    JEDEC J-STD-020d.1

    Abstract: GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE pcb warpage in ipc standard Soldering guidelines J-STD-020D pcb warpage* in smt reflow Lead Free reflow soldering profile BGA
    Text: AN 353: Reflow Soldering Guidelines for Lead-Free Packages February 2009 AN-353-2.0 Introduction This application note describes the differences between conventional soldering and lead-free soldering and provides guidelines and recommendations for reflow


    Original     		PDF AN-353-2 JEDEC J-STD-020d.1 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE pcb warpage in ipc standard Soldering guidelines J-STD-020D pcb warpage* in smt reflow Lead Free reflow soldering profile BGA

    Untitled

    Abstract: No abstract text available
    Text: www.eLED.com EM2520SECK09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SECK09 Recommended Soldering Pattern Units : mm


    Original     		PDF EM2520SECK09 1000PCS EA0130 EM2520SEK09-3/3 AUG/31/2001 EM2520SECK09 EM2520SEK09-1/3

    Untitled

    Abstract: No abstract text available
    Text: RECOMMENDED REFLOW CONDITION CONDUCTIVE POLYMER ALUMINUM SOLID CAPACITORS Surface Mount RECOMMENDED REFLOW SOLDERING CONDITION The following conditions are recommended for air or infrared reflow soldering PXA/PXseries onto a glass epoxy circuit board of 90B50B0.8mm


    Original     		PDF 90B50B0 40sec 30sec) 30sec 60sec 50sec) E1001C

    Untitled

    Abstract: No abstract text available
    Text: www.eLED.com EM2520SYC09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SYC09 Recommended Soldering Pattern Units : mm


    Original     		PDF EM2520SYC09 1000PCS EA0133 EM2520SY09-3/3 AUG/31/2001 EM2520SYC09 EM2520SY09-1/3

    Untitled

    Abstract: No abstract text available
    Text: www.eLED.com EM2520SEC09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SEC09 Recommended Soldering Pattern Units : mm


    Original     		PDF EM2520SEC09 1000PCS EA0129 EM2520SE09-3/3 AUG/31/2001 EM2520SEC09 EM2520SE09-1/3

    Untitled

    Abstract: No abstract text available
    Text: www.eLED.com EM2520SYCK09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SYCK09 Recommended Soldering Pattern Units : mm


    Original     		PDF EM2520SYCK09 1000PCS EA0135 EM2520SYK09-3/3 AUG/31/2001 EM2520SYCK09 EM2520SYK09-1/3

    Cu3Sn

    Abstract: Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN
    Text: AN10365 Surface mount reflow soldering description Rev. 02 — 26 July 2006 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.


    Original     		PDF AN10365 AN10365 Cu3Sn Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN

    AN10365

    Abstract: ipc 610D Cu3Sn JEDEC J-STD-033b.1 SSOP20 LAND PATTERN JEDEC J-STD-033b J-STD-033b.1 Cu6Sn5 ipc 610 non-wetting Solder Paste, Indium, Type 3
    Text: AN10365 Surface mount reflow soldering description Rev. 04 — 13 August 2009 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and


    Original     		PDF AN10365 AN10365 ipc 610D Cu3Sn JEDEC J-STD-033b.1 SSOP20 LAND PATTERN JEDEC J-STD-033b J-STD-033b.1 Cu6Sn5 ipc 610 non-wetting Solder Paste, Indium, Type 3

    Lead Free reflow soldering profile BGA

    Abstract: AN10365 HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products
    Text: AN10365 Surface mount reflow soldering description Rev. 01 — 24 May 2005 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.


    Original     		PDF AN10365 AN10365 Lead Free reflow soldering profile BGA HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products

    reflow profile

    Abstract: No abstract text available
    Text: TOKEN Typical RoHS Reflow Profile Typical RoHS Reflow Profile All Token RoHS-compliant parts are backward compatible with tin-lead soldering processes. Soldering temperature must be greater than 230°C to ensure proper melting of lead-free solder. For all soldering methods, the optimal reflow profile for a circuit board assembly is dependent on the solder


    Original     		PDF

    Cu3Sn

    Abstract: ipc 610 non-wetting
    Text: AN10365 Surface mount reflow soldering Rev. 6 — 30 July 2012 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and handling of NXP semiconductor packages.


    Original     		PDF AN10365 Cu3Sn ipc 610 non-wetting

    pcb warpage in ipc standard

    Abstract: pcb warpage* in smt reflow GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE Lead Free reflow soldering profile BGA reflow soldering profile BGA Altera lead free BGA PROFILING leaded AN-081
    Text: Reflow Soldering Guidelines for Lead-Free Packages Application Note 353 July 2004, ver. 1.0 Introduction Reflow Soldering Process Considerations The recent directives and legislations by nations around the world have mandated elimination of lead usage in some sectors of the electronics


    Original     		PDF

    h25b

    Abstract: MKA Series MFZ Series
    Text: SURFACE MOUNT ALUMINUM ELECTROLYTIC CAPACITORS Functional polymer electrolyte capacitors RECOMMENDED REFLOW SOLDERING CONDITION The following conditions are recommended for air or infrared reflow soldering PX/PXAseries onto a glass epoxy circuit board of 90B50B0.8mm


    Original     		PDF 90B50B0 40sec 30sec 50sec 60sec 50smmended E1001A h25b MKA Series MFZ Series

    Untitled

    Abstract: No abstract text available
    Text: ALUMINUM ELECTROLYTIC CAPACITORS CONDUCTIVE POLYMER ALUMINUM SOLID CAPACITORS Surface Mount RECOMMENDED REFLOW SOLDERING CONDITION The following conditions are recommended for air or infrared reflow soldering PXC/PXA series onto a glass epoxy circuit board of 90B50B0.8mm


    Original     		PDF 90B50B0 40sec 30sec) 30mmended E1001D

    capacitor 47 nano

    Abstract: No abstract text available
    Text: X7R Dielectric Capacitance Range PREFERRED SIZES ARE SHADED SIZE 0201 0402 0603 0805 1206 Soldering Packaging Reflow Only All Paper Reflow Only All Paper Reflow/Wave All Paper Reflow/Wave Paper/Embossed Reflow/Wave Paper/Embossed 0.60 ± 0.03 0.024 ± 0.001


    Original     		PDF

    AN10896

    Abstract: No abstract text available
    Text: AN10896 Mounting and Soldering of RF transistors Rev. 2 — 13 Nov 2012 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages


    Original     		PDF AN10896 AN10896

    MFK Series

    Abstract: No abstract text available
    Text: Soldering Surface Mount Reflow Surface Mount Capacitors. Recommended Reflow Soldering Conditions The following conditions are recommended for reflow soldering of surface mount capacitors onto a glass epoxy circuit board of 90 x 50 x 0.8 mm with resist by cream solder (eutectic solder).


    OCR Scan     		PDF

    profile wave soldering

    Abstract: No abstract text available
    Text: yA V - y A TANTALUM CAPACITORS Soldering Methods SOLDERING METHODS Solid tantalum chip capacitors can be attached by wave soldering or reflow soldering methods. The reflow soldering method however has become more popular since this process has been developed specifically for SMT components. Hand soldering is not


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: MQixnttns D10FL 83 4Max. 9.7Max. TYPE D10FL TYPE For Reflow Soldering Frequency Range: 1kHz ~ 1MHz Inductance Range: 1 0 - 1500pH Features • • • • Recommended patterns: Low profile SMD Type 4mm high Suitable for large current Suitable for reflow soldering


    OCR Scan     		PDF D10FL D10FL 1500pH TR6871