sanyo electrolytic capacitors
Abstract: No abstract text available
Text: Surface Mount Type Aluminum Electrolytic Capacitors • Surface Mount Type Aluminum Electrolytic Capacitors Permissible Reflow Condition Permissible Reflow Condition ; air reflow and IR reflow temperature at the top of capacitor °C Peak temperature 230
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30sMAX.
sanyo electrolytic capacitors
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reflow
Abstract: soldering
Text: SOLDER REFLOW PROFILE RECOMMENDATIONS Reflow Profiles Table 1 SnPb Assembly Process – Package Peak Reflow Temperatures Table 2 Pb-free Assembly Process – Package Peak Reflow Temperatures Manual Soldering Conditions: ► Peak Temperature at terminals : 350 °C
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Untitled
Abstract: No abstract text available
Text: Temperature Curve of Infrared Reflow SOP- 8P Pb Free Infrared Reflow 2005/08/15 Page 1 Temperature Curve of Infrared Reflow SOP- 8P Pb Free Infrared Reflow Information provided is alleged to be exact and consistent. SYNC Power Corporation presumes no responsibility for the
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capacitor 47 nano
Abstract: No abstract text available
Text: X7R Dielectric Capacitance Range PREFERRED SIZES ARE SHADED SIZE 0201 0402 0603 0805 1206 Soldering Packaging Reflow Only All Paper Reflow Only All Paper Reflow/Wave All Paper Reflow/Wave Paper/Embossed Reflow/Wave Paper/Embossed 0.60 ± 0.03 0.024 ± 0.001
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reflow profile
Abstract: Abracon 8001 reflow
Text: APPENDIX E SUGGESTED REFLOW PROFILE NOTE: This information is for reference only. Please refer to the Official Specification Sheet for component-specific reflow information and maximum temperature specifications. Please contact Abracon Corporation prior to implementation of reflow process changes.
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Untitled
Abstract: No abstract text available
Text: 22355 Abracon CORX 2-29.qxd 3/6/00 6:56 AM Page 69 CRYSTALS AND OSCILLATORS RECOMMENDED SOLDER REFLOW TYPICAL SOLDERING CONDITIONS FOR CRYSTALS AND OSCILLATORS SOLDERING METHOD SOLDERING IRON SOLDERING DIP Pre-heat REFLOW Reflow SOLDERING CONDITIONS TEMPERATURE
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reflow soldering profile BGA
Abstract: BGA PROFILING solder joint bga warpage bga rework
Text: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: • Use caution when profiling to insure minimal temperature difference <15°C and preferably <10°C between components Removal and replacement of BGA packages on printed
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10 35L CAPacitor
Abstract: 22 35L CAPacitor 87L TO-92
Text: • Soldering Method and Allowable Range of Reflow Soldering Method ■ Recommended Land Size Allowable Range of Reflow Hot-Plate Reflow Infrared-Ray Reflow Air Reflow Size X Y a φ3 1.6 2.2 0.8 φ4 1.6 2.6 1.0 φ5 1.6 3.0 1.4 φ6.3 1.6 3.5 2.1 φ3x5.5L, φ8×6.2L, φ8×7L
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WZ Chip Type, Wide Temperature Range High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec 230°C over 60 sec 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
8100Z
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WZ Chip Type, Wide Temperature Range High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec 230°C over 60 sec 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
8100B
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WH Chip Type, High Reliability High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering WH Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
8100B
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WH Chip Type, High Reliability High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering WH Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
8100Y
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100MF 35v
Abstract: 8100V
Text: ALUMINUM ELECTROLYTIC CAPACITORS WH Chip Type, High Reliability High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering WH Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
100MF 35v
8100V
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JEDEC J-STD-020d
Abstract: TES 1-0511V J-STD-020D JEDEC J-STD-020d Moisture Sensitivity 56756 4932 45328 j 182 JSTD-020D 4925
Text: Product: TES 1 Series Single Output Models Moisture Sensitivity Level MSL Test Report as per IPC/JEDEC J-STD-020D Table of Contents page Tested Flowchart 1 Tested Data before Reflow 2 245℃ Temperature Reflow Profile 3 Tested Data after Reflow 4 Pictures
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J-STD-020D
code0851)
JEDEC J-STD-020d
TES 1-0511V
J-STD-020D
JEDEC J-STD-020d Moisture Sensitivity
56756
4932
45328
j 182
JSTD-020D
4925
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f1010
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WZ Chip Type, Wide Temperature Range High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec 230°C over 60 sec 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
f1010
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WD Chip Type, Low Impedance High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ10 x 10 : 1 time)
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2011/65/EU)
100kHz,
100kHz
8100D
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WH Chip Type, High Reliability High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering WH Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WH Chip Type, High Reliability High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering WH Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
8100X
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WZ Chip Type, Wide Temperature Range High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec 230°C over 60 sec 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WZ Chip Type, Wide Temperature Range High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec 230°C over 60 sec 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
8100X
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220E
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WZ Chip Type, Wide Temperature Range High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec 230°C over 60 sec 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
8100Y
220E
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WH Chip Type, High Reliability High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering WH Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2011/65/EU)
120Hz,
120Hz
8100C
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WH Chip Type, High Reliability High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering WH Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
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electrolytic capacitor
Abstract: dip electrolytic capacitor
Text: ALUMINUM ELECTROLYTIC CAPACITORS Reflow soldering method for the chip aluminum electrolytic capacitor 1. Recommended conditions for reflow soldering The chip aluminum electrolytic capacitor is subjected to soldering by reflow method. Temperature and time conditions of reflow soldering shall be set as per each temperature profile shown below
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