REFLOW TEMPERATURE BGA LAPTOP Search Results

REFLOW TEMPERATURE BGA LAPTOP Result Highlights (5)

Part	Manufacturer	Description
TCTH022BE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Open-drain type / FLAG signal latch function
TCTH021BE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Open-drain type
TCTH011AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type
TCTH022AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function
TCTH021AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type

REFLOW TEMPERATURE BGA LAPTOP Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
BGA-3000 Abstract: BGA-3500 Metcal CSP 3502 Metcal BGA-3591 CSP-3500 metcal bga-3000 METCAL MX-500 circuit BGA-3591 BGA-3592 reflow temperature bga laptop Text: BGA & CSP Rework System BGA-3590 Series CSP-3500 Series USER GUIDE Precision Systems for the Electronics Bench www.metcal.com P/N 7000-1251, Ver. A , 9/01 ii BGA-3500 Series Manual 5/01 TABLE OF CONTENTS PREFACE Specifications 2 System Part Numbers 3 Environmental Conditions	Original	BGA-3590 CSP-3500 BGA-3500 D-64521 BGA-3000 Metcal CSP 3502 Metcal BGA-3591 metcal bga-3000 METCAL MX-500 circuit BGA-3591 BGA-3592 reflow temperature bga laptop	PDF
smd transistor mark E13 Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4 Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue	Original	SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4	PDF
PBGA 256 reflow profile Abstract: bt 2328 pbga 144 BGA cte pbga JESD22-A113 OSP FLIPCHIP CRACK 304-pin dimensions bga jedec thermocouple WELD nsmd smd Text: Customer Applications Support and Reliability Test Center Page 1 Motorola General Business Information Customer Applications Support and Reliability Test Center Customer support for new and current packaging technology; Package-to-board Interconnect reliability	Original		PDF
PCB design for very fine pitch csp package Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015A Second Edition – September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue	Original	SSYZ015A PCB design for very fine pitch csp package Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A	PDF
metcal apr 5000 Abstract: NZA-555-555-CGA APR-5000 APR-5000-XLS APR-5000-XL reflow temperature bga laptop NZA-270-270 PBGA 256 reflow profile NZA-350-350-CGA LGA rework Text: Advance Package Rework Systems OK O K I N T E R N A T I O N A LT M T o o l s OK International has been a leading manufacturer of tools for the electronics assembly work bench for almost 60 years. And, as the industry has evolved, our rework and repair tools have	Original	APR-5000 BRO-APR-US-05 metcal apr 5000 NZA-555-555-CGA APR-5000 APR-5000-XLS APR-5000-XL reflow temperature bga laptop NZA-270-270 PBGA 256 reflow profile NZA-350-350-CGA LGA rework	PDF
AMD reflow soldering profile BGA Abstract: visteon ford visteon eutectic 157 SMALL ELECTRONICS PROJECTS AMD reflow BGA ROHS nortel meridian Delco SIEMENS WASHING machine TOSHIBA GLASS MOLD Text: Lead Pb -Free Packaging Strategy 2000− −2003 . . . . . JUNE 2000 (DECEMBER 2001 Update) . . . . JAMES HAYWARD . NOTE ON USAGE It is a peculiarity of the English language that the words “lead” (as in package lead) and “lead” (as in the metallic element) are homographic; that is, they are spelled the same, although they have	Original		PDF
transistor smd G46 Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm Text: FBGA User’s Guide Version 4.2 -XO\ 7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG	Original	N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm	PDF
"0.4mm" bga "ball collapse" height Abstract: Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST Text: Application Report SPRAA99 – March 2008 nFBGA Packaging Robert Furtaw . ABSTRACT This application report gives you technical background on nFBGA packages and	Original	SPRAA99 "0.4mm" bga "ball collapse" height Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST	PDF
amd (BGA) replacement alloy Abstract: Sn-58Bi NOKIA CIRCUIT PCB SIEMENS WASHING machine TOSHIBA GLASS MOLD washing machine bosch circuit diagram visteon sony antimony Text: Lead Pb -Free Packaging Strategy 2000− −2003 . . JUNE 2000 . . . . . . . JAMES HAYWARD . NOTE ON USAGE It is a peculiarity of the English language that “lead” (as in package lead) and “lead” (as in the metallic element) are homographic; that is, they are spelled the same but have different	Original		PDF
BlueCore 3 csr Abstract: BSC COMPUTER SCIENCE digital logic design Notes CSR BLUECORE SPI CSR BLUECORE application note BlueCore 4 BlueCore 5 BlueCore 01b CSR BLUECORE SPI APPLICATION BC01B-USB-TR CSR BLUECORE application Text: Product Data Sheet Device Features BlueCore 01b TM Compliant to Bluetooth specification V1.1 TM Small footprint in 8mm x 8mm 81-ball BGA Single Chip Bluetooth Device Product Data Sheet For: USB V1.1 compliant BC01b-URT UART only version (BGA Packaging) Qualified Bluetooth firmware included	Original	81-ball BC01b-URT BC01bv-URT BlueCore01b bco1b-ds-003d bc01b-ds-003a bc01b-ds-003b bc01b-ds-003c bc01b-ds-003d bc01bv BlueCore 3 csr BSC COMPUTER SCIENCE digital logic design Notes CSR BLUECORE SPI CSR BLUECORE application note BlueCore 4 BlueCore 5 BlueCore 01b CSR BLUECORE SPI APPLICATION BC01B-USB-TR CSR BLUECORE application	PDF
BlueCore 3 csr Abstract: CSR BLUECORE SPI BlueCore 4 BSC COMPUTER SCIENCE digital logic design Notes BlueCore 4 csr BlueCore 5 csr CSR BLUECORE application BLUECORE uart module CSR BLUECORE module csr rf Text: Product Data Sheet Device Features BlueCore 01b TM Compliant to Bluetooth specification V1.1 TM Small footprint in 8mm x 8mm 81-ball BGA Single Chip Bluetooth Device Product Data Sheet For: USB V1.1 compliant BC01b-URT UART only version (BGA Packaging) Qualified Bluetooth firmware included	Original	81-ball BC01b-URT BC01bv-URT BlueCore01b bco1b-ds-003d bc01b-ds-003a bc01b-ds-003b bc01b-ds-003c bc01b-ds-003d BC01bv BlueCore 3 csr CSR BLUECORE SPI BlueCore 4 BSC COMPUTER SCIENCE digital logic design Notes BlueCore 4 csr BlueCore 5 csr CSR BLUECORE application BLUECORE uart module CSR BLUECORE module csr rf	PDF
transistor nec 8772 Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s	Original	AN1231/D AN1231 transistor nec 8772 nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry	PDF
transistor nec 8772 Abstract: NXR-1400 FXS-160 nec 8772 nec 8772 transistor nicolet nxr1400 8772 P Epoxy, glass laminate 2SB444 nec 7912 Text: Freescale Semiconductor, Inc. MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005	Original	AN1231/D AN1231 transistor nec 8772 NXR-1400 FXS-160 nec 8772 nec 8772 transistor nicolet nxr1400 8772 P Epoxy, glass laminate 2SB444 nec 7912	PDF
IPC-6012 Abstract: reflow temperature bga laptop IPC 6012 micron tsop 48 PIN tray failure of heating element in hot air gun epoxy adhesive paste cte table PCB design for very fine pitch csp package Text: Mounting of Surface Mount Components Introduction Over the past few year, electronic products, and especially those which fall within the category of Consumer Electronics, have been significantly reduced in physical size and weight. Products such as cellular telephones, lap-top computers,	Original		PDF

SMPS IC 2003 Abstract: pin SMD IC FOR SMPS circuits smps control ic With MOSFET Driver dv4 smd transistor dv4 smd transistor SMD dv3 smps control ic 2003 smps ic smd 8 pin SMPS Transformer Symbol 2003 smps Text: INTEGRATED CIRCUITS DATA SHEET TEA1654 GreenChipII SMPS control IC Product specification 2003 May 12 Philips Semiconductors Product specification GreenChipII SMPS control IC TEA1654 FEATURES APPLICATIONS Distinctive features Typical application areas are adapters and chargers e.g.	Original	TEA1654 SCA75 613502/01/pp24 SMPS IC 2003 pin SMD IC FOR SMPS circuits smps control ic With MOSFET Driver dv4 smd transistor dv4 smd transistor SMD dv3 smps control ic 2003 smps ic smd 8 pin SMPS Transformer Symbol 2003 smps	PDF
taiyo PSR4000 Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5 Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2	Original		PDF
1168 bga Abstract: No abstract text available Text: B 2 B S M T C on n e c t ors B 2 B® S M T B o ard t o B o ard C on n ect ors B2B® High Density SMT Connectors from Advanced are designed for long-life applications and robust handling. Superior quality is designed in from our screw-machined terminals with multi-finger contacts to our	Original	C36000) ASTM-B-16 C17200) ASTM-B-194 63Sn/37Pb B2B-BROCH06 1168 bga	PDF
BB 4130 Abstract: No abstract text available Text: B 2 B S M T C on n e c t ors N o v e m b er 2 0 0 6 B 2 B® S M T B o ard t o B o ard C on n ect ors B2B® High Density SMT Connectors from Advanced are designed for long-life applications and robust handling. Superior quality is designed in from our screw-machined terminals	Original	C36000) ASTM-B-16 C17200) ASTM-B-194 63Sn/37Pb B2B-BROCH06 BB 4130	PDF
fBGA package tray 12 x 19 Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125 Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2	Original		PDF
PEC 622 Abstract: No abstract text available Text: B 2 B S M T C on n e c t ors N o v e m b er 2 0 0 6 B 2 B® S M T B o ard t o B o ard C on n ect ors B2B® High Density SMT Connectors from Advanced are designed for long-life applications and robust handling. Superior quality is designed in from our screw-machined terminals	Original	C36000) ASTM-B-16 C17200) ASTM-B-194 63Sn/37Pb B2B-BROCH06 PEC 622	PDF
Untitled Abstract: No abstract text available Text: B 2 B S M T C on n e c t ors B 2 B® S M T B o ard t o B o ard C on n ect ors B2B® High Density SMT Connectors from Advanced are designed for long-life applications and robust handling. Superior quality is designed in from our screw-machined terminals with multi-finger contacts to our	Original	C36000) ASTM-B-16 C17200) ASTM-B-194 63Sn/37Pb B2B-BROCH06	PDF
dv4 smd transistor Abstract: TEA1552 TEA1552 application note smps control ic With MOSFET Driver smps ic smd 8 pin TEA1552T smd transistor dv4 SMPS Transformer Symbol 8 PIN SMD IC FOR SMPS MBL501 Text: INTEGRATED CIRCUITS DATA SHEET TEA1552 GreenChipII SMPS control IC Product specification Supersedes data of 2002 Jul 03 2002 Aug 27 Philips Semiconductors Product specification GreenChipII SMPS control IC TEA1552 FEATURES APPLICATIONS Distinctive features	Original	TEA1552 SCA74 613502/02/pp24 dv4 smd transistor TEA1552 TEA1552 application note smps control ic With MOSFET Driver smps ic smd 8 pin TEA1552T smd transistor dv4 SMPS Transformer Symbol 8 PIN SMD IC FOR SMPS MBL501	PDF
dv4 smd Abstract: dv4 smd transistor smd transistor dv4 MBL504 MGU236 TEA1552 application note MBL498 6 PIN SMD IC FOR SMPS primary Text: INTEGRATED CIRCUITS DATA SHEET TEA1552 GreenChipII SMPS control IC Preliminary specification 2002 Jul 03 Philips Semiconductors Preliminary specification GreenChipII SMPS control IC TEA1552 FEATURES APPLICATIONS Distinctive features Typical application areas are adapters and chargers e.g.	Original	TEA1552 SCA74 613502/01/pp24 dv4 smd dv4 smd transistor smd transistor dv4 MBL504 MGU236 TEA1552 application note MBL498 6 PIN SMD IC FOR SMPS primary	PDF
TAIYO PSR 4000 Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original		PDF

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REFLOW TEMPERATURE BGA LAPTOP Search Results

REFLOW TEMPERATURE BGA LAPTOP Result Highlights (5)

REFLOW TEMPERATURE BGA LAPTOP Datasheets Context Search

BGA-3000

smd transistor mark E13

PBGA 256 reflow profile

PCB design for very fine pitch csp package

metcal apr 5000

AMD reflow soldering profile BGA

transistor smd G46

"0.4mm" bga "ball collapse" height

amd (BGA) replacement alloy

BlueCore 3 csr

BlueCore 3 csr

transistor nec 8772

transistor nec 8772

IPC-6012

SMPS IC 2003

taiyo PSR4000

1168 bga

BB 4130

fBGA package tray 12 x 19

PEC 622

Untitled

dv4 smd transistor

dv4 smd

TAIYO PSR 4000