RELIABILITY OF AREA ARRAY SOLDER JOINTS IN BENDING DARVEAUX Search Results

RELIABILITY OF AREA ARRAY SOLDER JOINTS IN BENDING DARVEAUX Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
TRS8E65H		Toshiba Electronic Devices & Storage Corporation	SiC Schottky Barrier Diode (SBD), 650 V, 8 A, TO-220-2L
TBAW56		Toshiba Electronic Devices & Storage Corporation	Switching Diode, 80 V, 0.215 A, SOT23
TRS10E65H		Toshiba Electronic Devices & Storage Corporation	SiC Schottky Barrier Diode (SBD), 650 V, 10 A, TO-220-2L
TRS6E65H		Toshiba Electronic Devices & Storage Corporation	SiC Schottky Barrier Diode (SBD), 650 V, 6 A, TO-220-2L
TRS3E65H		Toshiba Electronic Devices & Storage Corporation	SiC Schottky Barrier Diode (SBD), 650 V, 3 A, TO-220-2L

RELIABILITY OF AREA ARRAY SOLDER JOINTS IN BENDING DARVEAUX Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
ipc 9704 Abstract: IPC-9702 strain gage test ipc 9702 FR4 1.6mm substrate ansys darveaux CP-01011-1 solder joint IPC9702 strain rosette Text: MODELING AND EXPERIMENTAL CORRELATION OF BGA SOLDER JOINTS UNDER PCB BENDING Anurag Bansal, Yuan Li, and Vadali Mahadev Altera Corporation 101 Innovation Drive M/S 4101, San Jose, CA 95134, USA abansal@altera.com ABSTRACT This study addresses the effects of varying configurations in	Original	IPC-9702 ipc 9704 strain gage test ipc 9702 FR4 1.6mm substrate ansys darveaux CP-01011-1 solder joint IPC9702 strain rosette	PDF
WLCSP stencil design Abstract: AN1112 Reliability of Area Array Solder Joints in Bending darveaux 8bump wlcsp altera board Text: Flexural Testing of Board Mounted Wafer Level Packages for Handheld Devices V. Patwardhan, D. Chin, S. Wong, E. Rey, N. Kelkar and L. Nguyen National Semiconductor Corporation 2900 Semiconductor Drive, M/S 19-100 Santa Clara, CA 95052-8090 Email: viraj.patwardhan@nsc.com	Original		PDF
NXR-1400 Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s	Original	AN1231/D AN1231 AN1231/D* NXR-1400 nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC	PDF
transistor nec 8772 Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s	Original	AN1231/D AN1231 transistor nec 8772 nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry	PDF
transistor nec 8772 Abstract: NXR-1400 FXS-160 nec 8772 nec 8772 transistor nicolet nxr1400 8772 P Epoxy, glass laminate 2SB444 nec 7912 Text: Freescale Semiconductor, Inc. MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005	Original	AN1231/D AN1231 transistor nec 8772 NXR-1400 FXS-160 nec 8772 nec 8772 transistor nicolet nxr1400 8772 P Epoxy, glass laminate 2SB444 nec 7912	PDF