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    RESISTOR 0306 PACKAGE Search Results

    RESISTOR 0306 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    RESISTOR 0306 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    HIGH VOLTAGE MLCC (SURFACE MOUNT)

    Abstract: No abstract text available
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz HIGH VOLTAGE MLCC (SURFACE MOUNT)

    Untitled

    Abstract: No abstract text available
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz

    mlcc AVX

    Abstract: HIGH VOLTAGE MLCC (SURFACE MOUNT)
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz mlcc AVX HIGH VOLTAGE MLCC (SURFACE MOUNT)

    0508-8 X7S 6.3v 1

    Abstract: No abstract text available
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz 0508-8 X7S 6.3v 1

    resistor 0306 package

    Abstract: bl 0306 0306 capacitor 0508-8 X7S 6.3v Licc avx
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz resistor 0306 package bl 0306 0306 capacitor 0508-8 X7S 6.3v Licc avx

    LD18

    Abstract: LD17
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz LD18 LD17

    resistor 0306 package

    Abstract: size 0204 capacitor
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz resistor 0306 package size 0204 capacitor

    size 0204 capacitor

    Abstract: LICC low inductance chip capacitor HIGH VOLTAGE MLCC (SURFACE MOUNT)
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz size 0204 capacitor LICC low inductance chip capacitor HIGH VOLTAGE MLCC (SURFACE MOUNT)

    LD18

    Abstract: Capacitor 16v LD17
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz LD18 Capacitor 16v LD17

    Untitled

    Abstract: No abstract text available
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz

    Untitled

    Abstract: No abstract text available
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz

    LICA3T333M1FC4AA

    Abstract: S55S LICA3T104P1FC1AA LICA3T134M1FC1AA LICA3T153P3FC4AA LICA3T193M3FC4AA LICA3T263P3FC4AA MIL-PRF-123 LICAZD504M3FC1AB current loop
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz H20-080 LICA3T333M1FC4AA S55S LICA3T104P1FC1AA LICA3T134M1FC1AA LICA3T153P3FC4AA LICA3T193M3FC4AA LICA3T263P3FC4AA MIL-PRF-123 LICAZD504M3FC1AB current loop

    LICA3T104P1FC1AA

    Abstract: LICA3T134M1FC1AA LICA3T153P3FC4AA LICA3T193M3FC4AA LICA3T263P3FC4AA LICA3T333M1FC4AA MIL-PRF-123 S55S 97Pb cap 0306 package
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz H20-080 LICA3T104P1FC1AA LICA3T134M1FC1AA LICA3T153P3FC4AA LICA3T193M3FC4AA LICA3T263P3FC4AA LICA3T333M1FC4AA MIL-PRF-123 S55S 97Pb cap 0306 package

    Low Inductance Capacitors

    Abstract: No abstract text available
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz H20-080 Low Inductance Capacitors

    bl 0306

    Abstract: No abstract text available
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz bl 0306

    Untitled

    Abstract: No abstract text available
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz

    lga components

    Abstract: No abstract text available
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz lga components

    L68A

    Abstract: bl 0306
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz L68A bl 0306

    CRG0805

    Abstract: No abstract text available
    Text: Thick Film Chip Resistors Type CRG Series Characteristics Electrical Type CRG Series Rated Power @ 70 °C W Resistance Range (Ohms) Min Max Tolerance (%) Code letter Selection Series Temperature Coefficient (ppm/°C) 10 1M0 1 F E24 0402 0.063 1 10 5 J E24


    Original     		PDF

    mpc5500

    Abstract: EB643 MPC5500-Based AN2127 MPC500 HK10 EMC APPLICATION note AN2706 eb64
    Text: Freescale Semiconductor Application Note AN2706 Rev. 0.1, 01/2005 EMC Guidelines for MPC5500-Based Systems by: Stevan Dobrasevic TECD Design Engineering This application note describes recommended EMC guidelines for reducing electromagnetic emissions in MPC5500-based systems.


    Original     		PDF AN2706 MPC5500-Based mpc5500 EB643 AN2127 MPC500 HK10 EMC APPLICATION note AN2706 eb64

    Susumu Date Code

    Abstract: No abstract text available
    Text: RR series SUSUMU CO.,LTD Precision 0.1% and 0.5%, tolerance Thin Film Chip Resistor FEATURES • Excellent low noise, THIN FILM NiCr construction • Low temperature coefficient and tight tolerance • EIA standard case size(0201, 0402, 0603, 0805) • RoHS Compliance and 100% Lead-Free (Matte Sn termination finished)


    Original     		PDF RR1220 RR1632 RR2632 Susumu Date Code

    E96 Series colour code

    Abstract: LR180
    Text: Metal Film Fixed Resistors Type LR Series Characteristics Electrical Type LR Series The resistive element comprises a thin film of nickel-chrome alloy evaporated onto a high thermal conductivity ceramic element. Metal end caps are force fitted to the element prior to


    Original     		PDF LR0204 E96 Series colour code LR180

    relay driver ic ULN2803

    Abstract: ULN2803 ULN2804AP ULN2804AFW ULN2803AFW ULN2803AP toshiba uln2803 LN2804A
    Text: TOSHIBA ULN2803/04AP/AFW TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC ULN2803AP, ULN2803AFW, ULN2804AP, ULN2804AFW 8CH DARLINGTON SINK DRIVER The ULN2803AP/ AFW Series are high-voltage, high-current d a rling ton drivers comprised o f e ig h t NPN darlington


    OCR Scan     		PDF ULN2803/04AP/AFW ULN2803AP, ULN2803AFW, ULN2804AP, ULN2804AFW ULN2803AP/ 500mA ULN2803AP/AFW SOL-18pin relay driver ic ULN2803 ULN2803 ULN2804AP ULN2803AFW ULN2803AP toshiba uln2803 LN2804A

    Untitled

    Abstract: No abstract text available
    Text: TC90A36F TOSHIBA TENTATIVE TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TC90A36F FIELD DOUBL-SCAN CONVERTER IC FOR A MULTI-STANDARD COLOR TV TC90A36F converts YUV signals with 50Hz or 60Hz of fv Vertical Frequency into YUV signals with 100Hz or 120Hz


    OCR Scan     		PDF TC90A36F TC90A36F 100Hz 120Hz TC90A36F, 625kHz 250kHz/ 734kHz