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Text: R X A resistors isolated resistor networks EU features • • • • Thin film on silicon Electrical and mechanical stability High integration (up to 12 terminating lines per package) Products with lead-free terminations meet EU RoHS and China RoHS requirements
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Text: resistors R X A isolated resistor networks EU features • • • • dimensions and construction Q20 Dimensions inches (mm) L W p .193 .236 .025 (4.90) (5.99) (0.635) .341 .236 .025 (8.66) (5.99) (0.635) Q24 .341 (8.66) .236 (5.99) .025 (0.635) Q28 .39 (9.9)
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100k3
510K3
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rba q16
Abstract: rza series
Text: resistors R X A isolated resistor networks EU features • • • • Thin film on silicon Electrical and mechanical stability High integration Products with lead-free terminations meet EU RoHS and China RoHS requirements applications • Series termination
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RIA Q16
Abstract: RIA N08
Text: R X A resistors isolated resistor networks features • Thin film on silicon • Electrical and mechanical stability • High integration (up to 12 terminating lines per package) applications • Series termination • Pull-up/pull-down • Current limiting
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W16 sot 23
Abstract: rza series 51 ria 40 rba sot 23 sot 23 W16 Q-16
Text: R X A resistors isolated resistor networks features • • • • Thin film on silicon Electrical and mechanical stability High integration (up to 12 terminating lines per package) Products with lead-free terminations meet RoHS requirements applications
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RIA Q16
Abstract: No abstract text available
Text: R X A resistors isolated resistor networks features • • • • Thin film on silicon Electrical and mechanical stability High integration (up to 12 terminating lines per package) Products with lead-free terminations meet RoHS requirements applications
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Abstract: No abstract text available
Text: R X A resistors isolated resistor networks features • Thin film on silicon • Electrical and mechanical stability • High integration (up to 12 terminating lines per package) applications • Series termination • Pull-up/pull-down • Current limiting
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rza series
Abstract: appendix T16 KOA A-1002B RIA Q16
Text: 1733 Reader's Spreads pg1-203:document 1/27/09 4:07 PM Page 80 R X A resistors isolated resistor networks EU features • • • • Thin film on silicon Electrical and mechanical stability High integration Products with lead-free terminations meet EU RoHS
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pg1-203
rza series
appendix T16 KOA
A-1002B
RIA Q16
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RIA N08
Abstract: 1M resistor frequency appendix T16 KOA w16 sot23 RIA Q20 ria n16
Text: isolated resistor networks KOA’s thin film termination networks provide the ideal solution for demanding high speed/high frequency data applications. Compared to thick film networks these thin film components improve performance, while saving space and reducing costs. Sophisticated semiconductor processing
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MIL-R-55342
MIL-STD-202
MlL-STD-202
RIA N08
1M resistor frequency
appendix T16 KOA
w16 sot23
RIA Q20
ria n16
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RIA Q20
Abstract: No abstract text available
Text: resistors R X A isolated resistor networks EU features • • • • dimensions and construction Dimensions inches (mm) L W p .193 .236 .025 (4.90) (5.99) (0.635) .341 .236 .025 (8.66) (5.99) (0.635) Size Code Q16 L Bonding Wire Q20 Q24 .341 (8.66) .236
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Text: R X A resistors isolated resistor networks features • Thin film on silicon • Electrical and mechanical stability • High integration (up to 12 terminating lines per package) applications • Series termination • Pull-up/pull-down • Current limiting
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DNA 1002
Abstract: RNX W16 marking s14 sot23 KPC T16 DNA MARKING CODE KOA KPC T16 Packaging marking code 8 lead soic-n package analog devices MARKING W16 SOT23 CODE DIODE
Text: NETWORKS TECHNOLOGY OF TOMORROW RESISTORS / CAPACITORS / DIODES 3 2 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC STRUCTURE 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 5 NETWORKS (PASSIVE COMPONENTS)
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D-25578
DNA 1002
RNX W16
marking s14 sot23
KPC T16
DNA MARKING CODE
KOA KPC T16 Packaging
marking code 8 lead soic-n package analog devices
MARKING W16 SOT23
CODE DIODE
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DNA 1002
Abstract: rnx w16 dn5 marking packaging resistor MARKING W16 SOT23 rnx Q24 DN6 marking diode
Text: NETWORKS TECHNOLOGY OF TOMORROW RESISTORS / CAPACITORS / DIODES 3 2 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC STRUCTURE 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 5 NETWORKS (PASSIVE COMPONENTS)
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Fiel70
D-25578
DNA 1002
rnx w16
dn5 marking
packaging resistor
MARKING W16 SOT23
rnx Q24
DN6 marking diode
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Untitled
Abstract: No abstract text available
Text: NETWORKS KOA´S INTEGRATED PASSIVE COMPONENTS 3 THIN FILM ON SILICON TFOS KPC STRUCTURE 2 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 4 IDENTIFICATION Specifications given herein may be changed at any time without prior notice.
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Text: RB X , RD(X), RT(X), RNX resistors integrated passive components EU features • Thin film (metal film) resistor array on silicon wafer • Excellent resistance matching, TCR tracking and stabilities • Custom circuits are available with flexible layout (Different
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OT-23
C/-55Â
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rnx w16
Abstract: 471j CAPACITOR w16 sot23 511j CAPACITOR KPC T16 12w SOT23-3 appendix T16 KOA KPC appendix KOA KPC T16
Text: 抵抗器 Resistors R/C NETWORKS KPC 表面実装形薄膜抵抗/コンデンサネットワーク KOA’s Integrated Passive Components •構造図 Construction ② ① ③ ① シリコンウェハ Si wafer ② ボンディングワイヤ Bonding wire
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SOICQSOPTSSOPSOT23
30min.
rnx w16
471j CAPACITOR
w16 sot23
511j CAPACITOR
KPC T16
12w SOT23-3
appendix T16 KOA KPC
appendix KOA KPC T16
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DNA 1002
Abstract: TE-5001 n014 jis c 5201-1 511j MARKING T20 SOT23 471j CAPACITOR 470M 471J diodes tvb
Text: NETWORKS Resistors / capacitors / diodes 3 2 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC 1 STRUCTURE 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 4 IDENTIFICATION TYPE COATING COLOR MARKING
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DNA 1002
TE-5001
n014
jis c 5201-1
511j
MARKING T20 SOT23
471j CAPACITOR
470M
471J
diodes tvb
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4571M
Abstract: MAX4571CEI
Text: >kiyjxi>ki 19-1404; Rev 0; 1/99 Serially Controlled, Clickless Audio/Video Sw itches The M A X 4 5 7 1 -M A X 4 5 7 4 s e ria l-in te rfa c e c o n tro lle d sw itches are ideal fo r m ultim edia a pp lica tion s. Each device features 35Q max on-resistance, -90dB audio
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-90dB
20kHz
-50dB
10MHz
-52dB
MAX4571/72)
MAX4573/74)
4571M
MAX4571CEI
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Untitled
Abstract: No abstract text available
Text: August 1996 Semiconductor N M 93C46A 1 ,0 2 4 -B it S e ria l In te r fa c e , S ta n d a rd V o lta g e C M O S E E P R O M M IC R O W IR E tm S y n c h ro n o u s B u s General Description Features The NM93C46A is 1,024 bits ot CMOS nonvolatile, electri
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93C46A
NM93C46A
16-bit
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Untitled
Abstract: No abstract text available
Text: August 1996 S e m ic o n d u c to r N M 93C46AL 1 0 2 4 -B it S e ria l E E P R O M 6 4 x 1 6 -B it o r 128 x 8 -B it C o n fig u ra b le w ith E x te n d e d V o lta g e 2 .7 V to 5 .5 V (M IC R O W IR E B u s In te r fa c e ) General Description Features
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93C46AL
NM93C46AL
16-bit
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Untitled
Abstract: No abstract text available
Text: RGB640 1.0 Introduction T h e RG B640 is a h ig h p erfo rm an ce p a le tte DAC w hich accepts d ig ital pixels a n d con v erts th e d a ta to an alo g form . A block d ia g ra m is given in F ig u re 1 chi p<;gr; 3. T h e RG B640 com bines fe a tu re s u se d in ad v an ced w o rk
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RGB640
10-bit
SC22-9865-03
07SC22986503
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1971M
Abstract: No abstract text available
Text: PRELIMINARY Semiconductor LM1971 & National LM1971 uPot Digitally Controlled 62 dB Audio Attenuator with Mute General Description Key Specifications T h e L M 1971 is a d ig ita lly c o n tro lle d s in g le c h a n n e l a u d io a tte n u a to r fa b ric a te d o n a C M O S p ro c e s s . A tte n u a tio n is
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LM1971
LM1971
1971M
1971N
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rnx w16
Abstract: No abstract text available
Text: KOA THIN FILM KOA's Integrated Passive Components SPEER ELECTRONICS, INC. General Description & Background Information These thin film passive components are designed for EMI/RFI filtering and impedance matching applications. The integrated passive components are produced using a silicon based technology that
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504b0A7
300mm
350mm
CZl16
150mm
300mm/min
rnx w16
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Untitled
Abstract: No abstract text available
Text: WEDMC64603R-XXX W hite E le c t r o n ic D esigns C o r p o r a t io n RISC 603e M o n o lith ic MICROPROCESSOR T h e W E D M C 6 4 6 0 3 R - X X X is p a rt of a fa m ily of reduced in s tru c tio n PRELIMINARY* te g e r u n it IU , a flo a tin g - p o in t u n it (FPU), a branch proc e ssin g u n it
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WEDMC64603R-XXX
64bit
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