Robinson Nugent s2
Abstract: No abstract text available
Text: FINE PITCH SOCKETS E & D _ Specifications for SOP Sockets MATERIALS Body & Frame: Glass reinforced PPS UL 94V-0 Contact: Copper Alloy Plating: TT = 2.03 pm (80 pinch) Tin/Lead overall. 1.27 pm (50 pinch) Nickel underplate. ELECTRICAL Current Rating: 0.5 Ampere per contact
|
OCR Scan
|
1000MQ
980m/S2
300mil)
S13M30S
OP-44EXX-SMT-TT
Robinson Nugent s2
|
PDF
|
Robinson Nugent socket
Abstract: ROBINSON NUGENT
Text: HIGH DENSITY_ 8 Byte DIMM Sockets, DIMS Series * Effectively provides double density packaging 9 Durability - 60 cycles minimum 9 Vertical entry allows insertion/removal without disturbing “neighboring DIMMs” RN DIMMPAK 9 Superior shock and vibration performance
|
OCR Scan
|
64-bit
R6000
MO-161
Robinson Nugent socket
ROBINSON NUGENT
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FINE PITCH SOCKETS SOP Sockets REMARKS 1 2) Use a screen thickness of 0.2mm or 0.3mm during cream solder printing. When infrared reflow soldering the peak surface temperature of the PC board should not exceed 245°C. Recommended conditions for the reflow
|
OCR Scan
|
|
PDF
|
96 pin DIN connector right angle
Abstract: Robinson Nugent 96 pin vme DIN connector 371D Robinson Nugent DIN-48CPC-XXX-TR DIN-96CPC-SR14A-TR Robinson Nugent 2.0 Robinson Nugent daughter Robinson Nugent cable to board
Text: DIN CONNECTORS_ Standard C-Form DIN Solder-To-Board Plug Connectors DIN-CP Series • 96 position connector used on VME, VXI, Multi-Bus II daughter cards • High temp SMT compatible insulator • EMLB groundng contacts allow “hot board” replacement see page 293
|
OCR Scan
|
076\im)
96 pin DIN connector right angle
Robinson Nugent
96 pin vme DIN connector
371D
Robinson Nugent DIN-48CPC-XXX-TR
DIN-96CPC-SR14A-TR
Robinson Nugent 2.0
Robinson Nugent daughter
Robinson Nugent cable to board
|
PDF
|
Untitled
Abstract: No abstract text available
Text: RN ICPAK —Nuaent SOP Sockets REMARKS 1 Use a screen thickness of 0.2mm or 0.3mm during cream solder printing. 2) When infrared reflow soldering the peak surface temperature of the PC board should not exceed 245°C. Recommended conditions for the reflow
|
OCR Scan
|
|
PDF
|
Robinson Nugent IC SOCKET
Abstract: No abstract text available
Text: SOCKETS SOP — XX B XX — SMT — TT Plating Position:. 20, 28 . Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags ‘nEOOOO TiESOOb B = .375" Row Spacing EEh s' PC board 1 = Body 2 = Frame 3 = SO Package IC oattern 1. 2 7 ± Q. Q5
|
OCR Scan
|
Plat50-300B,
FP-20DA,
FP-20-D
375mil)
P20GM-50-375B-3,
P20GT-50-375B-2
FPT-20P-M02
751D-03
P24GM-50-300B-2
Robinson Nugent IC SOCKET
|
PDF
|
MO-52
Abstract: No abstract text available
Text: R obinson — N u gen t- Sockets Sockets ELASTIC LEADED CHIP CARRIER SOCKETS PLCC-SMT Series Low profile; .200" maximum height Designed for automatic assembly Socket footprint same as device Open frame allows visual inspection of solder joints
|
OCR Scan
|
MO-52
27\im)
|
PDF
|
P20GT-50-375B-2
Abstract: 945080
Text: SOCKETS SOP — 44 E XX — SMT — TT Plating Position:. 44 Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags E = .600" Row Spacing T005371 000D370 I I I I I I Ijl I I I I I I I =lb4 am1 34 1= Body 2 = Frame 3 = SO Package IC
|
OCR Scan
|
T005371
000D370
OP-44EXX-SMT-TT
Tin/0GM-50-300B,
FP-20DA,
FP-20-D
375mil)
P20GM-50-375B-3,
P20GT-50-375B-2
FPT-20P-M02
P20GT-50-375B-2
945080
|
PDF
|
ICL-406-S7-T
Abstract: No abstract text available
Text: Sockets PRODUCTION DIP Single Wipe Sockets ICL/ICU Series * High compression, single wipe contact provides high retention and gastight connections 9 Automatic insertion option compatible with most insertion equipment * Anti-overstress design prevents damage to
|
OCR Scan
|
27\im)
ICL-406-S7-T
|
PDF
|
DIN 34 STANDARD
Abstract: 96 pin DIN connector right angle apple 30 pin connector DIN-96CPC-XXX-TR Robinson Nugent idc DIN-96CPC-SR14A-TR
Text: Robinson 2-Piece PC Nugent- Connectors Standard C-Form DIN Solder-To-Board Plug Connectors DIN-CP Series # 96 position connector used on VME, VXI, Multi-Bus II daughter cards • High temp SMT compatible insulator * EMLB groundng contacts allow “hot board’
|
OCR Scan
|
20CPC-XXX-XX
DIN-150CPC-XXX-XX
DIN 34 STANDARD
96 pin DIN connector right angle
apple 30 pin connector
DIN-96CPC-XXX-TR
Robinson Nugent idc
DIN-96CPC-SR14A-TR
|
PDF
|
ATMEL 32P
Abstract: toshiba 94V-0
Text: SOP— 40 D XX — SMT — TT .Plating Position:. 40 Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags D = .525" Row Spacing. m E h T falEOOOO TiEBDDb a FF na 3 65 1 = Body 2 = Frame 3 = SO Package IC R e c o m m e n d e d PC b o a r d
|
OCR Scan
|
OP-40DXX-SMT-TT
Socke0GM-50-300B,
FP-20DA,
FP-20-D
375mll)
P20GM-50-375B-3,
P20GT-50-375B-2
FPT-20P-M02
751D-03
P24GM-50-300B-2
ATMEL 32P
toshiba 94V-0
|
PDF
|
Robinson Nugent 100-pin
Abstract: Robinson Nugent IC SOCKET Robinson Nugent, IC Socket Robinson Nugent PAK-50 Robinson Nugent idc Robinson Nugent cable to board la 4631
Text: Robinson Nuaent— 50 mil Connectors Low Profile IDC Connectors P50LE Series Product supports 25 mil pitch cable Low profile - 11.8mm mated height RN PAK-50' One-touch locking ejector system Low insertion/withdrawal force Self-aligning mating Straight, right angle, and SMT options
|
OCR Scan
|
P50LE
PAK-50'
P25LE
Robinson Nugent 100-pin
Robinson Nugent IC SOCKET
Robinson Nugent, IC Socket
Robinson Nugent PAK-50
Robinson Nugent idc
Robinson Nugent cable to board
la 4631
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SOP — XX C XX — SMT — TT Plating Position:. 28, 32 C = .450" Row Spacing Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags T00S371 DD0D3tj7 PC Doara oattern 2 B 37T WWW 1. 271Q. 05 32 B A 2 1.85 24. B 16.51 19. 0 5
|
OCR Scan
|
T00S371
1650-300B,
FP-20DA,
FP-20-D
375mil)
P20GM-50-375B-3,
P20GT-50-375B-2
FPT-20P-M02
751D-03
P24GM-50-300B-2
|
PDF
|
Robinson Nugent 20 DIP socket
Abstract: Robinson Nugent DIP socket
Text: S ockets PRODUCTION DIP Screw Machine Sockets 17- ICA Series * Four-finger Beryllium Copper contact pro vides low, stable contact resistance * High retention design prevents “1C Walk out” during heavy vibration 9 Pin socket contact prevents solder wicking
|
OCR Scan
|
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Sockets PRODUCTION DIP Dual Wipe Sockets ICN Series • General purpose, dual leaf side wipe contact provides high reliability • Anti-wicking wafer prevents solder and flux wicking • Open body design provides excellent cooling properties How To Order ICN Series
|
OCR Scan
|
27\un)
|
PDF
|
Untitled
Abstract: No abstract text available
Text: PRODUCTION DIP Crystal Oscillator Screw Machine Sockets ICA-SCO Series * Four high retention pins for shock and vibration applications * Low profile socket height * Positive closed bottom flux barrier SOCKETS * Other contact loadings available on request How To Order ICA-SCO Series
|
OCR Scan
|
E73746
|
PDF
|
Untitled
Abstract: No abstract text available
Text: PRODUCTION DIP_ Open Body Screw Machine Sockets ICE Series • Variety of pin lengths to meet specific board stacking applications • Open body provides convection cooling • 4-finger Beryllium Copper contact accept short 1C leads 9 48 and 64 pin sizes available for VLSI, LA
|
OCR Scan
|
SL180
SL180,
|
PDF
|
Untitled
Abstract: No abstract text available
Text: DUAL WIPE SOCKETS SB/SBF/WB Series • Dual wipe contact 9 SB option allows flexible jumper strips leads to .025" SOCKETS * WB option is excellent for socketing ce ramic hybrids, LED’s and memory modules WB — XX — 55 — XX XXX XX XXX — X Product Series.
|
OCR Scan
|
SB100,
CA725
SB-100,
|
PDF
|
ICB163
Abstract: Robinson Nugent DIP socket
Text: Sockets PRODUCTION DIP Dual Wipe Sockets ICO/ICB Series * “Flux Fighter” closed bottom design prevents solder wicking and flux entrapment * Dual leaf, high compression contact provides gas-tight performance 9 Automatic insertion option compatible with
|
OCR Scan
|
27\im)
E73746
ICB163
Robinson Nugent DIP socket
|
PDF
|
Robinson Nugent IC SOCKET
Abstract: Robinson Nugent DIP socket Robinson Nugent 20 DIP socket icx286 nugent pin socket ICX083 ICX-203-S8X-T ICX-183-S8X-T
Text: BQpn. PRODUCTION DIP Dual Wipe Sockets ICO/ICB Series * “Flux Fighter” closed bottom design pre vents solder wicking and flux entrapment * Dual leaf, high compression contact provides gas-tight performance 9 Automatic insertion option compatible with
|
OCR Scan
|
27\im
E73746
Robinson Nugent IC SOCKET
Robinson Nugent DIP socket
Robinson Nugent 20 DIP socket
icx286
nugent pin socket
ICX083
ICX-203-S8X-T
ICX-183-S8X-T
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Sockets DUAL WIPE SOCKETS SB/SBF/WB Series • Dual wipe contact • SB option allows flexible jumper strips leads to .025" • WB option is excellent for socketing ce ramic hybrids, LED’s and memory modules WB — XX — 55 — XX XXX XX XXX — X T
|
OCR Scan
|
SB100,
CA725
SB-100,
27\im
|
PDF
|
P20GT-50-375B-2
Abstract: No abstract text available
Text: SMT — TT SOP — XX A XX Plating Position:_ 8, 14, 20, 24 A = .300" Row Spacing .Blank = Tube Pack TP = Tape and Reel body only *Frames are packaged in vinyl bags •Ì00S371 G0003fc>5 O CD lO t ST7 t 1 = Body 2 = Frame 3 = SO Package IC
|
OCR Scan
|
00S371
G0003fc
S13M00S
Pla50-300B,
FP-20DA,
FP-20-D
375mil)
P20GM-50-375B-3,
P20GT-50-375B-2
FPT-20P-M02
P20GT-50-375B-2
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Robinson —Nugent- Production Dip Wire Wrap Dual Wipe Sockets ICN-WB Series * General purpose, dual leaf side wipe contact provides high reliability * Economical Tin plated tail/Gold plated contact available SOCKETS N um ber of C o n ta c ts
|
OCR Scan
|
ICN-083-W
ICN-143-W
ICN-163-W
ICN-183-W
ICN-203-W
ICN-246-W
ICN-286-W
ICN-406-WB-X
11descriptions
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Muaent SOJ Series * Small outline, dual in-line socket accommodates J leaded SRAMs, DRAMs and VRAMs * Low profile; .200" maximum height * Socket footprint same as device * Open frame allows visual inspection of solder joints and solder joint repair without
|
OCR Scan
|
0DDDDDODDDOnO00DDODCr
|
PDF
|