Senju M705
Abstract: M705 solder paste senju m705 solder paste
Text: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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Senju M705
Abstract: Senju Sn Pb 60 40 solder Senju PASTE Senju
Text: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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senju m705 solder paste
Abstract: Senju M705 SENJU mobile actuator ltds senju solder paste
Text: NEW 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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Senju M705
Abstract: No abstract text available
Text: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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Senju M705
Abstract: M705-221CM5 senju m705 solder paste senju solder paste senju Senju metal solder paste SENJU 221CM5 M7052 M705-221CM5-42-10 221CM5
Text: NEW 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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senju m705 solder paste
Abstract: Solder bar of Senju M705 M705-221BM5-42-11
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*GT4C *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-5-14-A
senju m705 solder paste
Solder bar of Senju M705
M705-221BM5-42-11
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Untitled
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*GT4E *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-7-14-A
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senju m705 solder paste
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB50GT1C *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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GM2BB50GT1C
LD-E7-2-14-A
senju m705 solder paste
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Untitled
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QT1C *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-1-14-A
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SENJU 221CM5
Abstract: 08005E OZ63-201C-50-9 M705-221CM5-42-10 SENJU
Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
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Untitled
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QT4E *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-6-14-A
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Senju ESR-250
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2AA50GV6* *:1.2 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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GM2AA50GV6*
LD-E7-9-14-A
Senju ESR-250
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Untitled
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QB2C *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-3-14-A
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QT4c
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QT4C *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-4-14-A
QT4c
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M2424
Abstract: FH12 M705-221-CM5 0.3mm pitch 45 Conductor FPC Cable
Text: World's smallest & lightest 0.5mm pitch, 0.9mm above the board, Flexible Printed Circuit & Flexible Flat Cable Connectors FH19 & FH19S Series FH19 Series – FPC, FFC thickness: 0.2±0.03mm Actuator color: Dark brown FH19S Series – FPC, FFC thickness: 0.3±0.03mm
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FH19S
30pos.
FH19S
M2424
FH12
M705-221-CM5
0.3mm pitch 45 Conductor FPC Cable
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56QN50T18080
Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
Text: Application Report SCEA032 - March 2003 56-Pin Quad Flatpack No-Lead Logic Package Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages
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SCEA032
56-Pin
56-terminal
MO-220,
56QN50T18080
Senju
MO-220-compliant
Theta JA of 64-pin BGA
56RGQ
senju solder paste
MO-220
SN74SSTV16859
IPC-9701
qfn jc jb
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CL580-0010-3-05
Abstract: F8069
Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
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pap7501
Abstract: PAP7501V pas6311 FUSB200 LFM-48W almit lfm 48w Almit LFM-48W 25F512A M705-GRN360 PAS6311LT
Text: PAP7501V PAP7501V USB2.0 PC Camera Controller General Description The PAP7501V High-Speed USB2.0 Camera Controller is a highly integrated and cost-effective solution for USB2.0 PC-Camera based applications. It is fully compliant with USB Video Class 1.1 and USB audio class 1.0
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PAP7501V
PAP7501V
30fps
pap7501
pas6311
FUSB200
LFM-48W
almit lfm 48w
Almit LFM-48W
25F512A
M705-GRN360
PAS6311LT
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Untitled
Abstract: No abstract text available
Text: Doc. No. DG-132034 ISSUED February 26, 2013 LIGHTING DEVICE DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION 仕様書 SPECIFICATIONS 品名 表面実装型 LED Product name Surface Mount LED 形名 GM2BT57QV1□ Model No. □： 1，２
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DG-132034
GM2BT57QV1â
DG-132034
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Untitled
Abstract: No abstract text available
Text: Doc. No. DG-132032 ISSUED February 26, 2013 LIGHTING DEVICE DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION 仕様書 SPECIFICATIONS 品名 表面実装型 LED Product name Surface Mount LED 形名 GM2BT40QV1□ Model No. □： 1，２
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DG-132032
GM2BT40QV1â
DG-132032
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Untitled
Abstract: No abstract text available
Text: Doc. No. DG-132033 ISSUED February 26, 2013 LIGHTING DEVICE DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION 仕様書 SPECIFICATIONS 品名 表面実装型 LED Product name Surface Mount LED 形名 GM2BT50QV1□ Model No. □： 1，２
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DG-132033
GM2BT50QV1â
DG-132033
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Untitled
Abstract: No abstract text available
Text: Doc. No. DG-132036 ISSUED February 26, 2013 LIGHTING DEVICE DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION 仕様書 SPECIFICATIONS 品名 表面実装型 LED Product name Surface Mount LED 形名 GM2BT27QV2□ Model No. □： 1，２
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DG-132036
GM2BT27QV2â
DG-132036
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solder bar senju 705
Abstract: photometer EG G 150 EIAJ C-3
Text: SPEC. No. SH/VR $ /'T IS S U E /*•*' ELECTRONIC COMPONENTS ELECOM GROUP DG-07Y012 Dec. 28th, 2007 ^ ¡\ SHARP CORPORATION SPECIFICATIONS DEVICE SPECIFICATIONS FOR LIGHT EMITTING DIODE MODEL No.' GM1BW76341A CUSTOMERS’ APPROVAL PRESENTED Date_
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DG-07Y012
GM1BW76341A
A1249
solder bar senju 705
photometer EG G 150
EIAJ C-3
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GM1WA55311A
Abstract: GM1WA55311 senju m705 solder paste spec Senju Senju M705 Solder bar of Senju M705 C0806 IR sensor for 40khz diode Cathode indicated by blue band ESR250
Text: SPEC. N o. DG-072023A SH ARP ISSUE Dec-20-07 COMPOUND SEMICONDUCTOR SYSTEMS DIVISION ELECTRONIC COMPONENTS ELECOM GROUP SHARP CORPORATION SPECIFICATIONS DEVICE SPECIFICATION FOR LIGHT EMITTING DIODE MODEL No. G M 1W A 55311A CUSTOMERS' APPROVAL PRESENTED
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DG-072023A
Dec-20-07
GM1WA55311A
DG-072023A
GM1WA55
40kHz,
GM1WA55311A
GM1WA55311
senju m705 solder paste spec
Senju
Senju M705
Solder bar of Senju M705
C0806
IR sensor for 40khz
diode Cathode indicated by blue band
ESR250
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