Senju M705-GRN360-K2-V
Abstract: Senju M705-GRN360-K2-V solder paste Senju eco solder paste Senju M705-GRN360-K2-V TYPE 4 OZ63-221CM5-42-10 senju type 5
Text: 0.3 mm Pitch Back-lock FPC Connectors FF12 Series OUTLINE The FF12 series back-lock LIF connector allows for design flexibility by incorporating both an upper contact and a lower contact to interface with a 0.15mm thick FPC at a 0.3mm pitch. The low profile
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M705-GRN360-K2-V
Senju M705-GRN360-K2-V
Senju M705-GRN360-K2-V solder paste
Senju eco solder paste
Senju M705-GRN360-K2-V TYPE 4
OZ63-221CM5-42-10
senju type 5
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Untitled
Abstract: No abstract text available
Text: 0.5mm Pitch FPC/FFC/Membrane FF14A Series 【Cable Lock Type】 OUTLINE FF14A series is a 0.9mm height connector with a cable lock mechanism, in conformity to FPC of 0.5mm pitch and 0.2mm thick. Applicable cable is 0.2mm thick FPC, FFC and membrane. APPLICATIONS
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FF14A
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Untitled
Abstract: No abstract text available
Text: 0.5mm pitch low profile FPC LIF back-lock connector FF14C Series OUTLINE The FF14C series low profile FPC LIF connector has a back-lock mechanism with a 0.5mm contact pitch. It mates with a standard FPC circuit of 0.3mm thick. The upper contact is utilized as the electrical contact for the FPC material.
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FF14C
M705-GRN360-K2-V
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senju m705 solder paste
Abstract: Solder bar of Senju M705 M705-221BM5-42-11
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*GT4C *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-5-14-A
senju m705 solder paste
Solder bar of Senju M705
M705-221BM5-42-11
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Untitled
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*GT4E *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-7-14-A
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senju m705 solder paste
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB50GT1C *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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GM2BB50GT1C
LD-E7-2-14-A
senju m705 solder paste
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Untitled
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QT1C *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-1-14-A
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Untitled
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QT4E *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-6-14-A
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Senju ESR-250
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2AA50GV6* *:1.2 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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GM2AA50GV6*
LD-E7-9-14-A
Senju ESR-250
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Senju M705
Abstract: Senju eco solder M705 Senju M705 m705 m705-tva Senju eco solder paste senju m705 solder paste Solder bar of Senju M705 M705-TVA03 Senju m705-tva senju solder bar
Text: Application Report SWPA156 – February 2009 Part – II Assembly Guidelines for 0.4-mm Package-On-Package Packages Steven Kummerl . OMAP ABSTRACT
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SWPA156
Senju M705
Senju eco solder M705
Senju M705 m705 m705-tva
Senju eco solder paste
senju m705 solder paste
Solder bar of Senju M705
M705-TVA03
Senju
m705-tva
senju solder bar
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Untitled
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QB2C *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-3-14-A
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QT4c
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QT4C *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-4-14-A
QT4c
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Untitled
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2AA*QV6F *:27,30,35,40,50,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-8-14-A
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Senju M705-GRN360-K2-V solder paste
Abstract: Senju M705-GRN360-K2-V
Text: 0.5mm Pitch Back-lock FPC Connectors FF14 Series OUTLINE The FF14 FPC connector utilizes a back-lock mechanism with 0.5mm pitch. This ultra-low profile ZIF connector has a height of only 0.9mm. The FF14 connector series offers flexibility in FPC design as it mates with 0.20mm thick or 0.12mm thick
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M705-GRN360-K2-V
Senju M705-GRN360-K2-V solder paste
Senju M705-GRN360-K2-V
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senju M705 solder paste
Abstract: Senju M705 senju solder paste M705 senju solder paste M705 solder paste Senju metal solder paste senju solder specification
Text: NEW 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series 51pos. type 0.9mm 3.45mm 17 .1m m •Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms.
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51pos.
11gramms.
senju M705 solder paste
Senju M705
senju solder paste M705
senju solder paste
M705 solder paste
Senju metal solder paste
senju solder specification
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Senju M705
Abstract: M705 solder paste senju m705 solder paste
Text: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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Senju M705
Abstract: Senju Sn Pb 60 40 solder Senju PASTE Senju
Text: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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senju m705 solder paste
Abstract: senju solder paste Senju M705 Senju metal solder paste Senju M705-221CM5 SENJU 221CM5 senju M705 solder paste data sheet M705 solder paste stiffener
Text: 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series 51pos. type 0.9mm 3.45mm 17 .1m m •Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms.
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51pos.
11gramms.
senju m705 solder paste
senju solder paste
Senju M705
Senju metal solder paste
Senju
M705-221CM5
SENJU 221CM5
senju M705 solder paste data sheet
M705 solder paste
stiffener
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Untitled
Abstract: No abstract text available
Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
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51pos.
11gramms.
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senju m705 solder paste
Abstract: Senju M705 SENJU mobile actuator ltds senju solder paste
Text: NEW 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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Senju M705
Abstract: No abstract text available
Text: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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senju m705 solder paste
Abstract: Senju M705 SENJU SENJU SOLDER PASTE M705-221CM5 Senju metal solder paste standard ul94v0 plastic paste M705 solder paste
Text: NEW 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series 51pos. type 0.9mm 3.45mm 17 .1m m •Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms.
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51pos.
11gramms.
senju m705 solder paste
Senju M705
SENJU
SENJU SOLDER PASTE
M705-221CM5
Senju metal solder paste
standard ul94v0 plastic paste
M705 solder paste
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cf-110vh-2a
Abstract: tamura CF-110VH-2A senju m705 solder wire Senju senju m705 solder wire 0.5 mm Senju M705 senju m705 solder paste content SN100C C-1932144 tamura solder paste
Text: 108-60062-1 Product Specification HD-22 Amplimite Connector Restricted for Matsushita Electric Industrial Co.,Ltd. 1. SCOPE. 1.1 Content. This specification covers the requirements for product performance, test methods and quality assurance provision of AMPLIMITE CONNECTOR/HD22 V/T TYPE. Applicable product description and part
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HD-22
CONNECTOR/HD22
ASHL-0005-
cf-110vh-2a
tamura CF-110VH-2A
senju m705 solder wire
Senju
senju m705 solder wire 0.5 mm
Senju M705
senju m705 solder paste content
SN100C
C-1932144
tamura solder paste
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Senju M705
Abstract: M705-221CM5 senju m705 solder paste senju solder paste senju Senju metal solder paste SENJU 221CM5 M7052 M705-221CM5-42-10 221CM5
Text: NEW 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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