SG-BGA-6009 Search Results
SG-BGA-6009 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| 84512-202 |
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100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array |
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| 10022671-102LF |
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528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free |
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| 84501-001LF |
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300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free |
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| 55714-102LF |
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81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free |
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| 84520-002LF |
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400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free |
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SG-BGA-6009 Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Curated | Datasheet Type | |
|---|---|---|---|---|---|---|
| SG-BGA-6009 | Ironwood Electronics | GHz BGA Sockets-1.0mm; IC Size X (mm): 27; IC Size Y (mm): 27; IC Array X: 26; IC Array Y: 26; Max Pincount: 676; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.7; IC Ball Height Max (mm): 0.6; IC Ball Height Min (mm): 0.4; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 2.5; Max Package Code: BGA676C; Backing Plate: yes; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: ZIF (screw); Part Description: GHz BGA Socket (ZIF) | Original |