SG-BGA-6071 Search Results
SG-BGA-6071 Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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MPC860PZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | |||
MPC860PVR80D4 |
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32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | |||
MPC855TCZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | |||
MPC860TCZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | |||
MPC860ENZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
SG-BGA-6071 Datasheets (1)
Part | ECAD Model | Manufacturer | Description | Curated | Datasheet Type | |
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SG-BGA-6071 | Ironwood Electronics | GHz BGA Sockets-0.8mm; IC Size X (mm): 27; IC Size Y (mm): 27; IC Array X: Any; IC Array Y: Any; Max Pincount: Any; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.15; IC Ball Diameter Max (mm): 0.8; IC Ball Height Max (mm): 0.9; IC Ball Height Min (mm): 0.8; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 3.298; Max Package Code: Backing Plate: yes; Cavity Down: no; Heat Sink: yes; IC Top Surface: Flip Chip + Caps; Socket Lid: Screws; Part Description: GHz BGA Socket (ZIF) | Original |