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    SG-BGA-6073 Search Results

    SG-BGA-6073 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D6417750RBP240DV Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    HD6417750RBP240 Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    HD6417750RBP200V Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    7MMV4101S10BGI Renesas Electronics Corporation 128K X 24 MCM BGA 3.3 Visit Renesas Electronics Corporation
    7MMV4101S15BG Renesas Electronics Corporation 128K X 24 MCM BGA 3.3 Visit Renesas Electronics Corporation

    SG-BGA-6073 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SG-BGA-6073 Ironwood Electronics GHz BGA Sockets-1.0mm; IC Size X (mm): 45; IC Size Y (mm): 45; IC Array X: 44; IC Array Y: 44; Max Pincount: 1716; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.7; IC Ball Height Max (mm): 0.6; IC Ball Height Min (mm): 0.4; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 3.6; Max Package Code: Backing Plate: yes; Cavity Down: no; Heat Sink: yes; IC Top Surface: Flat; Socket Lid: Screws; Part Description: GHz BGA Socket (ZIF)-HD Original PDF