SG-BGA-6075 Search Results
SG-BGA-6075 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| MPC860PZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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| MPC860PVR80D4 |
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32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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| MPC855TCZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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| MPC860TCZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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| MPC860ENZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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SG-BGA-6075 Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Curated | Datasheet Type | |
|---|---|---|---|---|---|---|
| SG-BGA-6075 | Ironwood Electronics | GHz BGA Sockets-0.8mm; IC Size X (mm): 8; IC Size Y (mm): 8; IC Array X: 8; IC Array Y: 8; Max Pincount: 64; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.1; IC Ball Diameter Max (mm): 0.45; IC Ball Height Max (mm): 0.41; IC Ball Height Min (mm): 0.31; IC Size Tolerance (mm): 0.1; IC Total Height Max (mm): 1.5; Max Package Code: BGA64F; Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Screws; Part Description: GHz BGA Socket (ZIF)-HD | Original |