SG-BGA-6180 Search Results
SG-BGA-6180 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| MPC860PZQ50D4 |
|
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
|
|
|
| MPC860PVR80D4 |
|
32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
|
|
|
| MPC855TCZQ50D4 |
|
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
|
|
|
| MPC860TCZQ50D4 |
|
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
|
|
|
| MPC860ENZQ50D4 |
|
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
|
|
SG-BGA-6180 Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Curated | Datasheet Type | |
|---|---|---|---|---|---|---|
| SG-BGA-6180 | Ironwood Electronics | GHz BGA Sockets-1.27mm; IC Size X (mm): 45; IC Size Y (mm): 45; IC Array X: 34; IC Array Y: 34; Max Pincount: 1156; Top Pitch (mm): 1.27; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.75; IC Ball Height Max (mm): 0.7; IC Ball Height Min (mm): 0.5; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 2.51; Max Package Code: BGA1156; Backing Plate: yes; Cavity Down: no; Heat Sink: no; IC Top Surface: Mold Cap; Socket Lid: Screws; Part Description: GHz BGA Socket (ZIF) | Original |