SG-BGA-6209 Search Results
SG-BGA-6209 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| V62/09629-01XE |
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Enhanced Product Fixed-Point Digital Signal Processor 376-BGA -40 to 125 |
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| V62/09624-01XE |
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Enhanced Product Delfino™ 32-bit MCU, FPU, 512 KB Flash, EMIF, 12b ADC 176-BGA -55 to 125 |
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| TMS320C28344ZEPQ |
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Delfino Microcontroller 256-BGA |
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| TMS320C28345ZEPQ |
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Delfino Microcontroller 256-BGA |
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| TMS320C28343ZEPQ |
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Delfino Microcontroller 256-BGA |
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SG-BGA-6209 Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Curated | Datasheet Type | |
|---|---|---|---|---|---|---|
| SG-BGA-6209 | Ironwood Electronics | GHz BGA Sockets-0.8mm; IC Size X (mm): 15; IC Size Y (mm): 15; IC Array X: 18; IC Array Y: 18; Max Pincount: 324; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.55; IC Ball Height Max (mm): 0.5; IC Ball Height Min (mm): 0.3; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 0.132; Max Package Code: BGA324; Backing Plate: NO; Cavity Down: no; Heat Sink: no; IC Top Surface: Mold Cap; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF) | Original |