SG-BGA-6226 Search Results
SG-BGA-6226 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| MPC860PZQ50D4 |
|
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
|
|
|
| MPC860PVR80D4 |
|
32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
|
|
|
| MPC855TCZQ50D4 |
|
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
|
|
|
| MPC860TCZQ50D4 |
|
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
|
|
|
| MPC860ENZQ50D4 |
|
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
|
|
SG-BGA-6226 Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Curated | Datasheet Type | |
|---|---|---|---|---|---|---|
| SG-BGA-6226 | Ironwood Electronics | GHz BGA Sockets-1.0mm; IC Size X (mm): 19; IC Size Y (mm): 19; IC Array X: 18; IC Array Y: 18; Max Pincount: 324; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.7; IC Ball Height Max (mm): 0.5; IC Ball Height Min (mm): 0.3; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 3.42; Max Package Code: BGA324; Backing Plate: yes; Cavity Down: no; Heat Sink: yes; IC Top Surface: Mold Cap; Socket Lid: Screws; Part Description: GHz BGA Socket (ZIF) | Original |