High Density GHz BGA Sockets; Max Pincount: 96; Top Pitch (mm): 0.5; IC Array X: 12; IC Array Y: 8; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Mold Cap; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 1.125; IC Size X (mm): 7; IC Size Y (mm): 5; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.225; IC Ball Height Max (mm): 0.25; IC Ball Diameter Max (mm): 0.3; Max Package Code: BGA784; Part Description: GHz BGA Socket (ZIF)-HD
