SHIPPING TRAYS KOSTAT 10 X 10 Search Results

SHIPPING TRAYS KOSTAT 10 X 10 Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
UE36C1620005011		Amphenol Communications Solutions	1x1 QSFP-DD cage with the clip ship loose, no heat sink
10067847-001TLF		Amphenol Communications Solutions	10067847-001TLF-SD CARD TRAY PACKAGING
U77A11282001		Amphenol Communications Solutions	1X1 CAGE FOR H/S NI TRAY
U77A11282021		Amphenol Communications Solutions	1X1 CAGE FOR H/S NI TRAY
U77A61142001		Amphenol Communications Solutions	SFP 1X6 CAGE NI TRAY

SHIPPING TRAYS KOSTAT 10 X 10 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
Kostat tray Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13 Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher	Original	and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13	PDF
Kostat Abstract: JEDEC Kostat AN101094-1 Kostat tray J-STD-013 AN-1126 pcb design 0,5 mm pitch Shipping Trays kostat 10 x 10 Kostat tray 3.0 JEDEC Kostat component tray Text: National Semiconductor Application Note 1126 September 1999 Printed Circuit Board PCB Layout Guidelines NSMD defined pads enhance vision registration of copper fiducials compared to the SMD defined pad. For SMD defined pads, any misregistration of the solder mask will contribute	Original	AN-1126 Kostat JEDEC Kostat AN101094-1 Kostat tray J-STD-013 AN-1126 pcb design 0,5 mm pitch Shipping Trays kostat 10 x 10 Kostat tray 3.0 JEDEC Kostat component tray	PDF
TAIYO PSR 4000 Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100 Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original		PDF
TAIYO PSR 4000 Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original		PDF
SKY77189 Abstract: KS-1208-208 KS-1208 Shipping Trays kostat 10 x 10 HSDPA JEDEC Kostat ACLR10 D232 GP01 Kostat carrier tape Text: ADVANCE DATA SHEET SKY77189 Power Amplifier Module for WCDMA / HSDPA Band VIII 880–915 MHz Applications • WCDMA handsets • HSDPA Features • Low voltage positive bias supply 3.2 V to 4.2 V • Good linearity • High efficiency - 40% @ 28.75 dBm • Large dynamic range	Original	SKY77189 10-pad KS-1208-208 KS-1208 Shipping Trays kostat 10 x 10 HSDPA JEDEC Kostat ACLR10 D232 GP01 Kostat carrier tape	PDF
design of multi section directional coupler Abstract: class d power amplifier Kostat tray MMIC code D sky77189 Shipping Trays kostat 10 x 10 datasheet ACLR10 D232 GP01 kostat skyworks 3 x 3 Text: ADVANCE DATA SHEET SKY77189 Power Amplifier Module for WCDMA / HSDPA Band VIII 880–915 MHz Applications • WCDMA handsets • HSDPA Features • Low voltage positive bias supply 3.2 V to 4.2 V • Good linearity • High efficiency - 40% @ 28.75 dBm • Large dynamic range	Original	SKY77189 10-pad design of multi section directional coupler class d power amplifier Kostat tray MMIC code D Shipping Trays kostat 10 x 10 datasheet ACLR10 D232 GP01 kostat skyworks 3 x 3	PDF
Untitled Abstract: No abstract text available Text: DATA SHEET SKY77155 System Smart PA Module for CDMA / KPCS 1750–1780 MHz and WCDMA (1710–1785 MHz) Applications Description • Personal Communications Services (PCS) The SKY77155 System Smart® Power Amplifier Module (PAM) is a fully matched 8-pad surface mount	Original	SKY77155	PDF
JESD-A115 Abstract: SKY77155 kostat skyworks 6 x 6 D232 GP01 JEDEC Kostat kostat 6 x 6 JESD-C101 Shipping Trays kostat 10 x 10 Text: DATA SHEET SKY77155 System Smart PA Module for CDMA / KPCS 1750–1780 MHz and WCDMA (1710–1785 MHz) Applications Description • Personal Communications Services (PCS) The SKY77155 System Smart® Power Amplifier Module (PAM) is a fully matched 8-pad surface mount	Original	SKY77155 JESD-A115 kostat skyworks 6 x 6 D232 GP01 JEDEC Kostat kostat 6 x 6 JESD-C101 Shipping Trays kostat 10 x 10	PDF
fBGA package tray 12 x 19 Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125 Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2	Original		PDF
taiyo PSR4000 Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5 Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2	Original		PDF