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    Infineon Technologies AG

    Infineon Technologies AG SIDC05D60C6X1SA2

    Diode Switching 15A DIE Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC05D60C6X1SA2)
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    Avnet Americas SIDC05D60C6X1SA2 Waffle Pack 985
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    SIDC05D60C6 Datasheets (2)

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    SIDC05D60C6 Infineon Technologies Used for IGBT3 Original PDF
    SIDC05D60C6X1SA2 Infineon Technologies Discrete Semiconductor Products - Diodes - Rectifiers - Single - DIODE GEN PURP 600V 15A WAFER Original PDF

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    Untitled

    Abstract: No abstract text available
    Text: SIDC05D60C6 Fast switching diode chip in EMCON 3 -Technology FEATURES: • 600V EMCON 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient Chip Type VR SIDC05D60C6 600V IF 15A A This chip is used for:


    Original     		SIDC05D60C6 Q67050-A4284A101 L4531M, PDF

    L4531M

    Abstract: SIDC05D60C6
    Text: SIDC05D60C6 Fast switching diode chip in EMCON 3 -Technology FEATURES: • 600V EMCON 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient Chip Type VR SIDC05D60C6 600V IF 15A A This chip is used for:


    Original     		SIDC05D60C6 Q67050-A4284A101 L4531M, L4531M SIDC05D60C6 PDF

    L4531M

    Abstract: FS15R06XE3 SIDC05D60C6
    Text: SIDC05D60C6 Fast switching diode chip in EMCON 3 -Technology FEATURES: • 600V EMCON 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient A This chip is used for: • power module • discrete components


    Original     		SIDC05D60C6 L4531M, L4531M FS15R06XE3 SIDC05D60C6 PDF