B-3067
Abstract: B-3226 TST-9107 DD-03182GP-200 ddc b-3067 DD-03282GP-200 B-3227 HS1-3182-5 ddc B-3226 DD-03282DC-120
Text: INDUSTRY CROSS REFERENCE GUIDE ARINC 429 PACKAGE HOLT PART DEI LINE DRIVER 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 28-PIN CERAMIC LEADLESS CHIP CARRIER 28-PIN CERAMIC LEADLESS CHIP CARRIER
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16-PIN
28-PIN
B-3067
B-3226
TST-9107
DD-03182GP-200
ddc b-3067
DD-03282GP-200
B-3227
HS1-3182-5
ddc B-3226
DD-03282DC-120
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5-Lead Plastic DD Pak ltc Q
Abstract: ADI TI 20 PIN LEADLESS CHIP CARRIER qfn 44 PACKAGE footprint 9mm DN SOT-223 8 lead side brazed MS8 PACKAGE footprint 5 lead dd pak maxim Cross Reference Search WO10
Text: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE* DESCRIPTION LTC NSC ADI TI/BURR-BROWN MAXIM 8-Lead Side Brazed Hermetic D8 D D — DA 14-, 16-, 18- and 20-Lead Side Brazed (Hermetic)
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28-Lead
56-Lead
28-Lead
36-Lead
10-Lead
20-Lead
O-220
5-Lead Plastic DD Pak ltc Q
ADI TI
20 PIN LEADLESS CHIP CARRIER
qfn 44 PACKAGE footprint 9mm
DN SOT-223
8 lead side brazed
MS8 PACKAGE footprint
5 lead dd pak
maxim Cross Reference Search
WO10
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117450
Abstract: TO253 lt941 ltc947 1624i LT 129i5 sm 2178a LT1510CGN sot23 1303 ltbw 83
Text: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D D ADI/PMI — l — — DA 14-, 16-, 18- and 20-Lead Side Brazed (Hermetic) D D D YB QB XB L — — DD, DE, DN, DP
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20-Lead
20-Lead
O-220
117450
TO253
lt941
ltc947
1624i
LT 129i5
sm 2178a
LT1510CGN
sot23 1303
ltbw 83
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LTC DWG 05-08-1661
Abstract: ks 15544 transistor FN 1016 MS10 SO18 SO20 SO24 WO10 TO253 WO14
Text: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D D ADI/PMI — l — — DA 14-, 16-, 18- and 20-Lead Side Brazed (Hermetic) D D D YB QB XB L — — DD, DE, DN, DP
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20-Lead
20-Lead
O-226)
LTC DWG 05-08-1661
ks 15544
transistor FN 1016
MS10
SO18
SO20
SO24
WO10
TO253
WO14
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Untitled
Abstract: No abstract text available
Text: OVER-THE-SIDE IMMERSION HEATERS PRODUCT DESCRIPTION Over-the side immersion heaters are designed for vessels where through the side immersion heaters cannot be conveniently installed. These heaters are installed through the top of the vessel with the heated portion of the unit along the
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DD 127 D TRANSISTOR
Abstract: FK 231 SA 220 transistor fn 1016 LTC DWG FN 1016 dp 502 t TO 220 MOT E SO18 TI 3-Lead Plastic DD Pak ltc m 5-Lead Plastic DD Pak ltc Q
Text: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE LCC METAL CAN CERDIP Ceramic Dual-In-Line METAL CANS SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D
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20-Lead
20-Lead
28-Lead
O-226)
DD 127 D TRANSISTOR
FK 231 SA 220
transistor fn 1016
LTC DWG
FN 1016
dp 502 t
TO 220 MOT E
SO18 TI
3-Lead Plastic DD Pak ltc m
5-Lead Plastic DD Pak ltc Q
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LT1460BCS3-10
Abstract: marking code LTGG LTGF marking code sot 23 MARK LTGG LTKD MARKING CODE ltbw LM 3937 LT1460BCS3-2 LT1521CS8-3 LTHS
Text: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE LCC METAL CAN CERDIP Ceramic Dual-In-Line METAL CANS SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D
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20-Lead
20-Lead
28-Lead
LT1613CS5
LT1615CS5
LT1615CS5-1
LT1617CS5
LT1617CS5-1
LT1761ES5-1
LT1761ES5-2
LT1460BCS3-10
marking code LTGG
LTGF marking code sot 23
MARK LTGG
LTKD MARKING CODE
ltbw
LM 3937
LT1460BCS3-2
LT1521CS8-3
LTHS
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Untitled
Abstract: No abstract text available
Text: 2.0 RADHARD MSI PACKAGES Side-Brazed Packages 245 RadHard MSI Logic Flatpack Packages RadHard MSI Logic 246
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d1001-09
Abstract: d10-0109
Text: Supertex inc. Package Outline 20-Lead Ceramic Side-Brazed Package Outline C/NC .980x.280in. body, .200in. height (max), .100in. pitch D 20 Note 1 (Index Area) E1 E b1 1 b Top View View B View B Seating Plane A L A A1 e eA A eB Side View View A - A Note:
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20-Lead
280in.
200in.
100in.
DSPD-20CDIPCNC
D100109
d1001-09
d10-0109
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Untitled
Abstract: No abstract text available
Text: 2.0 RAD-HARD MSI PACKAGES Side-Brazed Packages 237 Rad-Hard MSI Logic Flatpack Packages Rad-Hard MSI Logic 238
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DS812
Abstract: Side Brazed Ceramic Dual-In-Line Packages lead side brazed hermetic
Text: data sheet CERAMIC / HERMETIC Side Braze Side Braze SB Amkor Technology is committed to continuing to service this long established standard industry package. The SB package comes in a wide range of lead counts: from 8-48 leads with a lead pitch of 100 mil inches. This thru-hole package consists
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DS812
DS812
Side Brazed Ceramic Dual-In-Line Packages
lead side brazed hermetic
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ansi y14.5m-1982
Abstract: 100-PIN CB100 XC3000
Text: NON LID SIDE LID SIDE s Y M B A2 DETAIL ’A’ □ DETAIL ’B’ NOTES: 1. ALL DIMENSIONING AND TOLERANCING CONFORM TO ANSI Y 1 4 .5 M - 1 982 2. SYMBOL ” N” IS THE NUMBER OF TERMINALS. 3. PACKAGES ARE SHIPPED UNFORMED. 4. LEAD FINISH: GOLD 50 MICROINCHES MINIMUM
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OCR Scan
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5M-1982
MIL-l-38535
100-PIN
CB100)
XC3000
ansi y14.5m-1982
CB100
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PDF
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Untitled
Abstract: No abstract text available
Text: Package Outline 20-Lead Ceramic Side-Brazed Package Outline C/NC .980x.280in. body, .200in. height (max), .100in. pitch D 20 Note 1 (Index Area) E1 E b1 1 b Top View View B View B Seating Plane A L A A1 e eA A eB Side View View A - A Note: 1. A Pin 1 identifier must be located in the index area indicated. The Pin 1 identifier can be: a molded mark/identifier; an embedded metal marker; or
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20-Lead
280in.
200in.
100in.
DSPD-20CDIPCNC
C101008
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CB164
Abstract: XC3000 164-pin 007012c
Text: LID SIDE NON LID SIDE SECTION P - P s / Y M aTT ^ T jt t DETAIL ’A’ INCHES B bJ U DETAIL ’B’ □ L ,130 A1 ,110 AP ,020 C D l/ E l 1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y1 4 .5 M - 1 982 MAX, NDM, A B NOTES: MIN. ,007 ,005 ,006 ,012 ,009
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OCR Scan
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5M-1982
MIL-l-38535
164-PIN
CB164)
XC3000
CB164
007012c
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PDF
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ansi y14.5m-1982
Abstract: 100-PIN CB100 XC4000 5M-1982
Text: NON LID SIDE LID SIDE s Y M B A2 □ DETAIL ’A’ DETAIL ’B’ NOTES: L MIN, NDM. MAX, ,135 A Al ,115 A2 ,020 B C 1. ALL DIMENSIONING AND TOLERANCING CONFORM TO ANSI Y 1 4 .5 M -1 982 IN CH ES D l/ E l ,006 ,005 ,008 ,006 ,012 ,009 ,740 ,750 ,765 ,600 BSC
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OCR Scan
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5M-1982
MIL-l-38535
100-PIN
CB100)
XC4000
ansi y14.5m-1982
CB100
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PDF
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ISO103
Abstract: ISO103B PWS750-1
Text: ISO103 Low-Cost, Internally Powered ISOLATION AMPLIFIER FEATURES APPLICATIONS ● SIGNAL AND POWER IN ONE DOUBLE-WIDE 0.6" SIDE-BRAZED PACKAGE ● 5600Vpk TEST VOLTAGE ● 1500Vrms CONTINUOUS AC BARRIER RATING ● MULTICHANNEL ISOLATED DATA ACQUISITION
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ISO103
5600Vpk
1500Vrms
4-20mA
20kHz
PWS750-1
PWS750-1
ISO103
ISO103B
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Untitled
Abstract: No abstract text available
Text: Installation Tools Crimping Guidelines for PANDUIT P a n -TEr m ® Terminals and Disconnects C R IM P DIRECTIO N dznL= L IN SU LATIO N C R IM P A R E A IND EN TER SIDE B R A Z E D SEAM 1 i IND EN TER SIDE — ^ (B U TTE D SEAM ) J Insulated Terminals and Disconnects
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OCR Scan
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PDF
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Untitled
Abstract: No abstract text available
Text: LID SIDE NON LID SIDE SEE DETAIL ’B’ £ SECTION P - P J_L 1 A1 A ¡rtrr s u u u U U □ DETAIL ’A ’ L B— NOTES: Y M B DETAIL ’B’ IN C H E S MIN, MAX, NDM, A Al ,130 ,081 ,090 ,105 A2 1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y 14.5 M —1982
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OCR Scan
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5M-1982
MIL-l-38535
196-PIN
CB196
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PDF
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ISO103
Abstract: pt100/RTD PT100 ISO103B PWS750-1 Isolated 4-20ma
Text: ISO103 Low-Cost, Internally Powered ISOLATION AMPLIFIER FEATURES APPLICATIONS ● SIGNAL AND POWER IN ONE DOUBLE-WIDE 0.6" SIDE-BRAZED PACKAGE ● 5600Vpk TEST VOLTAGE ● MULTICHANNEL ISOLATED DATA ACQUISITION ● 1500Vrms CONTINUOUS AC BARRIER RATING
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ISO103
5600Vpk
1500Vrms
20kHz
4-20mA
PWS750-1
PWS750-1
ISO103
pt100/RTD PT100
ISO103B
Isolated 4-20ma
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PDF
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AD2700
Abstract: No abstract text available
Text: S iP e X HS2700 SERIES "cofDOfatiori^ “ CofDOfatiori' SIGNAL PROCESSING EXCELLENCE PRECISION +10V, •10V, ±10V REFERENCES FEATURES ■ High accuracy: 10.000 volts, ±2,5mV ■ Low temperature coefficient: 3 ppm/°C ■ 14-pin ceramic side brazed package
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OCR Scan
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HS2700
14-pin
AD2700
HS2701
HS2702
MIL-STD-883C
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PDF
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DIL socket 16pin
Abstract: No abstract text available
Text: Quad Line Receiver Austin Semiconductor, Inc. Universal Hexadecimal Counter PIN ASSIGNMENT Top View AVAILABLE AS MILITARY SPECIFICATIONS 16-Pin Side Brazed DIP • Military Equivalent Screening - 883 1.2.2 VCC1 Q2 Q3 COUT\ D3 D2 S2 V EE GENERAL DESCRIPTION
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AS10H536C16MIL
16-Pin
AS10H536C16MIL
10K-Compatible
CDIP2-T16
DIL socket 16pin
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PDF
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DS33023
Abstract: PIC16C72 seminar Applications Book Maxim AN578 PIC16CR72
Text: M PIC16C72 SERIES 8-Bit CMOS Microcontrollers with A/D Converter Devices included: Pin Diagrams • PIC16C72 SDIP, SOIC, SSOP, Windowed Side Brazed Ceramic • PIC16CR72 Microcontroller Core Features: 1998 Microchip Technology Inc. •1 28 RB7 RA0/AN0
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PIC16C72
PIC16C72
PIC16CR72
DS33023
seminar Applications Book Maxim
AN578
PIC16CR72
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PDF
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PIC16C72
Abstract: PIC Mid-Range Reference Manual DS33023
Text: PIC16C72 SERIES 8-Bit CMOS Microcontrollers with A/D Converter Devices included: Pin Diagrams • PIC16C72 SDIP, SOIC, SSOP, Windowed Side Brazed Ceramic • PIC16CR72 Microcontroller Core Features: 1998-2013 Microchip Technology Inc. •1 28 RB7 RA0/AN0
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PIC16C72
PIC16C72
PIC16CR72
Me-3-5770-955
DS39016B-page
PIC Mid-Range Reference Manual DS33023
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PDF
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HV20420C
Abstract: No abstract text available
Text: HV204 inc. Objective Low Charge Injection 8-Channel High Voltage Analog Switch Ordering Information_ Package Options V - Vw NN * PP 28-pin ceramic*1 side-brazed DIP 200V Die in waffle pack 28-pin plastic DIP HV20420X HV20420P HV20420C
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OCR Scan
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HV204
28-pin
HV20420C
HV20420X
HV20420P
28-lead
HV20420PJ
IL-STD-883
10MHz
HV20420C
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