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    SIGC186T170R3E Price and Stock

    Infineon Technologies AG SIGC186T170R3EX1SA

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC186T170R3EX1SA)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIGC186T170R3EX1SA Waffle Pack 1,233
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    Infineon Technologies AG SIGC186T170R3EX1SA4

    (Alt: SP000522392)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    EBV Elektronik SIGC186T170R3EX1SA4 2 Weeks 1
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    SIGC186T170R3E Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: SIGC186T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology  low turn-off losses  short tail current  positive temperature coefficient  easy paralleling Chip Type SIGC186T170R3E VCE IC 1700V 150A This chip is used for:  power modules


    Original     		PDF SIGC186T170R3E L7797M, L7797T, L7797E,

    Untitled

    Abstract: No abstract text available
    Text: SIGC186T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC186T170R3E VCE IC 1700V 150A This chip is used for: • power modules


    Original     		PDF SIGC186T170R3E L7791T,