format .rbf
Abstract: EPC16 EPCS128 EPCS16 EPCS64 TMs 1122
Text: 11. Configuring Stratix III Devices SIII51011-1.1 Introduction This chapter contains complete information on the Stratix III supported configuration schemes, how to execute the required configuration schemes, and all the necessary option pin settings. Stratix III devices use SRAM cells to store configuration data. As SRAM
|
Original
|
PDF
|
SIII51011-1
mi2007
format .rbf
EPC16
EPCS128
EPCS16
EPCS64
TMs 1122
|
EP3SE50
Abstract: implement 16-bit CRC in transmitter and receiver 2N50
Text: 15. SEU Mitigation in Stratix III Devices SIII51015-1.1 Introduction In critical applications such as avionics, telecommunications, system control, and military applications, it is important to be able to do the following: • ■ Confirm that the configuration data stored in an Stratix III device is
|
Original
|
PDF
|
SIII51015-1
EP3SE50
implement 16-bit CRC in transmitter and receiver
2N50
|
SECDED
Abstract: EP3SE50
Text: 4. TriMatrix Embedded Memory Blocks in Stratix III Devices SIII51004-1.8 Introduction TriMatrix embedded memory blocks provide three different sizes of embedded SRAM to efficiently address the needs of Stratix III FPGA designs. TriMatrix memory includes 640- in ROM mode only or 320-bit memory logic array blocks (MLABs),
|
Original
|
PDF
|
SIII51004-1
320-bit
144-Kbit
M144K
SECDED
EP3SE50
|
EP3SE50
Abstract: glitch removing ICs for counter signals
Text: 6. Clock Networks and PLLs in Stratix III Devices SIII51006-1.1 Introduction Stratix III devices provide a hierarchical clock structure and multiple PLLs with advanced features. The large number of clocking resources, in combination with the clock synthesis precision provided by the PLLs,
|
Original
|
PDF
|
SIII51006-1
EP3SE50
glitch removing ICs for counter signals
|
diagram remote control receiver and transmitter
Abstract: remote protocol remote system upgrades EPCS64 remote control transmitter and receiver circuit EPCS128 EPCS16
Text: 12. Remote System Upgrades with Stratix III Devices SIII51012-1.5 This chapter describes the functionality and implementation of the dedicated remote system upgrade circuitry. It also defines several concepts related to remote system upgrade, including factory configuration, application configuration, remote update
|
Original
|
PDF
|
SIII51012-1
diagram remote control receiver and transmitter
remote protocol
remote system upgrades
EPCS64
remote control transmitter and receiver circuit
EPCS128
EPCS16
|
verilog code of carry save adder
Abstract: vhdl code of carry save adder 16 bit carry select adder verilog code 3-bit binary multiplier using adder VERILOG verilog code for 16 bit carry select adder 8 bit carry select adder verilog code vhdl code for crossbar switch vhdl for carry save adder vhdl code for carry select adder 8 bit carry select adder verilog code with
Text: 2. Logic Array Blocks and Adaptive Logic Modules in Stratix III Devices SIII51002-1.5 Introduction This chapter describes the features of the logic array block LAB in the Stratix III core fabric. The logic array block is composed of basic building blocks known as
|
Original
|
PDF
|
SIII51002-1
verilog code of carry save adder
vhdl code of carry save adder
16 bit carry select adder verilog code
3-bit binary multiplier using adder VERILOG
verilog code for 16 bit carry select adder
8 bit carry select adder verilog code
vhdl code for crossbar switch
vhdl for carry save adder
vhdl code for carry select adder
8 bit carry select adder verilog code with
|
circuit diagram of half adder
Abstract: datasheet for full adder and half adder half adder 32-bit adder multiplier bit 16 bit full adder 4 bit multiplier barrel shifter block diagram half adder datasheet EP3SE50
Text: 5. DSP Blocks in Stratix III Devices SIII51005-1.7 Introduction The Stratix III family of devices have dedicated high-performance digital signal processing DSP blocks optimized for DSP applications. These DSP blocks of the Altera® Stratix device family are the third generation of hardwired, fixed function
|
Original
|
PDF
|
SIII51005-1
circuit diagram of half adder
datasheet for full adder and half adder
half adder
32-bit adder
multiplier bit
16 bit full adder
4 bit multiplier
barrel shifter block diagram
half adder datasheet
EP3SE50
|
ic tms 1000
Abstract: ieee 1149 TMS 1100 EP3SE50
Text: 13. IEEE 1149.1 JTAG Boundary-Scan Testing in Stratix III Devices SIII51013-1.1 Introduction As printed circuit boards (PCBs) become more complex, the need for thorough testing becomes increasingly important. Advances in surface-mount packaging and PCB manufacturing have resulted in
|
Original
|
PDF
|
SIII51013-1
1980s,
ic tms 1000
ieee 1149
TMS 1100
EP3SE50
|
SECDED
Abstract: sram 16k8 EP3SE50
Text: 4. TriMatrix Embedded Memory Blocks in Stratix III Devices SIII51004-1.1 Introduction TriMatrix embedded memory blocks provide three different sizes of embedded SRAM to efficiently address the needs of Stratix III FPGA designs. TriMatrix memory includes 640-bit memory logic array blocks
|
Original
|
PDF
|
SIII51004-1
640-bit
144-Kbit
M144K
SECDED
sram 16k8
EP3SE50
|
diagram remote control receiver and transmitter
Abstract: universal remote EPCS128 EPCS16 EPCS64
Text: 12. Remote System Upgrades With Stratix III Devices SIII51012-1.1 Introduction This chapter describes the functionality and implementation of the dedicated remote system upgrade circuitry. It also defines several concepts related to remote system upgrade, including factory
|
Original
|
PDF
|
SIII51012-1
diagram remote control receiver and transmitter
universal remote
EPCS128
EPCS16
EPCS64
|
Untitled
Abstract: No abstract text available
Text: 10. Hot Socketing and Power-On Reset in Stratix III Devices SIII51010-1.1 Introduction This document contains information on hot socketing specifications, power-on reset requirements, and their implementation in Stratix III devices. Stratix III devices offer hot socketing, which is also known as hot plug-in
|
Original
|
PDF
|
SIII51010-1
|
circuit diagram of half adder
Abstract: datasheet for full adder and half adder 32-bit adder BUTTERFLY DSP half adder datasheet EP3SE50 0x0000100
Text: 5. DSP Blocks in Stratix III Devices SIII51005-1.1 Introduction The Stratix III family of devices have dedicated high-performance digital signal processing DSP blocks optimized for DSP applications. These DSP blocks of the Altera® Stratix device family are the third
|
Original
|
PDF
|
SIII51005-1
circuit diagram of half adder
datasheet for full adder and half adder
32-bit adder
BUTTERFLY DSP
half adder datasheet
EP3SE50
0x0000100
|
SSTL-15
Abstract: SSTL-18 112Rx BGA1152 mini-lvds connector
Text: 9. High-Speed Differential I/O Interfaces and DPA in Stratix III Devices SIII51009-1.1 Introduction The Stratix III device family offers up to 1.25-Gbps differential I/O capabilities to support source-synchronous communication protocols such as Utopia, Rapid I/O , XSBI, SGMII, SFI, and SPI.
|
Original
|
PDF
|
SIII51009-1
25-Gbps
SSTL-15
SSTL-18
112Rx
BGA1152
mini-lvds connector
|
SSTL-15
Abstract: SSTL15 DDR3 SSTL class resistor bank EIA-644 SSTL-18 EP3SE50 SSTL-15 class I
Text: 7. Stratix III Device I/O Features SIII51007-1.1 Introduction Stratix III I/Os are specifically designed for ease of use and rapid system integration while simultaneously providing the high bandwidth required to maximize internal logic capabilities and produce system-level
|
Original
|
PDF
|
SIII51007-1
SSTL-15
SSTL15
DDR3 SSTL class
resistor bank
EIA-644
SSTL-18
EP3SE50
SSTL-15 class I
|
|
Untitled
Abstract: No abstract text available
Text: 3. MultiTrack Interconnect in Stratix III Devices SIII51003-1.0 Introduction Stratix III devices contain a two-dimensional row- and column-based architecture to implement custom logic. A series of column and row interconnects of varying length and speed provides signal interconnects
|
Original
|
PDF
|
SIII51003-1
|
SSTL-15
Abstract: mini-lvds EIA-644 SSTL-18 EP3SL70
Text: 7. Stratix III Device I/O Features SIII51007-1.9 Stratix III I/Os are specifically designed for ease of use and rapid system integration while simultaneously providing the high bandwidth required to maximize internal logic capabilities and produce system-level performance. Independent modular I/O
|
Original
|
PDF
|
SIII51007-1
SSTL-15
mini-lvds
EIA-644
SSTL-18
EP3SL70
|
ic tms 1000
Abstract: 1.9 TDI TMS 1100 EP3SE50
Text: 13. IEEE 1149.1 JTAG Boundary-Scan Testing in Stratix III Devices SIII51013-1.9 This chapter discusses how to use the IEEE Std. 1149.1 boundary-scan test (BST) circuitry in Stratix III devices. The BST architecture offers the capability to test efficiently components on PCBs with tight lead spacing. BST architecture tests pin
|
Original
|
PDF
|
SIII51013-1
ic tms 1000
1.9 TDI
TMS 1100
EP3SE50
|
EP3SGX
Abstract: DDR3 "application note" EP3SE50
Text: 1. Stratix III Device Family Overview SIII51001-1.1 Introduction The Stratix III family provides the most architecturally advanced, high performance, low power FPGAs in the market place. Stratix III FPGAs lower power consumption through Altera’s innovative
|
Original
|
PDF
|
SIII51001-1
EP3SGX
DDR3 "application note"
EP3SE50
|
FBGA 1760
Abstract: EP3SE50 1760-Pin Quartus II Handbook version 9.1 image processing
Text: 1. Stratix III Device Family Overview SIII51001-1.8 The Stratix III family provides one of the most architecturally advanced, high-performance, low-power FPGAs in the marketplace. Stratix III FPGAs lower power consumption through Altera’s innovative Programmable Power Technology, which provides the ability to turn on the
|
Original
|
PDF
|
SIII51001-1
FBGA 1760
EP3SE50
1760-Pin
Quartus II Handbook version 9.1 image processing
|
EP3SE50
Abstract: 99115
Text: 6. Clock Networks and PLLs in Stratix III Devices SIII51006-2.0 This chapter describes the hierarchical clock networks and multiple phase-locked loops PLLs with advanced features in Stratix III devices. The large number of clocking resources, in combination with the clock synthesis precision provided by the
|
Original
|
PDF
|
SIII51006-2
EP3SE50
99115
|
EP3SE50
Abstract: No abstract text available
Text: 8. External Memory Interfaces in Stratix III Devices SIII51008-1.9 The Stratix III I/O structure has been completely redesigned to provide flexible, high-performance support for existing and emerging external memory standards. These include high-performance double data rate DDR memory standards such as
|
Original
|
PDF
|
SIII51008-1
EP3SE50
|
BGA PACKAGE thermal resistance
Abstract: EP3SE50 EP3SE110
Text: 17. Stratix III Device Packaging Information SIII51017-1.7 This chapter provides thermal resistance values and package information for Altera Stratix® III devices, including: • “Thermal Resistance” on page 17–2 ■ “Package Outlines” on page 17–2
|
Original
|
PDF
|
SIII51017-1
EP3SL50
EP3SL70
EP3SE50
EP3SE80
EP3SE110
BGA PACKAGE thermal resistance
EP3SE50
EP3SE110
|
102 TRANSISTOR
Abstract: No abstract text available
Text: 10. Hot Socketing and Power-On Reset in Stratix III Devices SIII51010-1.7 This chapter describes information about hot-socketing specifications, power-on reset POR requirements, and their implementation in Stratix III devices. Stratix III devices offer hot socketing, also known as hot plug-in or hot swap, and
|
Original
|
PDF
|
SIII51010-1
102 TRANSISTOR
|
EP3SE50
Abstract: implement 16-bit CRC in transmitter and receiver "Error Detection" error detection codes EP3SL260
Text: 15. SEU Mitigation in Stratix III Devices SIII51015-1.7 This chapter describes how to use the error detection cyclical redundancy check CRC feature when a Stratix III device is in user mode and recovers from CRC errors. The purpose of the error detection CRC feature is to detect a flip in any of the
|
Original
|
PDF
|
SIII51015-1
EP3SE50
implement 16-bit CRC in transmitter and receiver
"Error Detection"
error detection codes
EP3SL260
|