Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SIL-PAD K10 Search Results

    SIL-PAD K10 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    V36BEZ02307000T Amphenol Communications Solutions ExtremePort QSFP-DD 112G stacked SMT connector, Glue pad version Visit Amphenol Communications Solutions
    NDHN3B7 Amphenol Communications Solutions Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, 30u\\ Pd Ni with Gold flash plating Visit Amphenol Communications Solutions
    NDHN3B2 Amphenol Communications Solutions Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, 8u\\ Gold plating Visit Amphenol Communications Solutions
    NDHN6B2 Amphenol Communications Solutions Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Bulkhead, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, 8u\\ Gold plating Visit Amphenol Communications Solutions
    MSPEP6P22A0 Amphenol Communications Solutions SPE IP67 Plug, Push Pull Lock, Solder Pad, 28 to 18 AWG, Cable OD 0.138in to 0.252in, 3 Grommets Visit Amphenol Communications Solutions
    SF Impression Pixel

    SIL-PAD K10 Price and Stock

    The Bergquist Company SIL-PADK10 304X304 SHEET

    Thermally Conductive Insulator; Thermal Conductivity:1.3W/M.k; Conductive Material:Boron Nitride Filled Silicone Rubber; Thickness:0.152Mm; Thermal Impedance:0.86°C/W; Dielectric Strength:-; External Length:304Mm; Product Range:- Rohs Compliant: Yes |Bergquist SIL-PADK10 304X304 SHEET
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark SIL-PADK10 304X304 SHEET Bulk 10 1
    • 1 $105.53
    • 10 $95.92
    • 100 $85.79
    • 1000 $75.83
    • 10000 $75.83
    		Buy Now

    SIL-PAD K10 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    MIL-I-49456

    Abstract: SIL-PAD E59150 MIL-M-38527 SIL-PAD K10 MIL-M-38527C ASTM D412 for rubber MIL-M-87111 ASTM D412 D150
    Text: Sil-Pad K-10 ® The High Performance Kapton Based Insulator Features and Benefits • Thermal impedance 2 0.41°C-in /W @50 psi Typical Properties of Sil-Pad K-10 Property Imperial Value Metric Value Test Method Beige Beige Visual Color Reinforcement Carrier


    Original     		D2240 D1458 MIL-I-49456 SIL-PAD E59150 MIL-M-38527 SIL-PAD K10 MIL-M-38527C ASTM D412 for rubber MIL-M-87111 ASTM D412 D150 PDF

    SIL-PAD

    Abstract: D412 SIL-PAD K10 D1458 D149 D150 D2240 D257 D374 kapton film
    Text: Sil-Pad K-10 The High Performance Kapton®-Based Insulator Features and Benefits • Thermal impedance: 0.41°C-in2/W @50 psi • Tough dielectric barrier against cut-through • High performance film • Designed to replace ceramic insulators TYPICAL PROPERTIES OF SIL-PAD K-10


    Original     		D2240 D1458 SIL-PAD D412 SIL-PAD K10 D1458 D149 D150 D2240 D257 D374 kapton film PDF

    bergquist

    Abstract: SIL-PAD K10 ASTM D2240, D412 astm D150 ASTM D2240 ASTM D412 D412 D1458 D149 D150
    Text: Sil-Pad K-10 The High Performance Kapton®-Based Insulator Features and Benefits • Thermal impedance: 0.41°C-in2/W @50 psi • Tough dielectric barrier against cut-through • High performance film • Designed to replace ceramic insulators TYPICAL PROPERTIES OF SIL-PAD K-10


    Original     		D2240 D1458 bergquist SIL-PAD K10 ASTM D2240, D412 astm D150 ASTM D2240 ASTM D412 D412 D1458 D149 D150 PDF

    Untitled

    Abstract: No abstract text available
    Text: Sil-Pad K-10 The High Performance Kapton®-Based Insulator Features and Benefits • Thermal impedance: 0.41°C-in 2/W @50 psi • Tough dielectric barrier against cut-through • High performance film • Designed to replace ceramic insulators T YPICAL PROPERT IES OF SIL-PAD K-10


    Original     		D2240 D1458 PDF

    SP1750

    Abstract: SP1000 SP1950 SP400 SP2000 SP175
    Text: Choosing the right Sil-Pad Starts with the Mechanical and Electrical Properties MOUNTING TECHNIQUES MOUNTING PRESSURE AND Typical mounting techniques include: • A Spring clip, which exerts a centralized clamping force on the body of the transistor. The greater the mounting


    Original     		O-220, SP400 SP1000® SP2000® SPK-10® SP1750 SP1000 SP1950 SP2000 SP175 PDF

    TRANSISTOR REPLACEMENT GUIDE d882

    Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
    Text: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE


    Original     		PDF

    ALY 03

    Abstract: ALY 23 power generation POWER COMMAND HM 1211 TG Series 1037h MX12 MX23 PM4328 PM4388 PM6388
    Text: PM4328 TECT3 STANDARD PRODUCT DATASHEET ISSUE 1 HIGH DENSITY T1/E1 FRAMER AND M13 MULTIPLEXER 05 :32 :39 AM PMC-2011596 ,2 ay to nT ue sd TECT3 0A ug us t, 2 00 2 PM4328 DATASHEET Do wn loa de db ya hm ed me tw aly of sil ico ne xp er HIGH DENSITY T1/E1 FRAMER WITH


    Original     		PM4328 PMC-2011596 PM4328 PMC-2011596 PMC-2011465 ALY 03 ALY 23 power generation POWER COMMAND HM 1211 TG Series 1037h MX12 MX23 PM4388 PM6388 PDF

    SIL-PAD to-247

    Abstract: ASTM-A228 A228 T247 SIL-PAD K10 A366 C110 ASTM-A-366 TO220 HEATSINK Heatsinks TO247
    Text: WV Series Heatsinks For TO-220 and TO-247 devices T220 0.72" 18.3mm T247 0.92" (23.4mm) 0.63" (16.0mm) T220 1.20" (30.5mm) T247 1.20-1.26" (30.5-32.0mm) Ohmite Manufacturing has launched a series of heatsink solutions for use with our popular TO-220 and TO-247


    Original     		O-220 O-247 O-247 6063T5 900-S, 800-S, WV-T220-101E O-220 WV-T247-101E SIL-PAD to-247 ASTM-A228 A228 T247 SIL-PAD K10 A366 C110 ASTM-A-366 TO220 HEATSINK Heatsinks TO247 PDF

    chotherm 1674

    Abstract: P4855-1 TC-30AG 32-microinch TO3 SILICONE MICA SHEET torque for SELF TAPPING SCREW 87-HS-9 to225a SIL-PAD density Case 806-05
    Text: SECTION 7 MOUNTING TECHNIQUES FOR THYRISTORS Edited and Updated Figure 7.1 shows an example of doing nearly everything wrong. A tab mount TO-220 package is shown being used as a replacement for a TO-213AA TO-66 part which was socket mounted. To use the socket, the


    Original     		PDF

    1587H

    Abstract: sdh demapper 1035H-1037H 1037h 1250H 1488h MX12 MX23 PM5365 9811J
    Text: PM5365 TEMAP STANDARD PRODUCT DATASHEET ISSUE 3 HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER 11 :3 2: 49 PM PMC-1991148 ,1 1J an ua ry ,2 00 3 PM5365 to n Sa tu rd ay TEMAP DATA SHEET PROPRIETARY AND CONFIDENTIAL RELEASED ISSUE 3: SEPTEMBER 2001 Do wn lo


    Original     		PM5365 PMC-1991148 PM5365 1587H sdh demapper 1035H-1037H 1037h 1250H 1488h MX12 MX23 9811J PDF

    PM8353

    Abstract: ELLS 110 PM4354 PM7324 PM7326 PM7343 G.SHDSL LOOP modems UNI-IMA-32 paladin 172 411
    Text: 2: 06 PM S/UNI-IMA-16 Telecom Standard Product Data Sheet Released Su nd ay ,0 5J an S/UNI-IMA-16 ua ry ,2 00 3 11 :0 PM7343 sil ico ne xp er to n S/UNI INVERSE MULTIPLEXING FOR ATM, 16 LINKS PROPRIETARY AND CONFIDENTIAL RELEASED ISSUE 1: MAY 2002 Do wn lo


    Original     		S/UNI-IMA-16 S/UNI-IMA-16 PM7343 PMC-2020890, PM8353 ELLS 110 PM4354 PM7324 PM7326 PM7343 G.SHDSL LOOP modems UNI-IMA-32 paladin 172 411 PDF

    C2NC

    Abstract: 0x052B PM4332 TE-32 TR-TSY-000008 277-TE 407 0X090A 5SIL4 0x09c6
    Text: :35 PM TE-32 ASSP Telecom Standard Product Data Sheet Released t, 2 00 2 10 :54 PM4332 sd ay ,2 0A ug us TE-32 sil ico ne xp er to nT ue High Density 32 Channel T1/E1/J1 Framer Proprietary and Confidential Released Issue No. 5: June 2002 Do wn loa de db ya


    Original     		TE-32 PM4332 TE-32 PMC-2011402, 23x23mm C2NC 0x052B PM4332 TR-TSY-000008 277-TE 407 0X090A 5SIL4 0x09c6 PDF

    P4855-1

    Abstract: Ablestik Transistor Substitution 1993 2088AB belleville washer 33702 SIL-PAD density 208ab 2088a 814a
    Text: Order this document by AN1040/D MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1040 MOUNTING CONSIDERATIONS FOR POWER SEMICONDUCTORS Prepared by: Bill Roehr Staff Consultant, Motorola Semiconductor Sector TABLE OF CONTENTS Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


    Original     		AN1040/D AN1040 P4855-1 Ablestik Transistor Substitution 1993 2088AB belleville washer 33702 SIL-PAD density 208ab 2088a 814a PDF

    2088AB

    Abstract: TO-210AA Package motorola mhw 252 mhw 592 to220 torque for SELF TAPPING SCREW socket SELF TAPPING SCREW 4-40 Kapton Washer eb107 SIL-PAD density TO-210AB
    Text: MOTOROLA Freescale Semiconductor, Inc. Order this document by AN1040/D SEMICONDUCTOR APPLICATION NOTE AN1040 NOTE: The theory in this application note is still applicable, but some of the products referenced may be discontinued. Mounting Considerations for Power


    Original     		AN1040/D AN1040 2088AB TO-210AA Package motorola mhw 252 mhw 592 to220 torque for SELF TAPPING SCREW socket SELF TAPPING SCREW 4-40 Kapton Washer eb107 SIL-PAD density TO-210AB PDF

    WELTREND SEMICONDUCTORS

    Abstract: DIP-40 LQFP-48 SDIP-28 WT65F4 WT65F4-N28 WT65F4-N40 WT65F4-Q48 WT65F4-S28 homepage ups
    Text: Suites 2202-7, 22/F, Tower 6, The Gateway, 9 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel 852 2123 3289 Fax (852) 2123 3393 E-mail: sales@jesstech.com HomePage: http://www.jesstech.com WT65F4 USB µC with 8KB ISP Flash memory & 12bit ADC WT65F4 USB uC with 8KB ISP Flash Memory


    Original     		WT65F4 12bit 12-bit WELTREND SEMICONDUCTORS DIP-40 LQFP-48 SDIP-28 WT65F4 WT65F4-N28 WT65F4-N40 WT65F4-Q48 WT65F4-S28 homepage ups PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5675K Rev. 7, 5/2012 Qorivva MPC5675K Microcontroller Data Sheet 1 MPC5675K Introduction Document overview This document provides electrical specifications, pin assignments, and package diagrams for the Qorivva


    Original     		MPC5675K OT-343R MPC5675K 32-bit PDF

    LIDAR radar

    Abstract: MPC5675K mpc5675 MPC5673K e200z7d f5k5 Ultrasonic Transducer application notes MPC5674K 180MHZ-1 ultrasonic power generator with PLL
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5675K Rev. 7, 5/2012 Qorivva MPC5675K Microcontroller Data Sheet 1 MPC5675K Introduction Document overview This document provides electrical specifications, pin assignments, and package diagrams for the Qorivva


    Original     		MPC5675K MPC5675K QFN12 OT-343R 32-bit LIDAR radar mpc5675 MPC5673K e200z7d f5k5 Ultrasonic Transducer application notes MPC5674K 180MHZ-1 ultrasonic power generator with PLL PDF

    MPC5675K

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5675K Rev. 8, 10/2013 MPC5675K Qorivva MPC5675K Microcontroller Data Sheet 1 Introduction 1.1 Document overview Description The Qorivva MPC5675K microcontroller, a SafeAssure solution, is a 32-bit embedded controller designed for


    Original     		MPC5675K MPC5675K 32-bit MPC5500/5600 PDF

    ni usb 6212

    Abstract: SS-00259-1 C2060 C2055 C2068 quanta C2096 R2067 915GM SW1010CPT
    Text: 1 2 3 4 5 478 PIN micro FC-PGA 14, 15, 15w , 17w inch XGA, SXGA+ A LVDS LCD P7 P3,4 400/533 MHz A LVDS Alviso DVI M24/M26 UNBUFFERED DDRII SODIMM DDRII 400/533 P10 915GM/PM R/G/B CRT P9 R/G/B UNBUFFERED DDRII SODIMM DDRII 400/533 1257 PIN (micro FCBGA) PCIE 16Lanes


    Original     		M24/M26 915GM/PM 16Lanes 88E8053 ALC260 31x31mm) TI-TPA6011A4 33MHZ VT6212 11a/b/g ni usb 6212 SS-00259-1 C2060 C2055 C2068 quanta C2096 R2067 915GM SW1010CPT PDF

    K C2026 Y

    Abstract: VT6212 sony C2105 c2078 c2166 C2068 c2096 Marvell 88E8053 C2060 C2076
    Text: 1 2 3 4 5 478 PIN micro FC-PGA 14, 15, 15w , 17w inch XGA, SXGA+ A LVDS LCD P7 P3,4 400/533 MHz A LVDS Alviso DVI M24/M26 UNBUFFERED DDRII SODIMM DDRII 400/533 P10 915GM/PM R/G/B CRT P9 R/G/B UNBUFFERED DDRII SODIMM DDRII 400/533 1257 PIN (micro FCBGA) PCIE 16Lanes


    Original     		M24/M26 915GM/PM 16Lanes 88E8053 ALC260 31x31mm) TI-TPA6011A4 33MHZ VT6212 11a/b/g K C2026 Y VT6212 sony C2105 c2078 c2166 C2068 c2096 Marvell 88E8053 C2060 C2076 PDF

    ISL6259

    Abstract: transistor C3229 ISL6258AHRTZ transistor c6074 ISL9504BCRZ of transistor c2570 transistor c3300 c3228 transistor transistor c3150 c2570 transistor
    Text: 8 7 6 5 4 3 2 1. ALL RESISTANCE VALUES ARE IN OHMS, 0.1 WATT +/- 5%. 2. ALL CAPACITANCE VALUES ARE IN MICROFARADS. 3. ALL CRYSTALS & OSCILLATOR VALUES ARE IN HERTZ. 1 REV ECN DESCRIPTION OF REVISION C 0000813234 CK APPD DATE PRODUCTION RELEASED 2009-11-01


    Original     		PDF

    LPC47N354

    Abstract: BCM4401KQL quanta foxconn bm10 PR148 88sa8040 pq54 computer fan emc6n300
    Text: 1 2 DRAM Power 1.8V, 0.9V PG 43 DC/DC +3V_SRC +5VSUS A 3 6 7 TAHITI-INTEGRATED PG 44 Dothan AC/BATT CONNECTOR PG 47 BATT SELECTOR PG 40 BATT CHARGER PG 41 SYSTEM RESET CKT CLOCKS 478 Micro-FCPGA PG 15 PG 39 PG 3,4 Panel Connector PG 46 PG 17 4X133MHZ LVDS


    Original     		4X133MHZ SI1362 33MHz 88SA8040 19PBAT BAT54 100K/F BLM11B102S FDS4435 15K/F LPC47N354 BCM4401KQL quanta foxconn bm10 PR148 pq54 computer fan emc6n300 PDF

    2088AB

    Abstract: mhw 592 TC-30AG AN778 ierc heatsink RF 433 RR3 RF Power Modules 814a Aham-Tor SIL 1030
    Text: Order this document MOTOROLA m by AN1040/D SEMICONDUCTOR h m m b APPLICATION NOTE A N 1040 M ounting Considerations fo r Power Semiconductors Prepared by Bill Roehr Staff Consultant, Motorola Semiconductor Sector TABLE OF CONTENTS In tro d u c tio n .


    OCR Scan     		AN1040/D MK145BP, RR3-20 2088AB mhw 592 TC-30AG AN778 ierc heatsink RF 433 RR3 RF Power Modules 814a Aham-Tor SIL 1030 PDF