Untitled
Abstract: No abstract text available
Text: AIC111 www.ti.com SLAS382A – JUNE 2003 – REVISED NOVEMBER 2005 IC DESIGN SPECIFICATION 1.3-V microPower DSP/ C VOICE BAND AUDIO CODEC Check for Samples: AIC111 FEATURES – - 32-Pin QFN 5x5-mm Plastic Package – - 32-Pad Bumped Die in Waffle Pack wafer
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Original
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AIC111
SLAS382A
32-Pin
32-Pad
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PDF
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hearing aid integrated circuits
Abstract: 2808990 circuit diagram of hearing aid using transistors
Text: AIC111 www.ti.com SLAS382A – JUNE 2003 – REVISED NOVEMBER 2005 IC DESIGN SPECIFICATION 1.3-V microPower DSP/ C VOICE BAND AUDIO CODEC Check for Samples: AIC111 FEATURES – - 32-Pin QFN 5x5-mm Plastic Package – - 32-Pad Bumped Die in Waffle Pack wafer
|
Original
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AIC111
SLAS382A
108-dB
87-dB
73-dB
40kHz
55-dB
hearing aid integrated circuits
2808990
circuit diagram of hearing aid using transistors
|
PDF
|
Untitled
Abstract: No abstract text available
Text: AIC111 www.ti.com SLAS382A – JUNE 2003 – REVISED NOVEMBER 2005 IC DESIGN SPECIFICATION 1.3-V microPower DSP/ C VOICE BAND AUDIO CODEC Check for Samples: AIC111 FEATURES – - 32-Pin QFN 5x5-mm Plastic Package – - 32-Pad Bumped Die in Waffle Pack wafer
|
Original
|
AIC111
SLAS382A
108-dB
87-dB
73-dB
40kHz
55-dB
|
PDF
|
Untitled
Abstract: No abstract text available
Text: AIC111 www.ti.com SLAS382A – JUNE 2003 – REVISED NOVEMBER 2005 IC DESIGN SPECIFICATION 1.3-V microPower DSP/ C VOICE BAND AUDIO CODEC Check for Samples: AIC111 FEATURES – - 32-Pin QFN 5x5-mm Plastic Package – - 32-Pad Bumped Die in Waffle Pack wafer
|
Original
|
AIC111
SLAS382A
32-Pin
32-Pad
|
PDF
|
2808990
Abstract: microphone tube
Text: AIC111 www.ti.com SLAS382A − JUNE 2003 − REVISED JANUARY 2006 IC DESIGN SPECIFICATION 1.3ĆV microPower DSP/µC VOICE BAND AUDIO CODEC FEATURES D Single Channel Codec D Noise Shaped Delta Sigma ADC and DAC D D D Technology Low Supply Voltage and Current:
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Original
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AIC111
SLAS382A
108-dB
40-kHz
55-dB
2808990
microphone tube
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PDF
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