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    led flashlight

    Abstract: sm power3 SGOLD3
    Text: Pr oduc t Br ief P M B 6 821 SM -Power3 - Highly Integrated Power Ma nagement Units fo r Feature Rich Mobile De vi ces S M - P O W E R 3 extends the SM-Power family with a new highly integrated power management IC. It is optimized to support mobile devices


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    PDF B134-H8836-X-X-7600 led flashlight sm power3 SGOLD3

    Untitled

    Abstract: No abstract text available
    Text: Master Catalog EL9020 Series Hardened 10/100/1000BASE-TX to Gigabit SFP Media Converter ITS Wide Temp Value UL508 SFP socket lexible for Gigabit iber optic expansion Harsh environment design and supports auto 10/100/1000BASE-T Ethernet transmission Speciic design for industrial communication applications with


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    PDF EL9020 10/100/1000BASE-TX UL508 10/100/1000BASE-T UL508 IEC61000-6-2 1000Mbps-Full-duplex, ISO9001 48VDC 100pps

    UV 111A

    Abstract: heidenhain power supply manual HEIDENHAIN HEIDENHAIN EnDat 2.1 rod+323+heidenhain
    Text: Inverter Systems for HEIDENHAIN Controls Information for the Machine Tool Builder January 2015 HEIDENHAIN inverter systems The inverter systems from HEIDENHAIN are suitable for the HEIDENHAIN controls with digital speed control. They are designed for operating the synchronous and asynchronous


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    PDF 040-A, UV 111A heidenhain power supply manual HEIDENHAIN HEIDENHAIN EnDat 2.1 rod+323+heidenhain

    Untitled

    Abstract: No abstract text available
    Text: 10/100/1000Base-TX to Gigabit SFP Hardened Media Converter EIR-G-SFP-T PRODUCT FEATURES • • • • • • • • • • • • The EIR-G-SFP-T, Gigabit Ethernet media converters are designed to operate in harsh environments. The EIR-G-SFP-T functions at


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    PDF 10/100/1000Base-TX 1000Base RJ-45 150KHz, IEC60068-2-27 IEC60068-2-32 281ft.

    Untitled

    Abstract: No abstract text available
    Text: Agilent 83433A 10 Gb/s Lightwave Transmitter Agilent 83434A 10 Gb/s Lightwave Receiver Product Overview 83433A 83434A • Excellent 10 Gb/s and 2.5 Gb/s optical waveforms • Modulate at data rates from 2.4 to 10.7 Gb/s • Generates STM-64/OC-192 and STM-16/OC-48 compliant eye


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    PDF 3433A 3434A STM-64/OC-192 STM-16/OC-48 3434A-106, 3434A-H31 5968-9251E

    MCP79MXT-B3

    Abstract: ISL6258A ti c3931 u9701 rtl8211* Reference design L6703 C3931 88E1116R FW643E CS4206A
    Text: 8 6 7 2 3 4 5 1 CK APPD 1. ALL RESISTANCE VALUES ARE IN OHMS, 0.1 WATT +/- 5%. 2. ALL CAPACITANCE VALUES ARE IN MICROFARADS. 3. ALL CRYSTALS & OSCILLATOR VALUES ARE IN HERTZ. REV SCHEM,CORNHOLE,K19 ZONE ECN ENG APPD DESCRIPTION OF CHANGE DATE ? ? ? ? DATE


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    PDF ISL10 ISL11 MCP79MXT-B3 ISL6258A ti c3931 u9701 rtl8211* Reference design L6703 C3931 88E1116R FW643E CS4206A

    Untitled

    Abstract: No abstract text available
    Text: FDMC7200S Dual N-Channel PowerTrench MOSFETs 30 V, 22 mΩ, 10 mΩ Features General Description Q1: N-Channel Q2: N-Channel This device includes two specialized N-Channel MOSFETs in a dual power33 3mm X 3mm MLP package. The switch node has been internally connected to enable easy placement and routing


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    PDF FDMC7200S power33

    SOT500AA1

    Abstract: MOA2 IC 4822 S3001 CA94088-3409 ICS3001 R1211
    Text: CHIP CARD MODULES ADDENDUM SL1 MOA2 S30 Contactless Chip Card Module Specification Product Specification Revision 1.0 PUBLIC Philips Semiconductors July 2001 Contents Rev. 1.0 2001-07-13 Contents 1 General


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    PDF SCB52 SOT500AA1 MOA2 IC 4822 S3001 CA94088-3409 ICS3001 R1211

    lad1 12vdc

    Abstract: 26L531 sil 1162 pal 011 A SPEAKER OUTPUT IC 3000V diode sdm lf-h80p KI 2222A VT6301S PCT303a W83L950
    Text: SERVICE MANUAL FOR 8011 BY: Ally Yuan Repair Technology Research Department /EDVD Oct.2004 8011 N/B Maintenance Contents 1. Hardware Engineering Specification ………………………………………………………………… 1.1 1.2 1.3 1.4 1.5 1.6


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    PDF JO501 ESD41A/NA 7535S-15G2T-05 SYN7535S 33P/NA 316685400004/ASSY lad1 12vdc 26L531 sil 1162 pal 011 A SPEAKER OUTPUT IC 3000V diode sdm lf-h80p KI 2222A VT6301S PCT303a W83L950

    Untitled

    Abstract: No abstract text available
    Text: FDMC8360L N-Channel Shielded Gate Power Trench MOSFET 40 V, 80 A, 2.1 mΩ Features General Description „ Shielded Gate MOSFET Technology This N-Channel MOSFET is produced using Fairchild Semiconductor’s advanced PowerTrench® process that incorporates Shielded Gate technology. This process has been


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    PDF FDMC8360L

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    Abstract: No abstract text available
    Text: FDMC8321L N-Channel Power Trench MOSFET 40 V, 49 A, 2.5 mΩ Features General Description „ Max rDS on = 2.5 mΩ at VGS = 10 V, ID = 22 A This N-Channel MOSFET has been designed specifically to improve the overall efficiency and to minimize switch node


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    PDF FDMC8321L FDMC8321L

    Untitled

    Abstract: No abstract text available
    Text: FDMC8321L N-Channel Power Trench MOSFET 40 V, 49 A, 2.5 mΩ Features General Description ̈ Max rDS on = 2.5 mΩ at VGS = 10 V, ID = 22 A This N-Channel MOSFET has been designed specifically to improve the overall efficiency and to minimize switch node


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    PDF FDMC8321L

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    Abstract: No abstract text available
    Text: FDMC86570L N-Channel Shielded Gate PowerTrench MOSFET 60 V, 56 A, 4.3 mΩ Features „ Shielded Gate MOSFET Technology General Description „ Max rDS on = 4.3 mΩ at VGS = 10 V, ID = 18 A „ Termination is Lead-free This N-Channel MOSFET is produced using Fairchild


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    PDF FDMC86570L

    Untitled

    Abstract: No abstract text available
    Text: FDMC8360L N-Channel Power Trench MOSFET 40 V, 80 A, 2.1 mΩ Features General Description „ Max rDS on = 2.1 mΩ at VGS = 10 V, ID = 27 A This N-Channel MOSFET is produced using Fairchild Semiconductor’s advanced Power Trench® process that has been especially tailored to minimize the on-state resistance and


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    PDF FDMC8360L

    oz9910

    Abstract: 8258I li-ion 11.1v intel 945 motherboard schematic diagram lg r40 MOTHERBOARD CIRCUIT diagram 8258D mitac bios 8258i intel 945 ich7 family motherboard ICS9lpr310 schematic intel chipset 945 motherboard
    Text: SERVICE MANUAL FOR 8258I BY: Sanny Gao Technical Maintenance Department /GTK MTC Jun.2006 / R01 8258I N/B Maintenance Contents 1. Hardware Engineering Specification …………………………………………………………………… 4 1.1 Introduction …………………………………………………………………………………………………………….


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    PDF 8258I 8258I F041-SINGLE 945GM W83L951G oz9910 li-ion 11.1v intel 945 motherboard schematic diagram lg r40 MOTHERBOARD CIRCUIT diagram 8258D mitac bios 8258i intel 945 ich7 family motherboard ICS9lpr310 schematic intel chipset 945 motherboard

    rtm875t-606

    Abstract: G546B2 SCK 054 VARISTOR G546B2 MOSFET realtek rts5158 VARISTOR SCK 058 varistor sck 083 NS892405 intel G41 MOTHERBOARD crb SCK VARISTOR 083
    Text: 5 4 3 2 1 MA8 BLOCK DIAGRAM X'TAL 14.318MHz CPU Yonah/Merom D CPU THERMAL SENSOR +3.3V 479 Micro-FCPGA PG 3 +1.5V +1.05V_VCCP +VCC_CORE CPU CLK_ 200MHz CLOCK GEN GMCH CLK_ 200MHz DREFCLK_96MHz ICS9LPRS365/RTM875T-606 64pins PCIE MCH CLK_100MHz +3.3V PG 2


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    PDF 318MHz 200MHz 96MHz 100MHz ICS9LPRS365/RTM875T-606 64pins ISL6260C ISL6208 05VCCP rtm875t-606 G546B2 SCK 054 VARISTOR G546B2 MOSFET realtek rts5158 VARISTOR SCK 058 varistor sck 083 NS892405 intel G41 MOTHERBOARD crb SCK VARISTOR 083

    varian klystron

    Abstract: varian reflex klystron klystron applications for two cavity klystron 4X150G reflex klystron varian two cavity klystron s band klystron reflex klystron klystron television
    Text: TENTATIVE DATA 3K20,000LA 3K20,000LF 3K20.000LK E I T E L - M c C U L L O U G H , I nc KLYSTRO N S SAN BRUNO, • CALIFORNIA L -B A N O A M P L I F IE R S The E im a c 3 K 2 0 . 0 0 0 L A , 3 K 2 0 . 0 0 0 L F a nd 3 K 2 0 . 0 0 0 L K klystro ns are three


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    PDF 000LA 000LF 000LK 000LA, 000LK 00ted varian klystron varian reflex klystron klystron applications for two cavity klystron 4X150G reflex klystron varian two cavity klystron s band klystron reflex klystron klystron television

    TRANSISTOR ST25A

    Abstract: ST25A transistor intel 4362 al microprocessor superset system design Pentium II Xeon BUT13 wintel ST25A
    Text: PENTIUM II XEON PROCESSOR AT 400 AND 450 MHZ • Binary compatible with applications running on previous members of the Intel microprocessor family ■ Optimized for 32-bit applications running on advanced 32-bit operating systems ■ Dynamic Execution micro architecture


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    PDF 32-bit TRANSISTOR ST25A ST25A transistor intel 4362 al microprocessor superset system design Pentium II Xeon BUT13 wintel ST25A

    a114 os hen nec

    Abstract: apic S15 b154 sam la 8155 intel microcontroller architecture transistor b143 e.s A15-3P a45 dc he nne Pentium II Xeon DIODE 8137 DB83
    Text: PENTIUM II XEON PROCESSOR AT 400 MHZ • Binary compatible with applications running on previous members of the Intel microprocessor family ■ Single Edge Contact S.E.C. cartridge packaging technology; the S.E.C. cartridge delivers high performance


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    PDF 32-bit a114 os hen nec apic S15 b154 sam la 8155 intel microcontroller architecture transistor b143 e.s A15-3P a45 dc he nne Pentium II Xeon DIODE 8137 DB83

    AMD K6

    Abstract: No abstract text available
    Text: Preliminary Information AMDB AMD-K6-2E Embedded Processor Data Sheet Publication # 22529 Issue Date: Jan 2000 Rev: B Amendment/0 2000 Advanced Micro Devices, Inc. All rights reserved. T h e c o n te n ts of th is d o c u m e n t a r e p ro v id e d in co n n e c tio n w ith A d v a n c e d M icro


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    PDF AMD-K6-2E/350AFR 321-pin AMD-K6-2E/333AFR AMD-K6-2E/300AFR AMD-K6-2E/266AFR AMD-K6-2E/233AFR AMD K6

    100MAS

    Abstract: No abstract text available
    Text: Catalog 1 3 0 7 5 1 5 Issued 9-99 M T -R J Transceivers Continued Ethernet, Token Ring, Fast Ethernet 10 Mb/s Multimode MT-RJ Transmitter/Receiver Module Product Facts • Surface mount compatible ■ Industry standard MT-RJ interface ■ Smallest optical duplex


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    PDF 850nm 10BASE-FL) 100BASE-SX) 10BASE-FL 100MAS

    Untitled

    Abstract: No abstract text available
    Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MGS1100 MGS1100 Carbon Monoxide Gas Sensor The Motorola MGS1100 carbon m onoxide CO sensor features a gas sensitive, thin film m e tal-oxid e layer over an em bedded m icro-heater, see Figure 1. The heater is used to raise the tem perature of the film to enhance its sensitivity to CO. This structure is


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    PDF MGS1100 MGS1100 90CNOM.

    W22C

    Abstract: S12301DS 5133S stp520 t12m256 T12M256A-12J UPC507 MITAC PC515 GP014
    Text: MODEL : 5133S Revision 02A Table of Contents page 1 Cover Sheet Block Diagram 2 Central Processor Unit 3 North Bridge Part A & PBSRAM/TAG RAM 4 North Bridge Part B 5 System Memory 6 South Bridge 7 PCMCIA Controller & Socket 8 Audio Codec & Amplifier 9 Enhance IDE & FDD Connector


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    PDF 5133S VT82C686A 1000P 2N7002 2N7002 MLL34B SCK431CSK-1 OT23N W22C S12301DS stp520 t12m256 T12M256A-12J UPC507 MITAC PC515 GP014

    Untitled

    Abstract: No abstract text available
    Text: AMDÎ1 AMD-K6 E High-Performance, AMD-K6 Embedded Processor DISTINCTIVE CHARACTERISTICS • Advanced 6-Issue RISC86 Superscalar Microarchitecture - Seven parallel specialized execution units ■ Large On-Chip Split 64-Kbyte Level-One L1 Cache - 32-Kbyte instruction cache with additional


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    PDF RISC86Â 64-Kbyte 32-Kbyte x86-to-RISC86Â RISC86 754-Compatible 854-Compatible