smema
Abstract: STR22 smema wiring smema control technical of tamura solder paste Cu6Sn5 telcon Schloetter NASA Group TND311
Text: TND311 Tin Whisker Info “Brief” http://onsemi.com APPLICATION NOTE Tin whiskers are a potential concern with high-tin Sn content lead finishes (this includes alloys such as SnBi, and SnCu). SnPb alloys introduced in the 1950's have been the most successful in controlling whiskers. It is widely
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TND311
TND311/D
smema
STR22
smema wiring
smema control
technical of tamura solder paste
Cu6Sn5
telcon
Schloetter
NASA Group
TND311
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tyco mep 6t
Abstract: bmep 5t ASG TYCO BMEP-5T
Text: AMPMODU Interconnection System Application Tooling for AMPMODU Headers with ACTION PIN Posts ACTION PIN Post Replacement Tooling Single-Row Connector Seating Tools Tooling Assembly No. 91171-1 is used to install single-row AMPMODU headers with ACTION PIN posts into
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smema
Abstract: smema control STR223 smema wiring electronics nasa smema specifications Phoenix contact subcon 9 connector tamura solder paste tamura tin lead solder paste Telcon
Text: TND311 Tin Whisker Info Brief" http://onsemi.com APPLICATION NOTE acceleration test with quantified acceleration factors is unknown. This is complicated further by the highly variable “incubation” period during which stress builds before whiskers grow. However, ON has completed testing using
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TND311
TND311/D
smema
smema control
STR223
smema wiring
electronics nasa
smema specifications
Phoenix contact subcon 9 connector
tamura solder paste
tamura tin lead solder paste
Telcon
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Untitled
Abstract: No abstract text available
Text: VT-RBT SOLDER PASTE INSPECTION SYSTEM Omron’s VT-Rabbit stops defective boards before they multiply Integrate the VT-Rabbit into your PCB production process for an accurate, high-speed solder paste inspection solution. This small 35 inch footprint device operates at production
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advanc64
9/00/10M
50/60Hz,
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smema specifications
Abstract: smema AN038 smema control EAN-102068
Text: DESIGN APPLICATI0N NOTE - AN038 Solder Reflow Recommendations Sn/Pb and Pb Free for Plastic RFICs Overview The stages used in a solder profile We are often asked what the solder reflow profile should be for SMDI devices mounted on PCB’s using high volume production equipment. The reflow profile is
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AN038
10oC/second.
EAN-102068
AN-038
smema specifications
smema
AN038
smema control
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component data
Abstract: smema smema specifications automatic room light control with program QFP lead pitch 0.3mm Ricoh 2205 ups 3KVA boards
Text: VT-WIN PRINTED CIRCUIT BOARD INSPECTION SYSTEM Fully Automated And Integrated High-Speed, In-Line PCB Inspection and Verification System The increasing density and quality requirements of PCBs and intense manufacturing competition leave little room for error.To stay ahead of competition, maximize your resources
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component data
smema
smema specifications
automatic room light control with program
QFP lead pitch 0.3mm
Ricoh 2205
ups 3KVA boards
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Untitled
Abstract: No abstract text available
Text: XStation MX Automated X-Ray Inspection System Revolutionary multi-angle X-ray solution provides maximum coverage, throughput, and reliability using ClearVue™ and TraX™ technologies KEY FEATURES • Multi-angle X-ray inspection designed for: high-complexity PCBs, high-product
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smema
Abstract: smema control 500VA 5830 smema specifications
Text: 5830+ In-line On-board Programmer Key features Memory device types • Program up to 30 like devices in parallel • FLASH • Program unique or generic data • EEPROM • Erase, program and verify the data • MCU • Parallel programming of various devices types
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600mm
900mm
smema
smema control
500VA
5830
smema specifications
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AMPOMATOR CLS IV
Abstract: faston flag receptacles crimp height 59824-1 Tyco Amp hand tool faston flag receptacles crimp height smema AMP UK 45 faston 110 board mount tabs Crimping micro applicator crimp force smema control
Text: FASTON Terminals Insulated and Uninsulated Page Head_12 Application Tooling Hel. Con. Bold (Continued)_9pt Helvetica Lt Condensed AMP-O-LECTRIC Model “G” Termination Machines A totally new design of our most popular machine for bench-top operation. It features a quiet and
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wireless motor speed control by rf
Abstract: smema GPIB/USB DSASW0010279 gpib rohwedder smema specifications
Text: 5830+ In-line Multi-Combinational Tester Key features Test capability • • ICT: In-Circuit Test Up to 3060 in-circuit test points, or • FCT: Functional Circuit Test Up to 1024 functional test points, or • FUT: Functional Unit Test Up to 19, 3U PXI cards
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Cannon connectors
Abstract: smema smema specifications 8002 amplifier A-100 F-100 smema control
Text: ATE 4200 Series Advanced Manufacturing Test Systems A range of advanced manufacturing test systems offering a wide range of test methods and high throughput capability. • Maximum of 2048 pins Architecture • Windows 95 or NT operating system • Automatic program generation software
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peltier schematic
Abstract: peltier cooler schematic smema temperature controller peltier Sn37wt electronic schematic IMECE2004-62297
Text: Proceedings of IMECE2004 2004 ASME International Mechanical Engineering Congress and RD&D Expo November 13-19, 2004, Anaheim, California USA IMECE2004-62297 Simulated Power Cycling for Rapid Reliability Assessment of Pb-Free Packages K. Setty1, G. Subbarayan1, L. Nguyen2, D. Love3 and R. Sullivan4
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IMECE2004-62297
peltier schematic
peltier cooler schematic
smema
temperature controller peltier
Sn37wt
electronic schematic
IMECE2004-62297
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C18070
Abstract: C1807 smema C70250 FeNi42 Cu6Sn5 CuCrSiTi Infineon diffusion solder C19400 C1441
Text: Tin Whisker Formation – Results, Test Methods and Countermeasures Dittes, M*.; Oberndorff, P*.; Petit, L.* *Infineon Technologies, * Philips CFT, * STMicroelectronics marc.dittes@infineon.com pascal.oberndorff@philips.com luc.petit@st.com Abstract
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Cu6Sn5
Abstract: FeNi42 Infineon diffusion solder smema smema specifications transistor k81 leadframe materials olin 7025
Text: Tin Whisker Formation – Results, Test Methods and Countermeasures Dittes, M*.; Oberndorff, P*.; Petit, L.* *Infineon Technologies, * Philips CFT, * STMicroelectronics Abstract Electroplated tin layers as used as lead-free solderable finish on the terminations of semiconductor devices are
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ablebond 8380
Abstract: land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING
Text: CHAPTER 12 ADVANCED PACKAGE APPLICATIONS TAPE CARRIER PACKAGE INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized
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J-STD-001
ablebond 8380
land pattern PQFP 132
smema
Ablestik 8380
ablestik ablebond
shoulder angle foot length lead solder joint reliability
nozzle heater
gold embrittlement
Ablebond
cut template DRAWING
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smema
Abstract: land pattern for TSOP ultrasonic bond tensile-strength soft solder die bonding IPC-SM-780 TO metal package aluminum kovar dual beam laser land pattern for SOP material composition of chip capacitors
Text: CHAPTER 13 GLOSSARY A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.
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Ablebond 8380
Abstract: X3304 ablestik ablebond Ablestik 8380 A5700 shoulder angle foot length lead solder joint reliability smema control IPC-SM-780 tms 3615 A5716
Text: Advanced Package Applications: Tape Carrier Package 12.1 12 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is
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Ablebond 8380
X3304
ablestik ablebond
Ablestik 8380
A5700
shoulder angle foot length lead solder joint reliability
smema control
IPC-SM-780
tms 3615
A5716
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Ablebond 8380
Abstract: A5700 Ablestik 8380 smema nozzle heater shoulder angle foot length lead solder joint reliability tms 3615 A5716 A5707-01 alpha Resistors slide
Text: 12 Tape Carrier Package 12.1 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized products. These
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IPC-SM-780
Abstract: No abstract text available
Text: 2 Glossary 1/17/97 11:08 AM GLOSSARY.DOC INTEL CONFIDENTIAL until publication date 2 GLOSSARY A Access hole: A hole or series of holes in successive layers of a multilayer board that provide(s) access to the surface of the land in one or more layers of the board.
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CERAMIC PIN GRID ARRAY wire lead frame
Abstract: IPC-SM-780 nickel corrosion electroplating
Text: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.
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CERAMIC PIN GRID ARRAY wire lead frame
IPC-SM-780
nickel corrosion electroplating
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IPC-SM-780
Abstract: No abstract text available
Text: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.
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peltier element schematic
Abstract: peltier cooler schematic peltier schematic pitarresi IC SEM 2005 smema A356 Theory of Modern Electronic Semiconductor Device
Text: Powercycling Reliability, Failure Analysis and Acceleration Factors of Pb-free Solder Joints Kaushik Setty1, Ganesh Subbarayan1 and Luu Nguyen2 School of Mechanical Engineering, Purdue University, W. Lafayette, IN 47907-2088 2 National Semiconductor Corporation, Santa Clara, CA 95051
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Lead-Free
Abstract: SZZA037A smema wiring smema specifications DAY20 1600X
Text: Application Report SZZA037A - February 2003 Whisker Evaluation of Tin-Plated Logic Component Leads Douglas W. Romm, Donald C. Abbott, Stu Grenney, and Muhammad Khan Logic Packaging ABSTRACT Integrated circuits ICs with matte tin (Sn) finished leads for logic products were tested for
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Lead-Free
smema wiring
smema specifications
DAY20
1600X
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Untitled
Abstract: No abstract text available
Text: AUTOMATED INSERTION SYSTEMS; IN-LINE C N C AC-118 IN-LINE SYSTEM jS CONTINUOUS FEED TERMINAL REEL MACHINE STATUS LIGHT USER INTERFACE LIGHT SENSOR MACHINE STOP PASS THROUGH CONVEY! USER KEYBOARD SAFETY / SOUND PULL-OUT CONTROLLER TRAY ENCLOSURE A C - 118 & A C -218 Systems
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AC-118
AC-218
CC-116
CC-218
CC-112
CC-212
760mm
230lbs.
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