Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SMT PROCESS ROADMAP Search Results

    SMT PROCESS ROADMAP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMP89FS60AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP64-P-1010-0.50E Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP52-P-1010-0.65 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS60BFG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP64-1414-0.80-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63BUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP52-1010-0.65-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS62AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP44-P-1010-0.80A Visit Toshiba Electronic Devices & Storage Corporation

    SMT PROCESS ROADMAP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    INTEL application notes

    Abstract: land pattern BGA 0.75 PCB design for very fine pitch csp package land pattern for TSOP 2 1mm pitch BGA socket land pattern for TSOP BGA reflow guide pcb thermal Design guide trace theta layout micro pitch BGA socket s1 SOLDER PROFILE
    Text: 5.0 5.1 5.2.1 MANUFACTURING CONSIDERATIONS SMT Process Many factors contribute to a high yielding assembly process. A few of the key focus areas and their contributing factors are highlighted in Table 7. 5.2 PCB Design Guidelines One of the key efforts in implementing the


    Original     		PDF

    Sn62Pb36Ag2

    Abstract: Boards for assembly with 100OHM impedance erni 32 pins connector 68 pin high density flat connector Z-PACK DIN 1.5mm header connector SMT roadmap
    Text: DesignCon 2005 ERNI MicroSpeed, the Revolution in Mezzanine Connection Andreas Scheck, President & CEO, ERNI Electronics, Inc. Abstract For many reasons, today’s electronic systems are being built in three rather than two dimensions. As such, inter-board connectors – “mezzanine connectors” – play an


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Section 2: Niobium Oxide Capacitors* OxiCap NOJ Series and NOS Series DEVELOPMENT ROADMAP Released Low ESR Development NOS Low ESR, 125°C Released Specification and Matrix Development NOJ Generic Purpose 105°C Capacitors Under Development High CV Range Extension


    Original     		PDF 100kHz NOSC107M004 NOSC157M004 NOSD227M004 NOSD337M004 NOSE477M004 NOSD107M006

    capacitor esr 100khz

    Abstract: No abstract text available
    Text: Section 2: Niobium Oxide Capacitors* OxiCap NOJ Series and NOS Series DEVELOPMENT ROADMAP Released Low ESR Development NOS Low ESR, 125°C Released Specification and Matrix Development NOJ Generic Purpose 105°C Capacitors Under Development High CV Range Extension


    Original     		PDF 100kHz capacitor esr 100khz

    Untitled

    Abstract: No abstract text available
    Text: Section 2: Niobium Oxide Capacitors* OxiCap NOJ Series and NOS Series DEVELOPMENT ROADMAP Released Low ESR Development NOS Low ESR, 125°C Released Specification and Matrix Development NOJ Generic Purpose 105°C Capacitors Under Development High CV Range Extension


    Original     		PDF 100kHz NOSC107M004 NOSC157M004 NOSD227M004 NOSD337M004 NOSE477M004 NOSD107M006

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    Fuse m1 250C

    Abstract: SIEMENS b43471 B43991 SIEMENS b43405 B43876 B43875 m1 250c fuse B41684 epcos B43991 B43405
    Text: Microwave Ceramics and Modules RF LTCC Filter for ISM 2.4 GHz Filter B69893K2457C101 Preliminary datasheet Features • Low Profile maximum height 0.9 mm Change History Revision Detail of change P1 First release Date 09.06.06 Author Stadler Contents Page 2


    Original     		PDF B69893K2457C101 2002/95/EC 2005/747/EC Fuse m1 250C SIEMENS b43471 B43991 SIEMENS b43405 B43876 B43875 m1 250c fuse B41684 epcos B43991 B43405

    B43875

    Abstract: B43991 epcos B43991 EPCOS Sikorel B41684 B43876 B43405 B41684 SIEMENS b43405 B43471 Epcos B41684
    Text: SAW Components SAW filter TD-SCDMA Series/type: Ordering code: B7853 B39202B7853C710 Date: Version: September 28, 2006 2.2  EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS’ prior express consent is prohibited.


    Original     		PDF B7853 B39202B7853C710 LK39B. C61157-A8-A3 LK39A. B43875 B43991 epcos B43991 EPCOS Sikorel B41684 B43876 B43405 B41684 SIEMENS b43405 B43471 Epcos B41684

    B43875

    Abstract: B43876 SIEMENS b43471 SIEMENS b43405 epcos B43991 B41684 Epcos sikorel b41684 E70 ferrite core DDS2004 E16* transformer
    Text: SAW Components SAW Rx filter WCDMA band I Series/type: Ordering code: LK39B Date: Version: Sep. 26, 2006 1.1  EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS’ prior express consent is prohibited.


    Original     		PDF LK39B LK39B. C61157-A8-A3 B39202B7853C710 LK39A. B43875 B43876 SIEMENS b43471 SIEMENS b43405 epcos B43991 B41684 Epcos sikorel b41684 E70 ferrite core DDS2004 E16* transformer

    JAE MX34

    Abstract: SMT pitch roadmap CONNECTOR jae 50 SMT roadmap JAE ffc JAE CONNECTORS FPC 0.6mm pitch MX23A MX34 TX20A
    Text: JAE Product guide 15/11/05 1:43 pm Page 3 CONNECTOR PRODUCT GUIDE JAE Product guide 15/11/05 1:43 pm Page 4 Board to Board SERIES AA01A No of contacts 10,30,40,60 Pitch 0.5mm Current Rating 0.2 amp PCB Mounting Method SMT Operating Temp -40 +85 degrees Reeled


    Original     		PDF AA01A KX14/KX15 TX24/TX25 LOGO05/2 JAE MX34 SMT pitch roadmap CONNECTOR jae 50 SMT roadmap JAE ffc JAE CONNECTORS FPC 0.6mm pitch MX23A MX34 TX20A

    B43875

    Abstract: SIEMENS b43405 B43406 B41684 epcos B43991 B43991 B43876 Epcos sikorel b41684 DDS2004 B43405
    Text: SAW Components SAW filter MediaFLO Series/type: Ordering code: LR24A Date: Version: June 19, 2006 1.0  EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS’ prior express consent is prohibited.


    Original     		PDF LR24A 2002/95/EC 2005/747/EC B43875 SIEMENS b43405 B43406 B41684 epcos B43991 B43991 B43876 Epcos sikorel b41684 DDS2004 B43405

    Untitled

    Abstract: No abstract text available
    Text: Section 2: Niobium Oxide Capacitors* OxiCap NOJ Series and NOS Series DEVELOPMENT ROADMAP Released Low ESR Development NOS Low ESR, 125°C Released Specification and Matrix Development NOJ Generic Purpose 105°C Capacitors Under Development High CV Range Extension


    Original     		PDF NOJA156 NOJB226 NOJB336 NOJC476 NOJC686 NOJC107 NOJC157 NOJD227 NOJD337 NOJE477

    Untitled

    Abstract: No abstract text available
    Text: Section 2: Niobium Oxide Capacitors* OxiCap NOJ Series and NOS Series DEVELOPMENT ROADMAP Released Low ESR Development NOS Low ESR, 125°C Released Specification and Matrix Development NOJ Generic Purpose 105°C Capacitors Under Development High CV Range Extension


    Original     		PDF NOJE477M004# NOJV687M004# NOJA106M006# NOJB156M006# NOJB226M006# NOJB336M006# NOJC336M006# NOJC476M006# NOJC686M006# NOJD107M006#

    capacitor date codes

    Abstract: marking codes 93 Multi-Turn Potentiometers bi marking SMD CODES BCN31 HM80 P232 P270 smd marking codes SMD resistors codes
    Text: BI Technologies RoHS compliance roadmap Compliance herein is the same as Pb-free and indicates meeting E.U. RoHS legislation Directive 2002/95/EC and revisions to date . Pb in Cu (brass), steel, and Al are assumed exemptions (not listed). If P/N is changing, compliant date code indicates compliant production date not shipment date (due to non-compliant inventory)


    Original     		PDF 2002/95/EC EC/2002/95/EC) capacitor date codes marking codes 93 Multi-Turn Potentiometers bi marking SMD CODES BCN31 HM80 P232 P270 smd marking codes SMD resistors codes

    MezzSelect

    Abstract: FCI Connector interface hybrid 84502 meg array FCI Connector top mount 0 stand off single row header 2.0mm pitch 10mm height bergstik 2,54 SMT roadmap gig-array connector footprint SMT pitch roadmap GR-1217-CORE
    Text: Targeted Technology Service Speed and Integrity MezzSelect presentation – Dec 2009 – FCI ELX 1 Choose precisely what you Need What is a mezzanine connector? A mezzanine connector… …provides an electrical and mechanical connection between two printed circuits.


    Original     		PDF

    hp laptop MOTHERBOARD pcb CIRCUIT diagram

    Abstract: ips 500w circuit diagram 800w class d circuit diagram schematics IRS2092 audio amplifier circuit diagram 700w audio amplifier circuit diagram schematic diagram Electronic Ballast xenon 2000w audio amplifier circuit diagram 1000w class d circuit diagram schematics IR2153 spice model circuit diagram of smps 400w DESKTOP
    Text: Product Line Overview Applications Key Products Energy Saving Products • Appliances • Digital Control ICs Integrated design platforms that enable customers to add energyconserving features that achieve lower operating energy costs and manufacturing Bill of Material


    Original     		PDF

    WP-72-08

    Abstract: white papers coin sensor
    Text: Executive Briefing Avoiding an Energy Storage Crisis: The 8 Key Competitive Advantages of Solid State Batteries By Steve Grady Introduction If electronics manufacturers have a motto, it's probably this: Innovate or Die. For years, the industry's rapid rate of innovation and


    Original     		PDF WP-72-08 WP-72-08 white papers coin sensor

    ic 6116 datasheet from texas instruments

    Abstract: intel date code marking 28f160 SMT pitch roadmap intel 6116 uBGA device MARKing intel intel 04195 intel 28f160 SMT roadmap 28f800 56 pin csp process flow diagram
    Text: D Comprehensive User’s Guide for µBGA* Packages 1998 NOTE: For the most current µBGA* package related information, please refer to Intel's Website at http://www.intel.com/design/flcomp/packdata Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		PDF

    XC68307

    Abstract: toshiba Motherboards laptop layout MC68230P XC68834 B47K PPC860 XC68836 XC68040 XCF5102 XPC604
    Text: High-Performance Internal Product Portfolio Overview Issue 10 Fourth Quarter, 1995 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and


    Original     		PDF MOS11 MOS13 BR729/D, XC68307 toshiba Motherboards laptop layout MC68230P XC68834 B47K PPC860 XC68836 XC68040 XCF5102 XPC604

    74729 latch

    Abstract: dms 59 to vga SFF8470 pinout DMS59 to vga PS-91525-001 DMS-59 to 15pin QSFP passive connector xaui mini HDMI plug 74752-2301 Micro-D connectors
    Text: I/O Products High Speed Pluggable I/O Solutions Small Form-Factor Pluggable SFP to N-3 Cable to N-8


    Original     		PDF

    apqp MANUAL

    Abstract: PPAP MANUAL INCOMING RAW MATERIAL INSPECTION checklist INCOMING RAW MATERIAL INSPECTION format INCOMING RAW MATERIAL INSPECTION procedure 7020037 FORD apqp manual EIA-Std-541 INCOMING RAW MATERIAL INSPECTION report format ford ppap
    Text: Quality Cover.QXD A M 5/24/00 5:26 PM E R I C Page 1 A N M I C R O S Y S T E M S , I N C . GA00028 Quality.qxd 5/24/00 5:29 PM Page 1 AMI CORPORATE QUALITY MANUAL AMERICAN MICROSYSTEMS, INC. 2300 Buckskin Road Pocatello, Id. 83201 Spec. #5500011 Date: 2000


    Original     		PDF GA00028 QUALMAN00 GA00028PP apqp MANUAL PPAP MANUAL INCOMING RAW MATERIAL INSPECTION checklist INCOMING RAW MATERIAL INSPECTION format INCOMING RAW MATERIAL INSPECTION procedure 7020037 FORD apqp manual EIA-Std-541 INCOMING RAW MATERIAL INSPECTION report format ford ppap

    Infineon technology roadmap for mosfet

    Abstract: germanium transistor pnp smd smd mosfet sot-363 microwave transistor siemens bfp 420 varactor flip chip radar 77 ghz sige Infineon automotive semiconductor technology roadmap transistor SMD DK qs siemens spc 2 SiGe PNP transistor
    Text: Small CHIPS for big visions Silicon Discretes www.infineon.com Never stop thinking. INTRODUCTION O n e o f t h e w o r l d ' s major manufacturers of radio frequency RF components, Infineon Technologies is committed to innovative technologies and products, flexible service and the very best supply conditions for customers and partners.


    Original     		PDF B191-H7496-G1-X-7600 Infineon technology roadmap for mosfet germanium transistor pnp smd smd mosfet sot-363 microwave transistor siemens bfp 420 varactor flip chip radar 77 ghz sige Infineon automotive semiconductor technology roadmap transistor SMD DK qs siemens spc 2 SiGe PNP transistor

    General Micro-electronics

    Abstract: SMT pitch roadmap ansys darveaux ansys CP-01019-1 Electronic Arrays FR4 thermal expansion constant vs temperature neural network BGA cte amkor flip
    Text: Building Reliability Into Full-Array BGAs Yuan Li, Ph.D., Anil Pannikkat, Ph.D., Larry Anderson, Tarun Verma, Bruce Euzent Altera Corporation 101 Innovation Drive, San Jose, CA 95134 Electronic Arrays, NEC, IMP and Altera Corp. He joined Altera in 1992 and is currently Director


    Original     		PDF