ULQ2003
Abstract: 2004D1
Text: ULQ2001 ULQ2003 - ULQ2004 Seven Darlington array Features • Seven Darlington per package ■ Extended temperature range: -40 to 105 °C ■ Output current 500 mA per driver 600 mA peak ■ Output voltage 50 V ■ Automotive Grade product in SO16 package
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ULQ2001
ULQ2003
ULQ2004
ULQ2001A/2003A
2004D1
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PDF
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Untitled
Abstract: No abstract text available
Text: ST7LNB0V2Y0 DiSEqC 2.1 slave microcontroller for LNBs and switchers Features • ■ Clock, reset and supply management – Reduced power consumption. – Safe power on/off management by low voltage detector LVD . – Internal 8 MHz oscillator SO16 narrow
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AN2035
Abstract: AN2036 diseqc 2N2222 AN1015 AN1181 AN1709 IEC1000-4-2 ST7LNB0V2Y0
Text: ST7LNB0V2Y0 DiSEqC 2.1 slave microcontroller for LNBs and switchers Features • ■ Clock, reset and supply management – Reduced power consumption. – Safe power on/off management by low voltage detector LVD . – Internal 8 MHz oscillator SO16 narrow
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ULQ2003
Abstract: 2004a darlington dip 16 SO16 package AEC-Q100 ULQ2001 ULQ2001A ULQ2003A ULQ2004
Text: ULQ2001 ULQ2003 - ULQ2004 Seven Darlington array Features • Seven Darlington per package ■ Extended temperature range: -40 to 105 °C ■ Output current 500 mA per driver 600 mA peak ■ Output voltage 50 V ■ Automotive Grade product in SO16 package
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Original
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ULQ2001
ULQ2003
ULQ2004
ULQ2001,
ULQ2004
2004a
darlington dip 16
SO16 package
AEC-Q100
ULQ2001
ULQ2001A
ULQ2003A
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PDF
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Untitled
Abstract: No abstract text available
Text: RMKMS CNM www.vishay.com Vishay Sfernice SMD Molded, 50 Mil Pitch, Dual-In-Line Thin Film Resistor Networks FEATURES • Tight TCR tracking down to 5 ppm/°C • Monolithic reliability • Low noise < - 35 dB • SMD precision networks Actual Size • SO08, SO14, SO16 cases
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Original
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J-STD-020C
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
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PDF
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Untitled
Abstract: No abstract text available
Text: RMKMS CNM www.vishay.com Vishay Sfernice SMD Molded, 50 Mil Pitch, Dual-In-Line Thin Film Resistor Networks FEATURES • Tight TCR tracking down to 5 ppm/°C • Monolithic reliability • Low noise < -35 dB • SMD precision networks Actual Size • SO08, SO14, SO16 cases
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Original
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J-STD-020C
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
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PDF
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SO-08
Abstract: MARKING S408 S408 SO08 SO-14 Marking h 498 RMKMS408
Text: RMKMS CNM www.vishay.com Vishay Sfernice SMD Molded, 50 Mil Pitch, Dual-In-Line Resistor Networks FEATURES • Tight TCR tracking down to 5 ppm/°C • Monolithic reliability • Low noise < - 35 dB • SMD precision networks • SO08, SO14, SO16 cases Actual Size
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Original
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J-STD-020C
11-Mar-11
SO-08
MARKING S408
S408
SO08
SO-14
Marking h 498
RMKMS408
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PDF
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S408
Abstract: so08
Text: RMKMS CNM www.vishay.com Vishay Sfernice SMD Molded, 50 Mil Pitch, Dual-In-Line Resistor Networks FEATURES • Tight TCR tracking down to 5 ppm/°C • Monolithic reliability • Low noise < - 35 dB • SMD precision networks • SO08, SO14, SO16 cases Actual Size
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Original
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J-STD-020C
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
S408
so08
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PDF
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SO18 Package
Abstract: SO16 SO16 package SO16 footprint SO18 footprint SO18 SO20 SO24 F 6553
Text: Package information - SO16−28 Surface mounted package Package outline ⍜ D E H L c A2 A e A1 b Common dimensions DIM Millimeters Inches DIM Millimeters Min. Max. Inches Min. Max. Min. Max. A 2.35 2.65 0.093 0.104 e A1 0.10 0.30 0.004 0.012 b 0.33 0.51 0.013
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SO16-28
SO18 Package
SO16
SO16 package
SO16 footprint
SO18 footprint
SO18
SO20
SO24
F 6553
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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Original
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OT109-1
OT109-1
076E07
MS-012
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm; low stand-off height D E SOT109-2 A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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OT109-2
076E07
MS-012
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PDF
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sot162-1
Abstract: MS-013 075E03
Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp L 8 1 e detail X w M bp 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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OT162-1
075E03
MS-013
sot162-1
MS-013
075E03
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PDF
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sot162-1
Abstract: sot162 MS-013-AA
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 9 16 Q A2 A A 3 A1 pin 1 index θ Lp L 1 8 e detail X w M bp 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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Original
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OT162-1
OT162-1
075E03
MS-013AA
sot162-1
sot162
MS-013-AA
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PDF
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Untitled
Abstract: No abstract text available
Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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Original
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OT109-1
076E07
MS-012
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PDF
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MS-013 Package
Abstract: MS-013
Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp L 8 1 e detail X w M bp 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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Original
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OT162-1
075E03
MS-013
MS-013 Package
MS-013
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970522
Abstract: SOT109-1
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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Original
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OT109-1
OT109-1
076E07S
MS-012AC
970522
SOT109-1
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PDF
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076E07
Abstract: No abstract text available
Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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Original
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OT109-1
076E07
MS-012
076E07
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm; body thickness 1.47 mm D E SOT109-3 A X c y HE v M A Z 16 9 A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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OT109-3
MS-012AC
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PDF
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MS-012AC
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm; body thickness 1.47 mm D E SOT109-3 A X c y HE v M A Z 16 9 A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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Original
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OT109-3
MS-012AC
MS-012AC
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PDF
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sot109
Abstract: SOT109-2
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm; low stand-off height D E SOT109-2 A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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Original
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OT109-2
OT109-2
sot109
SOT109-2
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PDF
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Untitled
Abstract: No abstract text available
Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm; low stand-off height D E SOT109-2 A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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Original
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OT109-2
076E07
MS-012
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PDF
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Untitled
Abstract: No abstract text available
Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm; low stand-off height D E SOT109-2 A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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Original
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OT109-2
076E07
MS-012
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PDF
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74HC4040
Abstract: 74HCT4040 74HC4040BQ 74HC4040D 74HC4040DB 74HC4040N 74HC4040PW HEF4040B JESD22-A114-C
Text: 74HC4040; 74HCT4040 12-stage binary ripple counter Product data sheet 1. General description The 74HC4040; 74HCT4040 are high-speed Si-gate CMOS devices and are pin compatible with the HEF4040B series. They are specified in compliance with JEDEC standard no. 7A.
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74HC4040;
74HCT4040
12-stage
74HCT4040
HEF4040B
OT109-1
74HC4040
74HC4040BQ
74HC4040D
74HC4040DB
74HC4040N
74HC4040PW
JESD22-A114-C
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PDF
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74AHC157
Abstract: 74AHC157D 74AHC157PW 74AHCT157 74AHCT157D JESD22-A114E MNA484
Text: 74AHC157; 74AHCT157 Quad 2-input multiplexer Product data sheet 1. General description The 74AHC/AHCT157 are high-speed Si-gate CMOS devices and are pin compatible with Low Power Schottky TTL LSTTL . They are specified in compliance with JEDEC standard no. 7A.
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Original
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74AHC157;
74AHCT157
74AHC/AHCT157
74AHC/AHCT157.
OT109-1
076E07
MS-012
AHCT157
74AHC157
74AHC157D
74AHC157PW
74AHCT157
74AHCT157D
JESD22-A114E
MNA484
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PDF
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