E5CK-TAA1-500
Abstract: E53-R4R4 E5AK omron software E53-C4DR4 E53-Q4R4 E5CK-AA1-500 H301-E3-1 IEC-1010 E53-CK03
Text: Ramp/Soak Process Controller E5CK-T Advanced, 1/16-DIN Ramp/Soak Process Controllers Ideal for Worldwide Use D D D D D D D D D Offers one pattern of simple programming control, up to four patterns with communications 16 steps per pattern . Water-resistant front face meets IP66/NEMA 4 (indoor
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1/16-DIN
IP66/NEMA
RS-232C
RS-485)
H301-E3-1
E5CK-TAA1-500
E53-R4R4
E5AK omron software
E53-C4DR4
E53-Q4R4
E5CK-AA1-500
H301-E3-1
IEC-1010
E53-CK03
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Vapor Phase Soldering tantalum capacitors
Abstract: thermal mass 185-C PREHEAT
Text: General Technical Information Recommended Soldering Profiles For Surface Mount Tantalum Capacitors Component Land Temperature °C IR and Convection Reflow Assembly exits heat no forced cooldown Additional soak time to allow uniform heating of the substrate
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reflow profile
Abstract: No abstract text available
Text: CD-SP2 Recommended Solder Reflow Profile Parameter Average temperature gradient in preheating Soak Time Time Above 217°C Time Above 230°C Time Above 250°C Peak Temperature in reflow Temperature gradient in cooling Reference soak t1 t2 t3 Tpeak Specification
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Untitled
Abstract: No abstract text available
Text: CSC32 Series Compact Benchtop Controllers Optional Communications Bundled with Free Software From $ 345 Basic Unit MADE IN USA ߜ Rugged Metal Benchtop Enclosure ߜ 4-Digit Display, 1 or 0.1° Resolution ߜ Full Autotune PID Heat-Cool Control ߜ Single Ramp and Soak Capability
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CSC32
RS-232
RS-485
CN9500
CN9300/CN9400/CN9500
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Murata ultrasonic
Abstract: No abstract text available
Text: !Notice other 1. Cleaning Conditions: The total cleaning time of soaking, ultrasonic and steam methods should be within 5 minutes. Consult with Murata concerning the cleaning solvent. In order to totally abolish ODC (Freon, Trichrolethan), Murata has carried out testing on non-cleaning and water cleaning (watersoluble flux, water-soluble cream solder, water-based cleaning
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Untitled
Abstract: No abstract text available
Text: A firm Commitment to excellence with a global perspective and an eye to the future Home » Solder Soakers » S2745- S- M Solder Soakers - S2745- S- M Features: Custom die- cut sponges available minimum quantity 2,500 RoHS Compliant "T"=10 per package "M"=1000 per package
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S2745-
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Untitled
Abstract: No abstract text available
Text: A firm Commitment to excellence with a global perspective and an eye to the future Home » Solder Soakers » S1227- O- M Solder Soakers - S1227- O- M Features: Custom die- cut sponges available minimum quantity 2,500 RoHS Compliant "T"=10 per package "M"=1000 per package
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S1227-
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Untitled
Abstract: No abstract text available
Text: A firm Commitment to excellence with a global perspective and an eye to the future Home » Solder Soakers » S2432- O- M Solder Soakers - S2432- O- M Features: Custom die- cut sponges available minimum quantity 2,500 RoHS Compliant "T"=10 per package "M"=1000 per package
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S2432-
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Untitled
Abstract: No abstract text available
Text: A firm Commitment to excellence with a global perspective and an eye to the future Home » Solder Soakers » S3219- O- M Solder Soakers - S3219- O- M Features: Custom die- cut sponges available minimum quantity 2,500 RoHS Compliant "T"=10 per package "M"=1000 per package
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S3219-
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Untitled
Abstract: No abstract text available
Text: A firm Commitment to excellence with a global perspective and an eye to the future Home » Solder Soakers » S3020- P- M Solder Soakers - S3020- P- M Features: Custom die- cut sponges available minimum quantity 2,500 RoHS Compliant "T"=10 per package "M"=1000 per package
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S3020-
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Untitled
Abstract: No abstract text available
Text: A firm Commitment to excellence with a global perspective and an eye to the future Home » Solder Soakers » S3030- R- M Solder Soakers - S3030- R- M Features: Custom die- cut sponges available minimum quantity 2,500 RoHS Compliant "T"=10 per package "M"=1000 per package
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S3030-
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Untitled
Abstract: No abstract text available
Text: PID Controllers Temperature Controls T2000 • • • • • • • • • • • • T2000 1/16 DIN and 1/32 DIN NEMA 4X protection Autotune automatically sets PID parameters Single ramp/soak program Heat-cool operation AC or DC power supply Inputs: Thermocouple, RTD, 0-50mV
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T2000
0-50mV
RS232
RS485
100-240VAC
12-24VDC
T2032
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141-50-FEP
Abstract: 250-50-FEP 141-75-FEP 86-50-FEP 141-35-FEP ECR 86-50 141-60-FEP 14175
Text: ELCURIGID High screened coaxial RF-cable with tin soaked braid Business Group Industrial Applications 1 Title SN 39 225 E Stand: 24.11.99 Seite 1 v 6 Detail specification for high screened coaxial RF-cable with tin soaked braid 2 Specifications Generic specification:
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86-50-FEP
141-50-FEP
141-75-FEP
141-35-FEP
141-60-FEP
141-100-FEP
250-50-FEP
141-50-FEP
250-50-FEP
141-75-FEP
86-50-FEP
141-35-FEP
ECR 86-50
141-60-FEP
14175
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BA2901
Abstract: No abstract text available
Text: Reliability Test Result DEVICE: BA2901 Family RESULT ITEM METHOD n pn pcs (pcs) - 22x3 10sec 22×3 CONDITION Resistance to Soldering Heat<#1> Soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat<#1> Soak into solder tub 260±3°C
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BA2901
10sec
30min)
100cycles
1000hours
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Catalog ROHM
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BU16027KV RESULT ITEM METHOD n pn pcs (pcs) − 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Temperature Cycling(*1) Tstg min (30min) / Tstg max (30min)
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BU16027KV
30min)
100cycles
1000hours
500hours
Catalog ROHM
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VSON008X2030
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BR93H□□-W Series RESULT ITEM METHOD CONDITION n pcs pn(pcs) － 77 x 3 Resistance to Soldering Heat (*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat (*2)
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BR93H-W
10sec
10cycles
30min)
1000cycles
1000hours
VSON008X2030
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BU16024KV
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BU16024KV RESULT ITEM METHOD n pn pcs (pcs) − 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Temperature Cycling(*1) Tstg min (30min) / Tstg max (30min)
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BU16024KV
30min)
100cycles
1000hours
500hours
BU16024KV
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BU52013HFV
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BU52013HFV RESULT ITEM METHOD n pn pcs (pcs) − 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Thermal Shock(*1) 100℃(5min) / 0℃ (5min)
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BU52013HFV
10cycles
30min)
100cycles
1000hours
1000ho
BU52013HFV
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bd9842
Abstract: bd98 BD9842FV
Text: Reliability Test Result DEVICE : BD9842FV RESULT ITEM METHOD n pn pcs (pcs) － 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat(*2)
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BD9842FV
10sec
10cycles
30min)
100cycles
1000hours
1000hou
bd9842
bd98
BD9842FV
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Untitled
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BA2903S Family RESULT ITEM METHOD n pn pcs (pcs) − 22 x 3 10sec 22 x 3 CONDITION Resistance to Soldering Heat (#1) Soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat (#1) Soak into solder tub 260±3℃
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BA2903S
10sec
30min)
100cycles
1000hours
1000ho
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Untitled
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BD9192GUL RESULT ITEM METHOD n pn pcs (pcs) － 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Thermal Shock(*1) 100℃(5min) / 0℃ (5min)
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BD9192GUL
10cycles
30min)
100cycles
1000hours
1000hour
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BU52003GUL
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BU52003GUL RESULT ITEM METHOD n pn pcs (pcs) − 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Thermal Shock(*1) 100℃(5min) / 0℃ (5min)
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BU52003GUL
10cycles
30min)
100cycles
1000hours
1000ho
BU52003GUL
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BD9134MUV
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BD9134MUV RESULT ITEM Resistance to Soldering Heat *2 METHOD n pn (pcs) (pcs) － 22 CONDITION After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260°C) Thermal Shock(*1) 100°C (5min) / 0°C (5min)
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BD9134MUV
10cycles
30min)
100cycles
1000hours
BD9134MUV
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IC Ultrasonic
Abstract: Water soluble flux
Text: • STANDARD SOLDERING CONDITIONS Sufficient preheating of the product Is required. Temperature difference A T between the soJder tempera ture and the part surface is to be within the limit indicated in the table. In case oi quick cooling- soaking in solvent after soldering,
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