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    SOIC 16 JEDEC PACKAGE OUTLINE Search Results

    SOIC 16 JEDEC PACKAGE OUTLINE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    SOIC 16 JEDEC PACKAGE OUTLINE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    MS-012 soic 16

    Abstract: MS-012 M16A jedec MS-012 soic 16 Jedec package outline
    Text: Revised January 1999 Package M16A 16-Lead Small Outline Integrated Circuit SOIC , JEDEC MS-012, 0.150” Narrow Package Number M16A 1999 Fairchild Semiconductor Corporation m16a.prf www.fairchildsemi.com Package M16A January 1999


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    16-Lead MS-012, MS-012 soic 16 MS-012 M16A jedec MS-012 soic 16 Jedec package outline PDF

    soic 16 Jedec package outline

    Abstract: jedec MS-013 MS-013 M16B
    Text: Revised January 1999 Package M16B 16-Lead Small Outline Intergrated Circuit SOIC , JEDEC MS-013, 0.300” Wide Package Number M16B 1999 Fairchild Semiconductor Corporation m16b.prf www.fairchildsemi.com Package M16B January 1999


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    16-Lead MS-013, soic 16 Jedec package outline jedec MS-013 MS-013 M16B PDF

    74S133

    Abstract: DM74S133 DM74S133M DM74S133N M16A MS-001 N16E 13-INPUT
    Text: Revised April 2000 DM74S133 13-Input NAND Gate General Description This device contains a single gate which performs the logic NAND function. Ordering Code: Order Number Package Number Package Description DM74S133M M16A 16-Lead Small Outline Integrated Circuit SOIC , JEDEC MS-012, 0.150 Narrow


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    DM74S133 13-Input DM74S133M 16-Lead MS-012, DM74S133N MS-001, 74S133 DM74S133 DM74S133M DM74S133N M16A MS-001 N16E PDF

    1256A-12

    Abstract: 8 pin 393 atmel 0420
    Text: Package Drawing 16S2, 16-lead, 0.300" Wide, Plastic Gull Wing Small Outline JEDEC SOIC Dimensions in Inches and (Millimeters) 0.020 (0.508) 0.013 (0.330) 0.299 (7.60) 0.291 (7.39) PIN 1 0.420 (10.7) 0.393 (9.98) 0.050 (1.27) BSC 0.394 (10.00) 0.386 (09.80)


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    16-lead, 1256A-12 8 pin 393 atmel 0420 PDF

    16s1

    Abstract: No abstract text available
    Text: Package Drawing 16S1, 16-lead, 0.150" Wide, Plastic Gull Wing Small Outline JEDEC SOIC Dimensions in Inches and (Millimeters) 0.020 (0.51) 0.013 (0.33) 0.158 (4.00) 0.150 (3.80) PIN 1 0.244 (6.20) 0.228 (5.80) .050 (1.27) BSC 0.394 (10.00) 0.386 (09.80)


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    16-lead, 16s1 PDF

    jedec MS-012-AC

    Abstract: MS-012-AC
    Text: Plastic Package Small Outline Plastic Package SOIC M16.15 (JEDEC MS-012-AC ISSUE C) N 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004)


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    MS-012-AC jedec MS-012-AC PDF

    MS-013-AA

    Abstract: No abstract text available
    Text: Plastic Package Small Outline Plastic Package SOIC M16.3 (JEDEC MS-013-AA ISSUE C) 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004)


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    MS-013-AA PDF

    jedec MS-013

    Abstract: MS-013-AA
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M16.3 (JEDEC MS-013-AA ISSUE C) 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E -B1 2 3 L SEATING PLANE -A- A D hx -CA1 B C 0.10(0.004)


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    MS-013-AA 5M-1982. jedec MS-013 PDF

    jedec MS-012-AC

    Abstract: MS-012-AC
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M16.15 (JEDEC MS-012-AC ISSUE C) N INDEX AREA H 0.25(0.010) M 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE B M E INCHES -B- 1 2 SYMBOL 3 L SEATING PLANE -A- h x 45o A D -C-


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    MS-012-AC 5M-1982. jedec MS-012-AC PDF

    jedec MS-012-AC

    Abstract: MS-012-AC MS-012AC
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M16.15 (JEDEC MS-012-AC ISSUE C) N INDEX AREA H 0.25(0.010) M 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE B M INCHES E -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1


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    MS-012-AC jedec MS-012-AC MS-012AC PDF

    MS-013-AA

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M16.3 (JEDEC MS-013-AA ISSUE C) N INDEX AREA 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE H 0.25(0.010) M B M INCHES E -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M


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    MS-013-AA PDF

    98ARL10519D

    Abstract: JESD51-5 JEDEC JESD51-8 BGA AN2409 JESD51-7 JESD51-51 jesd51 8 54ld JESD51-8
    Text: Freescale Semiconductor Application Note AN2409 Rev. 1.0, 12/2005 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,


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    AN2409 98ARL10519D JESD51-5 JEDEC JESD51-8 BGA AN2409 JESD51-7 JESD51-51 jesd51 8 54ld JESD51-8 PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Application Note AN2409 Rev. 2.0, 4/2013 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,


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    AN2409 PDF

    MTTF analysis data

    Abstract: JEDEC JESD51-8 BGA 98ARL10519D JESD51-51 QFN PACKAGE thermal resistance JESD51-5 JESD51-7 jesd51 8 1147 x motorola SOICW-32
    Text: Freescale Semiconductor, Inc. Application Note AN2409/D Rev. 0, 01/2003 Small Outline Integrated Circuit-Fine Pitch Package SOIC Freescale Semiconductor, Inc. CONTENTS 1.0 PURPOSE 3 2.0 SCOPE 3 3.0 SOIC PACKAGE 3 3.1 PACKAGE DESCRIPTION 3 3.2 PACKAGE DIMENSION


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    AN2409/D MTTF analysis data JEDEC JESD51-8 BGA 98ARL10519D JESD51-51 QFN PACKAGE thermal resistance JESD51-5 JESD51-7 jesd51 8 1147 x motorola SOICW-32 PDF

    Untitled

    Abstract: No abstract text available
    Text: Data Sheet LEADFRAME ExposedPad TSSOP/MSOP/SOIC/SSOP Thermal Performance Forced Convection, Single-layer PCB ExposedPad Thin Shrink Small Outline Package TSSOP , Micro Small Outline Package (MSOP), Small Outline IC Package (SOIC), Shrink Small Outline (SSOP)


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    DS571J PDF

    footprint jedec MS-026 TQFP AEB

    Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5


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    32-lead, 44-lead, 48-lead, 64-lead 100-lead, 144-lead, 24-lead, 20-lead, footprint jedec MS-026 TQFP AEB footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint PDF

    Untitled

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS040D − Revised October 2003 The CD4042B types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffixes , 16-lead dual-in-line plastic package (E suffix), 16-lead small-outline packages (D, DR, DT, DW, DWR, and NSR


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    SCHS040D CD4042B 16-lead 11-Nov-2009 CD4042BD CD4042BDE4 CD4042BDG4 PDF

    Untitled

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS040D − Revised October 2003 The CD4042B types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffixes , 16-lead dual-in-line plastic package (E suffix), 16-lead small-outline packages (D, DR, DT, DW, DWR, and NSR


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    SCHS040D CD4042B 16-lead 11-Nov-2009 CD4042BD CD4042BDE4 CD4042BDG4 PDF

    CD4014B

    Abstract: CD4014BE CD4014BEE4 CD4014BF3A CD4014BM CD4014BM96 CD4014BM96E4 CD4014BM96G4 CD4014BME4 CD4014BMG4
    Text: Data sheet acquired from Harris Semiconductor SCHS024C − Revised October 2003 The CD4014B and CD4021b series types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffix , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR


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    SCHS024C CD4014B CD4021b 16-lead 16-lead 12-Jan-2010 CD4014BE CD4014BEE4 CD4014BE CD4014BEE4 CD4014BF3A CD4014BM CD4014BM96 CD4014BM96E4 CD4014BM96G4 CD4014BME4 CD4014BMG4 PDF

    CD4043BEE4

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS041D − Revised October 2003 The CD4043B and CD4044B types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffix , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (D, DR, DT, DW, DWR,


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    SCHS041D CD4043B CD4044B 16-lead 11-Nov-2009 CD4043BD CD4043BDE4 CD4043BEE4 PDF

    CD4014B

    Abstract: CD4014BE CD4014BEE4 CD4014BF3A CD4014BM CD4014BM96 CD4014BM96E4 CD4014BM96G4 CD4014BME4 CD4014BMG4
    Text: Data sheet acquired from Harris Semiconductor SCHS024C − Revised October 2003 The CD4014B and CD4021b series types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffix , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR


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    SCHS024C CD4014B CD4021b 16-lead 16-lead 12-Jan-2010 CD4014BE CD4014BEE4 CD4014BE CD4014BEE4 CD4014BF3A CD4014BM CD4014BM96 CD4014BM96E4 CD4014BM96G4 CD4014BME4 CD4014BMG4 PDF

    LD128

    Abstract: PPF leadframe
    Text: LEADFRAME data sheet SOIC Features Small Outline IC Package SOIC : SOIC is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. This industry standard package runs in very high volume and


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    MS-013 MO-119 LD128 PPF leadframe PDF

    footprint jedec MS-026 TQFP

    Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


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    32-lead, 44-lead, 48-lead, 64-lead 100-lead, 0555D 11/99/xM footprint jedec MS-026 TQFP atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545 PDF

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE soie DIAGRAM OUTLINES PACKAGE DIAGRAM OUTLINES SOIC C o n t i n u e d REVISIONS DWG § NOM N MAX T E S 0 18- -1 DWG § JEDEC VARIATION □ AA MIN DWG § S016- JEDEC VARIATION □ AB MIN NOM MAX S020- 2 JEDEC VARIATION T E NOM MAX T E S024- 2 NOM


    OCR Scan
    S016N M0-059, -330T PDF