Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SOL20 PACKAGE Search Results

    SOL20 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    SOL20 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    74BC645

    Abstract: 74bc244 BC242 bc540 BC541 BC244 bc574 BC240 bc564 BC241
    Text: Bi-CMOS Logic TD74ABT/TD74BC Series Toshiba Bi-CMOS Logic TD74ABT / TD74BC Series Outline , High-speed bus systems based on today s advanced CPUs require more than just standard logic. In particular, the bus interfaces of such systems demand very high-performance devices. To meet these needs, Toshiba


    Original     		PDF TD74ABT/TD74BC TD74ABT TD74BC 74ABT 74BC244 74BC645 74bc244 BC242 bc540 BC541 BC244 bc574 BC240 bc564 BC241

    SOL20 package

    Abstract: sol 20 Package thermal simulation of IC package EL1501 dremel
    Text: Measuring the Thermal Resistance of Power Surface-Mount Packages by B Harvey 8 Modern miniature IC packages have allowed great space savings in products but frustrate the designer by concentrating the heat generated by circuits into smaller volumes Increasing IC


    Original     		PDF

    SOL20 package

    Abstract: sol 20 Package AN1091 EL1501
    Text: Measuring the Thermal Resistance of Power Surface-Mount Packages Application Note March 23, 1998 AN1091 Author: B. Harvey Modern miniature IC packages have allowed great space savings in products, but frustrate the designer by concentrating the heat generated by circuits into smaller


    Original     		PDF AN1091 SOL-20 EL1501 SOL20 package sol 20 Package AN1091

    compliance matrix

    Abstract: datadelay
    Text: Data Delay Devices, Inc 3 Mount Prospect Ave Clifton, NJ 07013 Tel: 973-773-2299 Fax: 973-773-9672 www.datadelay.com Monolithic RoHS-Compliance Matrix as of 3/7/2013 SMD Package ID Series Z D R S SOIC8 SOIC14 SOIC16 SOL16 3D3215 0901 Y 3D3220 Y Y 3D3225


    Original     		PDF SOIC14 SOIC16 SOL16 3D3215 3D3220 3D3225 3D3314 3D3323 3D3324 3D3418 compliance matrix datadelay

    SOL28 package

    Abstract: SOL20 sol-20 SOL20 package sol 20 Package SOL-24 sol28 SOL-28 SO20 Package SOL package
    Text: Plastic Packages for Integrated Circuits Small Outline Package Family SO A D h X 45° (N/2)+1 N A PIN #1 I.D. MARK E1 E c SEE DETAIL “X” 1 (N/2) B L1 0.010 M C A B e H C A2 GAUGE PLANE SEATING PLANE A1 0.004 C 0.010 M C A B L b 0.010 4° ±4° DETAIL X


    Original     		PDF MDP0027 SO-14 SOL-16) SOL-20) SOL-24) SOL-28) 5M-1994 SOL28 package SOL20 sol-20 SOL20 package sol 20 Package SOL-24 sol28 SOL-28 SO20 Package SOL package

    Untitled

    Abstract: No abstract text available
    Text: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF O-220, OT-223, SOL-20 217-36CTR6 1-866-9-OHMITE 217-36CTT6 O-263 MO-169

    SOL28 package

    Abstract: SO20 SO24 SOL-24 SOL-28 sol 20 Package SOL-20 SOL20 package
    Text: Plastic Packages for Integrated Circuits Small Outline Package Family SO A D h X 45° (N/2)+1 N A PIN #1 I.D. MARK E1 E c SEE DETAIL “X” 1 (N/2) B L1 0.010 M C A B e H C A2 GAUGE PLANE SEATING PLANE A1 0.004 C 0.010 M C A B L b 0.010 4° ±4° DETAIL X


    Original     		PDF MDP0027 SO-14 SOL-16) SOL-20) SOL-24) SOL-28) 5M-1994 SOL28 package SO20 SO24 SOL-24 SOL-28 sol 20 Package SOL-20 SOL20 package

    TOSHIBA CR2032

    Abstract: ali m1489 c86 sot23 74F03 RN7 SOT23 74f06d RC0805 M1487 ali m5042 TIL311
    Text: Am486PCI_21_BOM.xls Am486 Microprocessor PCI Customer Development Board Revised: Friday, December 18, 1998 Revision: 2.1A C Advanced Micro Devices, Inc. (800) 222-9323 5204 E. Ben White Blvd. Austin, TX 78741 AMD Proprietary/All Rights Reserved Bill Of Materials


    Original     		PDF Am486PCI Am486 CPLCC44 74ABT244D M5113A TFDS6000D LTC1349CG Am79C972KC LXT970QC MC33269DT-3 TOSHIBA CR2032 ali m1489 c86 sot23 74F03 RN7 SOT23 74f06d RC0805 M1487 ali m5042 TIL311

    TB62006P

    Abstract: TB62003 TB62003F TB62003FW TB62003P TB62004F TB62004FW TB62004P TB62006F TB62006FW
    Text: TB62003,004,006～009P/F/FW TOSHIBA Bi−CMOS INTEGRATED CIRCUIT SILICON MONOLITHIC TB62008FW,TB62009P,TB62009F,TB62009FW 8CH DMOS TRANSISTOR ARRAY WITH GATE


    Original     		PDF TB62003 006009P/F/FW TB62003P TB62003F TB62003FW TB62004P TB62004F TB62004FW TB62006P TB62006F TB62006P TB62006FW

    TB62003F

    Abstract: TB62003 TB62003FW TB62003P TB62004F TB62004FW TB62004P TB62006F TB62006FW TB62006P
    Text: TB62003,004,006～009P/F/FW TOSHIBA Bi−CMOS INTEGRATED CIRCUIT SILICON MONOLITHIC TB62008FW,TB62009P,TB62009F,TB62009FW 8CH DMOS TRANSISTOR ARRAY WITH GATE


    Original     		PDF TB62003 006009P/F/FW TB62003P TB62003F TB62003FW TB62004P TB62004F TB62004FW TB62006P TB62006F TB62006FW TB62006P

    sol18 package

    Abstract: MS-012AA Package PLCC-44 SMD SOL18 64 CERAMIC LEADLESS CHIP CARRIER LCC MS 013AA sol 20 Package PLCC-20 SOL-18
    Text: APPLICATIONS INFORMATION SURFACE-MOUNT IC PACKAGES Significant benefits can be achieved through the use of surfacemounted devices SMDs and general surface-mount technology as it applies to all components, both active and passive. The major benefits are reduced size and weight, and improved system reliability through


    Original     		PDF OA-005-14 SOL-16 PLCC-44 OA-005-17 OA-007-44 SOL-20B OA-005-21 sol18 package MS-012AA Package PLCC-44 SMD SOL18 64 CERAMIC LEADLESS CHIP CARRIER LCC MS 013AA sol 20 Package PLCC-20 SOL-18

    sol18 package

    Abstract: PLCC-44 SMD SOL 18 package SOL18 ELECTRICAL WIRING SOL-28 64 CERAMIC LEADLESS CHIP CARRIER LCC SOL-24B MS 013AA sol 20 Package
    Text: SURFACE-MOUNT IC PACKAGES APPLICATIONS INFORMATION SURFACE-MOUNT IC PACKAGES Significant benefits can be achieved through the use of surfacemounted devices SMDs and general surface-mount technology as it applies to all components, both active and passive. The major benefits


    Original     		PDF OA-005-14 SOL-16 PLCC-44 OA-005-17 OA-007-44 SOL-20B OA-005-21 sol18 package PLCC-44 SMD SOL 18 package SOL18 ELECTRICAL WIRING SOL-28 64 CERAMIC LEADLESS CHIP CARRIER LCC SOL-24B MS 013AA sol 20 Package

    EL7154

    Abstract: EL7154CN EL7154CNZ EL7154CS EL7154CS-T13 EL7154CS-T7 EL7154CSZ EL7154CSZ-T13 EL7154CSZ-T7 7154cs
    Text: EL7154 FN7278.2 High Speed, Monolithic Pin Driver The EL7154 three-state pin driver is particularly well suited for ATE and level shifting applications. The 4A peak drive 1 EL7154 Ordering Information PART NUMBER PART MARKING TAPE AND REEL PKG. DWG. # PACKAGE


    Original     		PDF EL7154 FN7278 EL7154 EL7154CN MDP0031 EL7154CNZ EL7154CN EL7154CNZ EL7154CS EL7154CS-T13 EL7154CS-T7 EL7154CSZ EL7154CSZ-T13 EL7154CSZ-T7 7154cs

    rma 291

    Abstract: Solder paste RMA-291 SOL-28 SOL28 package
    Text: before wave soldering Rosin mildly activated RMA flux or organic flux is needed Wave soldering using a dual wave system at 250 C g 10 C for a maximum of two seconds per wave is preferable Thorough cleaning of boards after soldering is required Soldering Packages to PC Boards


    Original     		PDF Pre255 MDP0038 OT-23 rma 291 Solder paste RMA-291 SOL-28 SOL28 package

    SOL24

    Abstract: SOL-24 SSOP20 SOL20
    Text: TD74ABT Series A4 Type No. Package TD74ABT 240F/FS/FW Octal Bus Buffer/lnvertlng/3-state SOP20/SSOP20/SOL20 TD74ABT 241F/FW Octal Bus Buffer/Non-lnverting/3-state SOP20/SOL20 TD74ABT 244F/FS/FW Octal Bus Bufler/Non-lnverting/3-state SOP20/SSOP20/SOL20 TD74ABT 245F/FS/FW


    OCR Scan     		PDF TD74ABT 240F/FS/FW 241F/FW 244F/FS/FW 245F/FS/FW SOL24 SOL-24 SSOP20 SOL20

    SOP20

    Abstract: SOL20 DIP20 DIP-20
    Text: BiCMOS Standard Logics TD74BC Series A4 Typo No. Package Function TD74BC00P Quad 2-Input NAND Gate DIP14 TD74BC08P Quad 2-Input AND Gate DIP14 TD74BC32P Quad 2-Input OR Gate DIP14 TD74BC230P/F/FW Octal Bus Butter/Inverting and Non-lnvertlng/3-state DIP20/SOP20/SOL20


    OCR Scan     		PDF TD74BC TD74BC00P TD74BC08P TD74BC32P TD74BC230P/F/FW TD74BC231P/F/FW TD74BC240P/F/FW TD74BC241 TD74BC242P TD74BC243P SOP20 SOL20 DIP20 DIP-20

    SSOP20-P-225A

    Abstract: No abstract text available
    Text: 7-2 Package SOP 14PIN 150mil BODY OUTLINE DRAW IN G (SOI14-P-150) 16 9 W eight : 0.13g(TYP.) 88 U nit in mm SO P 20PIN (300mil B O D Y ) OU TLIN E D R A W IN G (SOL20-P-300) U nit in mm 7^45' it W eight 0.46g (TYP.) 89 SO P 14PIN (200mil B O D Y ) O U TLIN E D R A W IN G (SOP14-P-300)


    OCR Scan     		PDF 14PIN 150mil SOI14-P-150) 20PIN 300mil SOL20-P-300) 200mil OP14-P-300) 16PIN SSOP20-P-225A

    Common collector 8 bit darlington

    Abstract: TB62705AF 16-Bit sipo Shift Register 8ch FET driver SOP18 TD62M8601 DIP18 darlington buffer array push-pull driver led constant current driver 500mA 8ch driver SOP18
    Text: A4 Type No. Function Output Output No. of Clamp Output Voltage Current Circuite V (*A) Diode Input RasMor (O) Recommended System Power Supply Package TD62591AP Single transistor array (emitter common) 8 50 200 Not provided Free DIP 18 TD62592AP Single transistor array (emitter common)


    OCR Scan     		PDF TD62591AP TD62592AP TD62S93AP/AFN TD62594AP/AFN TD62595AP/AF TD62596AP/AF TD62597AP/AF/AFN TD62598AP/AF/AFN TD62601P/F TD62602P/F Common collector 8 bit darlington TB62705AF 16-Bit sipo Shift Register 8ch FET driver SOP18 TD62M8601 DIP18 darlington buffer array push-pull driver led constant current driver 500mA 8ch driver SOP18

    sprague DIP

    Abstract: sprague catalog resistors
    Text: Hi i'.vt SPRAGUE CUSTOM DESIGN NETWORKS • Custom Design Networks 4 - ,v o •4PV CUSTOM DESIGN NETWORKS £ * Features — • High-Performance • Design Flexibility • All Package Configurations Available • Lead-Times Comparable to Standard Networks


    OCR Scan     		PDF RD-125B sprague DIP sprague catalog resistors

    74LS541 equivalent

    Abstract: 74LS541 N74LS541N
    Text: Signetics I 74LS540, 74LS541 Buffers/Drivers Octal B uffer/Line Driver 3-State Product Specification Logic Products TYPICAL PROPAGATION DELAY TYPE TYPICAL SUPPLY CURRENT (TOTAL) 74LS540 9ns 22mA 74LS541 10ns 23mA ORDERING CODE FUNCTION TABLE PACKAGES mlI


    OCR Scan     		PDF 74LS540, 74LS541 74LS540 SOL-20 N74LS540D, N74LS541D N74LS540N, N74LS541N 30LSul 74LS541 equivalent 74LS541 N74LS541N

    Untitled

    Abstract: No abstract text available
    Text: HtGH PERFO RMANCE Ä Ö 8 INTEGRATED CIRCUITS Measuring the Thermal Resistance o f Power Surface-Mount Packages Measuring the Thermal Resistance of Power Surface-Mount Packages by B. Harvey M odern m iniature IC packages have allow ed great space savings in products, but frustrate the designer


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: SURFACE MOUNT CLOCK OSCILLATORS PLETRONICS INC 42E » SM I 100 SERIES 755GS7M OOQODST S * P L E DESCRIPTION: SPECIFICATIONS: These new plastic-molded, surface mountable crystalcontrolled clock oscillators are available in two different lead configurations:


    OCR Scan     		PDF 755GS7M SM1114 SM1100G SM1100J SM1100G 191060-REV

    74S244N

    Abstract: LOGIC 74LS244 signetics 74LS244 74LS244 LOGIC OF 74LS244 74LS244 function 74LS244D 74LS244 pin configuration 74LS244 PIN CONFIGURATION AND SPECIFICATIONS
    Text: 74LS244, S244 Signetics Buffers Octal Buffers 3-State Product Specification Logic Products TYPICAL PROPAGATION DELAY TYPE TYPICAL SUPPLY CURRENT (TOTAL) 74LS244 12ns 25mA 74S244 6ns 112mA FUNCTION TABLE OUTPUTS INPUTS OEa L L H u OEb lb Ya Yb L H X L L H


    OCR Scan     		PDF 74LS244, 74LS244 74S244 112mA SOL-20 N74LS244N, 74S244N 74LS244D 08870S LOGIC 74LS244 signetics 74LS244 LOGIC OF 74LS244 74LS244 function 74LS244D 74LS244 pin configuration 74LS244 PIN CONFIGURATION AND SPECIFICATIONS

    ttl buffer 74LS245

    Abstract: 74ls245 74LS245PC function table of 74LS245 buffer 74LS245 TTL 74ls245 1N3064 1N916 74LS LS245
    Text: Signetìcs 74LS245 Transceiver Octal Transceiver 3-State Product Specification Logic Products FEATURES • Octal bidirectional bus interface • 3-State buffer outputs • PNP inputs for reduced loading • Hysteresis on all Data inputs TYPE TYPICAL PROPAGATION


    OCR Scan     		PDF 74LS245 LS245 1N916, 1N3064, 500ns ttl buffer 74LS245 74ls245 74LS245PC function table of 74LS245 buffer 74LS245 TTL 74ls245 1N3064 1N916 74LS