all ic data
Abstract: EIAJ SO 8 solder heating profile intel 80486 DX4 INTEL DX4 paste profile SMT Process dx4 208 SQFP 80c196kb 1988 diode databook intel 80486
Text: Board Solder Reflow Process Recommendations - Leaded SMT 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables including the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile
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all ic data
Abstract: land pattern for TSOP 2 pace craft 100 82425EX intel 80486 80486 DX4 80c196kb 1988 QFP PACKAGE thermal resistance 55A5 TSOP infrared
Text: CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT Surface Mount Technology assembly equipment solder paste component and reflow profile
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ad-1565
Abstract: D-602-0141 ES-61199 D-602-0122 D-602-0150 D-602-0151 raychem ad-1494 D-602-0140 AT-1319-78 Raychem D 602 0278
Text: Shielded Contacts SolderTacts Shielded One-Piece Solder Contacts Product Facts • ■ ■ ■ ■ Reliable one-piece solder contacts: through-connector shielding reduces crosstalk, and improves signal transmission One-step installation Solder joints are strong and
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D-600-0071
D-600-0116
D-600-0125
DOD-C-83527
MIL-C-38999
ad-1565
D-602-0141
ES-61199
D-602-0122
D-602-0150
D-602-0151
raychem ad-1494
D-602-0140
AT-1319-78
Raychem D 602 0278
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Intel reflow soldering profile BGA
Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
Text: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.
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conductivi49-58.
Intel reflow soldering profile BGA
all ic data
infrared heating gun
82425EX
80c196kb 1988
28F010
80C196KB
pcb warpage after reflow
Intel reflow soldering profile BGA intel
conveyor belt alignment
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Untitled
Abstract: No abstract text available
Text: MAXIMUM solutions Mill-Max Solder Pre-forms Mill-Max now offers solder pre-forms. Solder pre-forms enhance the assembly of large pin grid array PGA sockets. The main benefit of solder pre-forms is the placement of solder directly between the lead and the hole. This ensures a
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mutoh ip-220
Abstract: No abstract text available
Text: Database for Properties of Lead-Free Solder Alloys DATABASE FOR PROPERTIES OF LEAD-FREE SOLDER ALLOYS Version 1.0 This database is a joint project of ELFNET and COST 531 Action. COST 531 ACTION ON LEAD-FREE SOLDER ALLOYS EURPEAN LEAD-FREE SOLDERING NETWORK
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kskimm12
RC22717
W0302-019)
mutoh ip-220
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Untitled
Abstract: No abstract text available
Text: MAXIMUM solutions Mill-Max Solder Pre-forms Mill-Max now offers solder pre-forms. Solder pre-forms enhance the assembly of large pin grid array PGA sockets. The main benefit of solder pre-forms is the placement of solder directly between the lead and the hole. This ensures a
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heraeus pd944
Abstract: heraeus pd945 Amicon d125f D125F3 PD945 PD944 AMICON D125F AmiconD125F TSSOP footprint
Text: CHAPTER 4 THROUGH-HOLE MOUNTING METHODS page Soldering by dipping or solder wave 4-2 Repairing soldered joints 4-2 Philips Semiconductors IC Packages Through-hole mounting methods Chapter 4 SOLDERING BY DIPPING OR SOLDER WAVE The maximum temperature of the solder must not exceed
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MLC742
heraeus pd944
heraeus pd945
Amicon d125f
D125F3
PD945
PD944
AMICON
D125F
AmiconD125F
TSSOP footprint
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all ic data
Abstract: Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208
Text: 2 9 Board Solder Reflow Process Recommendations 1/16/97 5:29 PM CH09WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS 9.1. INTRODUCTION In reflowed board assemblies, the solder joint quality is affected by several variables such as
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all ic data
Intel reflow soldering profile BGA
infrared heating gun
82425EX
intel 80486 DX4
hot air bga
land pattern for TSOP
TSOP infrared
80c196kb 1988
land pattern QFP 208
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Untitled
Abstract: No abstract text available
Text: CHAPTER 4 THROUGH-HOLE MOUNTING METHODS page Soldering by dipping or solder wave 4-2 Repairing soldered joints 4-2 Philips Semiconductors IC Packages Through-hole mounting methods Chapter 4 SOLDERING BY DIPPING OR SOLDER WAVE The maximum temperature of the solder must not exceed
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Solder paste volume
Abstract: No abstract text available
Text: HSDL-2XXX Surface Mount Technology Assembly Application Note 1138 Solder Pad, Mask and Metal Solder Stencil Aperture METAL STENCIL FOR SOLDER PASTE PRINTING STENCIL APERTURE LAND PATTERN SOLDER MASK PCBA Figure 1. Stencil and PCBA Recommended Land Pattern for HSDL-2XXX
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5966-3027E
Solder paste volume
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3.5mm Stereo Chassis Socket
Abstract: FDZ BT PCB Mounted 6.5mm Stereo Socket trs stereo jack female jack 3.5mm Stereo plug FEMALE PCB MOUNT 6.35mm audio black Socket 5 pin PCB Mounted 3.5mm Stereo jack TRS jack CONNECTOR Stereo phone plug solder 3.5MM PCB Mounted 3.5mm Stereo plug 4 pole switch
Text: CONTENTS CONTENTS CATEGORY SUB CATEGORY AX SERIES XLR CABLE CONNECTORS PAGE 3 METAL SHELL TYPE - SOLDER AC SERIES XLR CABLE CONNECTORS PAGE 9 METAL SHELL TYPE - SOLDER THERMOPLASTIC SHELL TYPE - SOLDER METAL SHELL TYPE RIGHT ANGLE - SOLDER METAL SHELL TYPE - IDC SOLDERLESS
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35Mother
3.5mm Stereo Chassis Socket
FDZ BT
PCB Mounted 6.5mm Stereo Socket
trs stereo jack female jack
3.5mm Stereo plug FEMALE PCB MOUNT
6.35mm audio black Socket
5 pin PCB Mounted 3.5mm Stereo jack
TRS jack
CONNECTOR Stereo phone plug solder 3.5MM
PCB Mounted 3.5mm Stereo plug 4 pole switch
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PCB Mounted 6.5mm Stereo Socket
Abstract: 3.5mm Stereo plug FEMALE PCB MOUNT 3.5mm Stereo Chassis Socket trs stereo jack female jack layout pcb stk 070 PCB Mounted 3.5mm Stereo Socket chassis STEREO FEMALE CONNECTOR 3.5MM PCB MOUNT 6.35mm audio black Socket XLR-5 connector amphenol CHASSIS MOUNT d sub CONNECTORS
Text: CONTENTS CONTENTS CATEGORY SUB CATEGORY AX SERIES XLR CABLE CONNECTORS PAGE 3 METAL SHELL TYPE - SOLDER AC SERIES XLR CABLE CONNECTORS PAGE 9 METAL SHELL TYPE - SOLDER THERMOPLASTIC SHELL TYPE - SOLDER METAL SHELL TYPE RIGHT ANGLE - SOLDER METAL SHELL TYPE - IDC SOLDERLESS
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Abstract: No abstract text available
Text: Solder reflow recommendations Solder reflow profiles consist of four stages. They are: • Preheat • Pre-flow • Reflow • Cool down It is critical to have the rate of temperature change, maximum temperature, and time duration within each stage controlled to create solder joints that have flowed properly. An example of a
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Abstract: No abstract text available
Text: Lead Free Solder Page 1 of 2 Lead Free Solder Sn99 4901 99.3% tin and 0.7% copper M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Cu Tin/Copper alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to
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J-Std-006
4901-112G
4901-227G
4901-454G
4901-2LB
com/products/4901
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sn63pb37 solder wire
Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
Text: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information
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bellcore GR-78
Abstract: J-STD-006 SAC305
Text: Lead Free Solder SAC305 Page 1 of 2 Lead Free Solder Sn96 SAC 305 4900 96.3% tin, 0.7% copper and 3% silver M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder.
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SAC305
J-Std-006
J-Std-006
4900-35G
4900-112G
4900-227G
4900-454G
com/products/4900
bellcore GR-78
J-STD-006 SAC305
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BKC Semiconductors
Abstract: No abstract text available
Text: Summer 1999 Application Notes Plated and Solder Dipped Finishes for Semiconductor Components Plated or hot-solder-dipped coatings have been used for semiconductor component external solder terminations for many years in both commercial and military applications.
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CU-106A
Abstract: entek plus cu 106a anova general cross references TI Cross Reference Search HC373 Au Sn eutectic gold embrittlement
Text: Pb-Free Solder Joint Evaluation Contact Us Buy About TI TI Worldwide my.TI Advanced Search Keyword Part Number >> Semiconductor Home > Products > Digital Logic > Digital Logic Overview > Texas Instruments Palladium Lead Finish Pb-Free Solder Joint Evaluation
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CU-106A
entek plus cu 106a
anova
general cross references
TI Cross Reference Search
HC373
Au Sn eutectic
gold embrittlement
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Untitled
Abstract: No abstract text available
Text: HIGH DENSITY PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints * Insures a reliable solder joint by prc ing an exact amount of solder 9 Eliminates the need for solder paste
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Robinson Nugent
Abstract: Robinson Nugent pga 18x18 Nugent
Text: HIGH DENSITY_ PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints 9 Insures a reliable solder joint by provid ing an exact amount of solder * Eliminates the need for solder paste and
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13x13
18x18
Robinson Nugent
Robinson Nugent pga
Nugent
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Untitled
Abstract: No abstract text available
Text: PC Card and CompactFlash Connectors with Solder-Flux Bearing Leads Innovative, award winning technology. Interconnection Systems ▲ A precise amount of flux-core solder ▲ Proven, consistent solder-joint reliability attached to each lead allows automated soldering
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IS09001
ISO9001
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Untitled
Abstract: No abstract text available
Text: S O L D E R IN G A N D C L E A N IN G PROCESSES 1 — Solder Paste Printing Roflow GENERAL Use the optimum solder paste for the pattern, printing pi-ocess, solderpaste density and solder joint quality. RECOMMENDED Use Sn 63% Pb 37% solder paste. Use 8 to 10 mil thickness for
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TEKAS00056
Abstract: No abstract text available
Text: PC Card and CompactFlash Connectors with Solder-Flux Bearing Leads Innovative, award winning technology. Interconnection Systems ▲ A precise amount of flux-core solder ▲ Proven, consistent solder-joint reliability attached to each lead allows automated soldering
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IS09001
TEKAS00056
IS0900?
TEKAS00056
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