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    SOLDER PASTE, INDIUM REFLOW PROCESS CONTROL Search Results

    SOLDER PASTE, INDIUM REFLOW PROCESS CONTROL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMP89FS60AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP64-P-1010-0.50E Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP52-P-1010-0.65 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS60BFG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP64-1414-0.80-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63BUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP52-1010-0.65-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS62AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP44-P-1010-0.80A Visit Toshiba Electronic Devices & Storage Corporation

    SOLDER PASTE, INDIUM REFLOW PROCESS CONTROL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    72116

    Abstract: tamura solder paste solder paste tlf 204 29 tamura solder paste PROFILE NC-SMQ92J solder paste solder paste tamura tlf 204 29 UP78 multicore RP15 tamura No clean solder paste Loctite rp15
    Text: AN825 Vishay Siliconix The Solderability of the PowerPAKr SO-8 and PowerPAK 1212-8 When Using Different Solder Pastes and Profiles Jess Brown and Kandarp Pandya INTRODUCTION Next-generation PowerPAK packages from Vishay Siliconix feature very low thermal resistances, enabling higher power


    Original     		PDF AN825 15-Dec-03 72116 tamura solder paste solder paste tlf 204 29 tamura solder paste PROFILE NC-SMQ92J solder paste solder paste tamura tlf 204 29 UP78 multicore RP15 tamura No clean solder paste Loctite rp15

    Solder Paste, Indium, Type 3

    Abstract: d012 relay d012 w32 transistor fbr166 W32 MARKING FBR160
    Text: POWER RELAY 1 POLE—15 to 25 A FOR AUTOMOTIVE APPLICATIONS FBR161,166 Series RoHS compliant n FEATURES Suitable for automotive applications such as motor load controls, door locks, power windows, wipers, etc. l Variety of contact materials covering wide current switching


    Original     		PDF POLE--15 FBR161 FBR166 Solder Paste, Indium, Type 3 d012 relay d012 w32 transistor W32 MARKING FBR160

    Untitled

    Abstract: No abstract text available
    Text: POWER RELAY 1 POLE—15 to 25 A FOR AUTOMOTIVE APPLICATIONS FBR161,166 Series RoHS compliant n FEATURES Suitable for automotive applications such as motor load controls, door locks, power windows, wipers, etc. l Variety of contact materials covering wide current switching


    Original     		PDF POLE--15 FBR161 FBR166 FBR161:

    lf 12201

    Abstract: Solder Paste, Indium, Type 3
    Text: POWER RELAY 1 POLE—15 to 25 A FOR AUTOMOTIVE APPLICATIONS FBR161,166 Series RoHS compliant n FEATURES Suitable for automotive applications such as motor load controls, door locks, power windows, wipers, etc. l Variety of contact materials covering wide current switching


    Original     		PDF POLE--15 FBR161 FBR166 FBR161: lf 12201 Solder Paste, Indium, Type 3

    LGA voiding

    Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
    Text: Assembly Considerations for Linear Technology ModuleTM LGA Packages September 2010 Linear Technology Corporation Outline • • • • Package Construction PCB Design Guidelines Moisture Sensitivity, Pack, Ship & Bake Board Assembly Process – Screen Print


    Original     		PDF LTM4600 CCL-HL-832 LGA voiding Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325

    entek Cu-56

    Abstract: Cu-56 pcb warpage* in smt reflow pcb warpage after reflow Solder Paste, Indium, Type 3 thick bga die size bga thermal cycling reliability
    Text: Surface Laminar Circuit SLC Ball Grid Array (BGA) Eutectic Surface Mount Assembly Application Note 5026 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-56 surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array


    Original     		PDF Cu-56 5989-0491EN AV02-0770EN entek Cu-56 pcb warpage* in smt reflow pcb warpage after reflow Solder Paste, Indium, Type 3 thick bga die size bga thermal cycling reliability

    fujitsu relay 57d24

    Abstract: 57D24 FBR57 DC-12 FBR57ND24-W 57D24-N MICRO TX1
    Text: COMPACT HIGH POWER RELAY 1 POLE—30 A 28 VDC (FOR 24 V BATTERY AUTOMOTIVE APPLICATIONS) FBR57 SERIES RoHS compliant n FEATURES High power contact capacity (carrying current: 40 A/2 minutes, 30 A/1 hour) l Suitable for controlling 24 V motors in trucks and other


    Original     		PDF POLE--30 FBR57 FBR57: fujitsu relay 57d24 57D24 DC-12 FBR57ND24-W 57D24-N MICRO TX1

    fujitsu relay 57d24

    Abstract: 57D24-N
    Text: COMPACT HIGH POWER RELAY 1 POLE—12 A 28 VDC (FOR 24 V BATTERY AUTOMOTIVE APPLICATIONS) FBR57 SERIES RoHS compliant n FEATURES High power contact capacity (carrying current: 40 A/2 minutes, 30 A/1 hour) l Suitable for controlling 24 V motors in trucks and other


    Original     		PDF POLE--12 FBR57 FBR57: fujitsu relay 57d24 57D24-N

    LGA rework

    Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
    Text: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules


    Original     		PDF AN3241 MC1320x MC1321x LGA rework AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework

    entek Cu-56

    Abstract: bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile
    Text: HITCE* Ball Grid Array Surface Mount Assembly for Lead BGA Balls Application Note 5055 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.


    Original     		PDF 20ppm/ 5989-0834EN AV02-0769EN entek Cu-56 bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile

    AN1035

    Abstract: tamura solder paste SN62 PB36 ag2 kester IRF6604 DirectFet SN62 PB36 ag2 Copper Tamura kaken 100N IRF6601 IRF6602
    Text: AN-1035 DirectFET TM Technology Board Mounting Application Note page Device construction 2 Design considerations 3 Assembly considerations 4 Mechanical test results 5 International Rectifier AN-1035 DirectFET Technology Board Mounting Application Note Introduction


    Original     		PDF AN-1035 065mm. pp1509-1523 AN1035 tamura solder paste SN62 PB36 ag2 kester IRF6604 DirectFet SN62 PB36 ag2 Copper Tamura kaken 100N IRF6601 IRF6602

    Untitled

    Abstract: No abstract text available
    Text: RMPA2265 28dBm WCDMA Power Amplifier Module General Description Features The RMPA2265 power amplifier module PAM is designed for WCDMA applications. The 2 stage PAM is internally matched to 50Ω to minimize the use of external components and features a low-power mode to reduce


    Original     		PDF RMPA2265 28dBm RMPA2265

    Untitled

    Abstract: No abstract text available
    Text: RMPA2265 28dBm WCDMA Power Amplifier Module General Description Features The RMPA2265 power amplifier module PAM is designed for WCDMA applications. The 2 stage PAM is internally matched to 50Ω to minimize the use of external components and features a low-power mode to reduce


    Original     		PDF RMPA2265 28dBm RMPA2265

    tamura tlf-206-93f

    Abstract: p10 LED matrix single color module CANADA ICES 003. CLASS B mother board tamura tlf sac305 S131CL-5-RMM-2450S tamura solder paste SAC305 indium MMCX connector Sn 4011 SAC387 solder
    Text: PRELIMINARY DATA SHEET MATRIX Transceiver Modules ZMXM-400 Series Integrated Transceiver Module for ZigBee / IEEE 802.15.4 Evaluation Kits available DESCRIPTION The Matrix module is a 2.4 GHz IEEE 802.15.4 RF transceiver providing a cost- effective solution for data links and wireless networks. The module design is


    Original     		PDF ZMXM-400 100mW, tamura tlf-206-93f p10 LED matrix single color module CANADA ICES 003. CLASS B mother board tamura tlf sac305 S131CL-5-RMM-2450S tamura solder paste SAC305 indium MMCX connector Sn 4011 SAC387 solder

    Untitled

    Abstract: No abstract text available
    Text: February 2005 RMPA2263 i-Lo WCDMA Power Amplifier Module 1920–1980 MHz Features General Description • 40% WCDMA efficiency at +28 dBm Pout ■ 14% WCDMA efficiency 85 mA total current at +16 dBm Pout ■ Linear operation in low-power mode up to +19 dBm


    Original     		PDF RMPA2263

    Untitled

    Abstract: No abstract text available
    Text: RMPA2263 i-Lo i L o ™ Features General Description • 40% WCDMA efficiency at +28 dBm Pout The RMPA2263 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the


    Original     		PDF RMPA2263 RMPA2263

    Solder Paste Indium reflow process control

    Abstract: No abstract text available
    Text: April 2005 RMPA1963 i-Lo US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier Module iL o ™ General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout The RMPA1963 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting US-PCS CDMA/WCDMA/HSDPA and Wireless Local


    Original     		PDF RMPA1963 RMPA1963 CDMA2000-1X IS-95/CDMA2000-1XRTT/WCDMA Solder Paste Indium reflow process control

    CDMA2000-1X

    Abstract: ECJ-1VB1H102K RMPA1963 ECJ1VB1C104K
    Text: May 2005 RMPA1963 i-Lo US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier Module iL o ™ General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout The RMPA1963 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting US-PCS CDMA/WCDMA/HSDPA and Wireless Local


    Original     		PDF RMPA1963 CDMA2000-1X RMPA1963 ECJ-1VB1H102K ECJ1VB1C104K

    ECJ-1VB1H102K

    Abstract: RMPA2266 SN63 SN96
    Text: May 2006 RMPA2266 i-Lo WCDMA Power Amplifier Module, 1920–1980 MHz Features General Description • 40% WCDMA efficiency at +28dBm Pout The RMPA2266 Power Amplifier Module PAM is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA


    Original     		PDF RMPA2266 28dBm 16dBm) 16dBm ECJ-1VB1H102K SN63 SN96

    ECJ-1VB1H102K

    Abstract: RMPA1966 SN63 SN96
    Text: PRELIMINARY RMPA1966 i-Lo WCDMA Band II Power Amplifier Module, 1850–1910 MHz Features General Description • 40% WCDMA efficiency at +28.5dBm Pout The RMPA1966 Power Amplifier Module PAM is Fairchild’s latest innovation in 50Ω matched, surface


    Original     		PDF RMPA1966 16dBm) 16dBm ECJ-1VB1H102K SN63 SN96

    Untitled

    Abstract: No abstract text available
    Text: April 2005 RMPA1963 i-Lo US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier Module iL o ™ General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout The RMPA1963 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting US-PCS CDMA/WCDMA/HSDPA and Wireless Local


    Original     		PDF RMPA1963 RMPA1963 CDMA2000-1X IS-95/CDMA2000-1XRTT/WCDMA

    Untitled

    Abstract: No abstract text available
    Text: February 2005 RMPA0963 i-Lo Cellular CDMA, CDMA2000-1X and WCDMA Power Amplifier Module Features General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout ■ 14% CDMAA/WCDMA efficiency 80 mA total current at +16 dBm Pout ■ Linear operation in low-power mode up to +19 dBm


    Original     		PDF RMPA0963 CDMA2000-1X

    Solder Paste Indium reflow process control

    Abstract: ECJ-1VB1H102K RMPA2263 SN63 SN96
    Text: RMPA2263 i-Lo i L o ™ Features General Description • 40% WCDMA efficiency at +28 dBm Pout The RMPA2263 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the


    Original     		PDF RMPA2263 RMPA2263 Solder Paste Indium reflow process control ECJ-1VB1H102K SN63 SN96

    CDMA2000-1X

    Abstract: ECJ-1VB1H102K RMPA0966 fairchild microwave power transistor
    Text: November 2005 RMPA0966 i-Lo Cellular CDMA, CDMA2000-1X and WCDMA Power Amplifier Module Features General Description • 42% CDMA/WCDMA efficiency at +28 dBm Pout ■ 21% CDMA/WCDMA efficiency 56 mA total current at +16 dBm Pout ■ Meets HSDPA performance requirements


    Original     		PDF RMPA0966 CDMA2000-1X ECJ-1VB1H102K fairchild microwave power transistor