Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SOLDER PASTE FLOOR LIFE Search Results

    SOLDER PASTE FLOOR LIFE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    SOLDER PASTE FLOOR LIFE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    LGA voiding

    Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
    Text: Assembly Considerations for Linear Technology ModuleTM LGA Packages September 2010 Linear Technology Corporation Outline • • • • Package Construction PCB Design Guidelines Moisture Sensitivity, Pack, Ship & Bake Board Assembly Process – Screen Print


    Original     		PDF LTM4600 CCL-HL-832 LGA voiding Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325

    IPC-SM-780

    Abstract: IPC-SM-780 solder paste OVEN RQFP IPC-SM-786
    Text: Reflow Soldering Guidelines June 1996, ver. 1 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , J-lead chip carrier (JLCC and PLCC), ball-grid array (BGA), and small-outline integrated circuit (SOIC) devices, as well as QFP development sockets.


    Original     		PDF varyinI/IPC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780 IPC-SM-780 solder paste OVEN RQFP IPC-SM-786

    IPC-SM-780

    Abstract: No abstract text available
    Text: Reflow Soldering Guidelines January 1998, ver. 2 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid


    Original     		PDF ANSI/IPC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780

    IPC-SM-780

    Abstract: IPC-SM-786 IPC-SM-786A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE moisture sensitive handling and packaging BGA and QFP Altera Package mounting Solder paste floor life
    Text: Reflow Soldering Guidelines June 1996, ver. 1 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , J-lead chip carrier (JLCC and PLCC), ball-grid array (BGA), and small-outline integrated circuit (SOIC) devices, as well as QFP development sockets.


    Original     		PDF oC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780 IPC-SM-786 IPC-SM-786A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE moisture sensitive handling and packaging BGA and QFP Altera Package mounting Solder paste floor life

    AN10365

    Abstract: ipc 610D Cu3Sn JEDEC J-STD-033b.1 SSOP20 LAND PATTERN JEDEC J-STD-033b J-STD-033b.1 Cu6Sn5 ipc 610 non-wetting Solder Paste, Indium, Type 3
    Text: AN10365 Surface mount reflow soldering description Rev. 04 — 13 August 2009 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and


    Original     		PDF AN10365 AN10365 ipc 610D Cu3Sn JEDEC J-STD-033b.1 SSOP20 LAND PATTERN JEDEC J-STD-033b J-STD-033b.1 Cu6Sn5 ipc 610 non-wetting Solder Paste, Indium, Type 3

    Cu3Sn

    Abstract: ipc 610 non-wetting
    Text: AN10365 Surface mount reflow soldering Rev. 6 — 30 July 2012 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and handling of NXP semiconductor packages.


    Original     		PDF AN10365 Cu3Sn ipc 610 non-wetting

    BGA and QFP Altera Package mounting profile

    Abstract: BGA PROFILING JEP113-B infrared heating gun guidelines JEP113 Reliability Data Plastic Packages QFP J-STD-020A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
    Text: Reflow Soldering Guidelines for Surface-Mount Devices June 2002, ver. 4 Application Note 81 7 Introduction Altera’s surface-mount packages include quad flat pack QFP , plastic J-lead chip carriers (PLCC), and ball-grid array (BGA), including FineLine


    Original     		PDF

    IPC-SM-786A

    Abstract: BGA and QFP Altera Package mounting profile JESD22-A113 J-STD-020A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-780 altera board
    Text: Reflow Soldering Guidelines January 1999, ver. 3 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid


    Original     		PDF

    rf2052

    Abstract: JESD625-A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE RF2052TR13 RFMD RF2052
    Text: Manufacturing Notes for RF2052 The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. "RFMD" for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is


    Original     		PDF RF2052 EUDirective2002/95/EC RF2052 JESD625-A; J-STD-033) 052020A JESD625-A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE RF2052TR13 RFMD RF2052

    RF119

    Abstract: JESD625-A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
    Text: Manufacturing Notes for RF1195 The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. "RFMD" for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is


    Original     		PDF RF1195 EUDirective2002/95/EC RF1195 JESD625-A; J-STD-033) RF11950201 RF119 JESD625-A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE

    JEDEC J-STD-033 TAPE AND REEL

    Abstract: J-STD-033 SUF-5033 JESD625-A JEDEC J-STD-033
    Text: Manufacturing Notes for SUF-5033 The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. "RFMD" for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is


    Original     		PDF SUF-5033 EUDirective2002/95/EC SUF-5033 JESD625-A; J-STD-033) SUF-5033010B JEDEC J-STD-033 TAPE AND REEL J-STD-033 JESD625-A JEDEC J-STD-033

    JESD625-A

    Abstract: RF2051TR13 RF2051 RFMD RF2051 J-STD-033
    Text: Manufacturing Notes for RF2051 The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. "RFMD" for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is


    Original     		PDF RF2051 EUDirective2002/95/EC RF2051 JESD625-A; J-STD-033) 051020A JESD625-A RF2051TR13 RFMD RF2051 J-STD-033

    JESD625-A

    Abstract: SUF-8533 JESD625 J-STD-033
    Text: Manufacturing Notes for SUF-8533 The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. "RFMD" for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is


    Original     		PDF SUF-8533 EUDirective2002/95/EC SUF-8533 JESD625-A; J-STD-033) SUF-8533010B JESD625-A JESD625 J-STD-033

    96SCAGS89

    Abstract: JESD625-A J-STD-033 RF2053 multicore solder paste moisture handling
    Text: Manufacturing Notes for RF2053 The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. "RFMD" for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is


    Original     		PDF RF2053 EUDirective2002/95/EC RF2053 JESD625-A; J-STD-033) 053020A 96SCAGS89 JESD625-A J-STD-033 multicore solder paste moisture handling

    JESD625-a

    Abstract: J-STD-033 Multicore CR39
    Text: Manufacturing Notes for SUF-1033 The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. "RFMD" for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is


    Original     		PDF SUF-1033 EUDirective2002/95/EC SUF-1033 JESD625-A; J-STD-033) SUF-1033010A JESD625-a J-STD-033 Multicore CR39

    JEDEC J-STD-033

    Abstract: jedec JESD625-a RF2057 J-STD-033 96SCAGS89 SN62 PB36 ag2 JESD625-A J-STD-033 PCB multicore solder paste 62 JESD625A
    Text: Manufacturing Notes for RF2057 The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. "RFMD" for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is


    Original     		PDF RF2057 EUDirective2002/95/EC RF2057 JESD625-A; J-STD-033) JEDEC J-STD-033 jedec JESD625-a J-STD-033 96SCAGS89 SN62 PB36 ag2 JESD625-A J-STD-033 PCB multicore solder paste 62 JESD625A

    JESD625-A

    Abstract: J-STD-033 PCB Multicore CR39 RF5500 J-STD-033 SN62 PB36 ag2 JEDEC J-STD-033 rework station diagram IPC-020b-5-1
    Text: Manufacturing Notes for RF5500 The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. "RFMD" for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is


    Original     		PDF RF5500 EUDirective2002/95/EC RF5500 JESD625-A; J-STD-033) 5500010B JESD625-A J-STD-033 PCB Multicore CR39 J-STD-033 SN62 PB36 ag2 JEDEC J-STD-033 rework station diagram IPC-020b-5-1

    JEDEC J-STD-033

    Abstract: RF2059 JESD625-A J-STD-033 GETEK FR4 SN62 PB36 ag2 JEDEC J-STD-033 TAPE AND REEL
    Text: Manufacturing Notes for RF2059 The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. "RFMD" for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is


    Original     		PDF RF2059 EUDirective2002/95/EC RF2059 JESD625-A; J-STD-033) JEDEC J-STD-033 JESD625-A J-STD-033 GETEK FR4 SN62 PB36 ag2 JEDEC J-STD-033 TAPE AND REEL

    weller ec1201p

    Abstract: EC1201P Polyethylene capacitor X32B weller 2002C ec1201 ST382 Solder paste floor life weller 2002C
    Text: SOLDERING GUIDELINES ® Capstick & Surfilm Capacitors • Type CB, CS and ST General The Capstick and Surfilm capacitors Type CB, CS and ST use PET as the film dielectric and have been thermally stabilized to withstand reflow soldering temperatures for a maximum of 220°C


    Original     		PDF

    SPRU811

    Abstract: BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate
    Text: Flip Chip Ball Grid Array Package Reference Guide Literature Number: SPRU811A May 2005 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue


    Original     		PDF SPRU811A SPRU811 SPRU811 BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate

    JEDEC J-STD-033 TAPE AND REEL

    Abstract: No abstract text available
    Text: RFSA2534 Manufacturing Notes Table of Contents 1 Introduction . 2 2 Module Package Description . 2 3 2.1 RFSA2534 Outline Drawing . 2


    Original     		PDF RFSA2534 RFSA2534 MN140910 JEDEC J-STD-033 TAPE AND REEL

    24 leads qfn 5x5

    Abstract: qfn 3X3 land pattern JESD47D 28 leads qfn 4x5 QFN 20 5x5 "recommended PCB Layout" JEDEC J-STD-033b marking 8206 Jedec jesd47d AN0017 qfn 5x5 thermal resistance
    Text: AN0017 Application Note for Molded Plastic QFN Packages GaAs Monolithic Packaged Microwave IC 1. General considerations on plastic molded packages Surface Mount Device type packages SMD* for microwave applications are appearing more and more on the market. The use of such packages requires some


    Original     		PDF AN0017 AN0017-8206 24 leads qfn 5x5 qfn 3X3 land pattern JESD47D 28 leads qfn 4x5 QFN 20 5x5 "recommended PCB Layout" JEDEC J-STD-033b marking 8206 Jedec jesd47d AN0017 qfn 5x5 thermal resistance

    Cu3Sn

    Abstract: HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3 AN10365
    Text: AN10365 Surface mount reflow soldering description Rev. 03 — 22 April 2008 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.


    Original     		PDF AN10365 AN10365 Cu3Sn HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3

    Cu3Sn

    Abstract: Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN
    Text: AN10365 Surface mount reflow soldering description Rev. 02 — 26 July 2006 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.


    Original     		PDF AN10365 AN10365 Cu3Sn Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN