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    SOLDER PASTE INDIUM REFLOW PROCESS CONTROL Search Results

    SOLDER PASTE INDIUM REFLOW PROCESS CONTROL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMP89FS60AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP64-P-1010-0.50E Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP52-P-1010-0.65 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS60BFG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP64-1414-0.80-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63BUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP52-1010-0.65-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS62AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP44-P-1010-0.80A Visit Toshiba Electronic Devices & Storage Corporation

    SOLDER PASTE INDIUM REFLOW PROCESS CONTROL Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: POWER RELAY 1 POLE—15 to 25 A FOR AUTOMOTIVE APPLICATIONS FBR161,166 Series RoHS compliant n FEATURES Suitable for automotive applications such as motor load controls, door locks, power windows, wipers, etc. l Variety of contact materials covering wide current switching


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    POLE--15 FBR161 FBR166 FBR161: PDF

    lf 12201

    Abstract: Solder Paste, Indium, Type 3
    Text: POWER RELAY 1 POLE—15 to 25 A FOR AUTOMOTIVE APPLICATIONS FBR161,166 Series RoHS compliant n FEATURES Suitable for automotive applications such as motor load controls, door locks, power windows, wipers, etc. l Variety of contact materials covering wide current switching


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    POLE--15 FBR161 FBR166 FBR161: lf 12201 Solder Paste, Indium, Type 3 PDF

    fujitsu relay 57d24

    Abstract: 57D24-N
    Text: COMPACT HIGH POWER RELAY 1 POLE—12 A 28 VDC (FOR 24 V BATTERY AUTOMOTIVE APPLICATIONS) FBR57 SERIES RoHS compliant n FEATURES High power contact capacity (carrying current: 40 A/2 minutes, 30 A/1 hour) l Suitable for controlling 24 V motors in trucks and other


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    POLE--12 FBR57 FBR57: fujitsu relay 57d24 57D24-N PDF

    LGA rework

    Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
    Text: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules


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    AN3241 MC1320x MC1321x LGA rework AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework PDF

    Untitled

    Abstract: No abstract text available
    Text: RMPA2265 28dBm WCDMA Power Amplifier Module General Description Features The RMPA2265 power amplifier module PAM is designed for WCDMA applications. The 2 stage PAM is internally matched to 50Ω to minimize the use of external components and features a low-power mode to reduce


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    RMPA2265 28dBm RMPA2265 PDF

    Untitled

    Abstract: No abstract text available
    Text: RMPA2263 i-Lo i L o ™ Features General Description • 40% WCDMA efficiency at +28 dBm Pout The RMPA2263 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the


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    RMPA2263 RMPA2263 PDF

    Untitled

    Abstract: No abstract text available
    Text: April 2005 RMPA1963 i-Lo US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier Module iL o ™ General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout The RMPA1963 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting US-PCS CDMA/WCDMA/HSDPA and Wireless Local


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    RMPA1963 RMPA1963 CDMA2000-1X IS-95/CDMA2000-1XRTT/WCDMA PDF

    Untitled

    Abstract: No abstract text available
    Text: February 2005 RMPA0963 i-Lo Cellular CDMA, CDMA2000-1X and WCDMA Power Amplifier Module Features General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout ■ 14% CDMAA/WCDMA efficiency 80 mA total current at +16 dBm Pout ■ Linear operation in low-power mode up to +19 dBm


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    RMPA0963 CDMA2000-1X PDF

    CDMA2000-1X

    Abstract: ECJ-1VB1H102K RMPA0966 fairchild microwave power transistor
    Text: November 2005 RMPA0966 i-Lo Cellular CDMA, CDMA2000-1X and WCDMA Power Amplifier Module Features General Description • 42% CDMA/WCDMA efficiency at +28 dBm Pout ■ 21% CDMA/WCDMA efficiency 56 mA total current at +16 dBm Pout ■ Meets HSDPA performance requirements


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    RMPA0966 CDMA2000-1X ECJ-1VB1H102K fairchild microwave power transistor PDF

    GRM39Y5V104Z16V

    Abstract: No abstract text available
    Text: February 2005 RMPA1963 i-Lo US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier Module Features General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout ■ 14% CDMA/WCDMA efficiency 85 mA total current at +16 dBm Pout ■ Linear operation in low-power mode up to +19 dBm


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    RMPA1963 CDMA2000-1X GRM39Y5V104Z16V PDF

    Untitled

    Abstract: No abstract text available
    Text: RMPA2263 i-Lo i L o ™ Features General Description • 40% WCDMA efficiency at +28 dBm Pout The RMPA2263 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the


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    RMPA2263 RMPA2263 PDF

    Solder Paste, Indium 5.8

    Abstract: ECJ-1VB1H102K RMPA1966 SN63 SN96 grm39
    Text: PRELIMINARY RMPA1966 i-Lo tm WCDMA Band II Power Amplifier Module Features General Description • 40% WCDMA efficiency at +28.5dBm Pout The RMPA1966 Power Amplifier Module PAM is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA


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    RMPA1966 16dBm) 16dBm Solder Paste, Indium 5.8 ECJ-1VB1H102K SN63 SN96 grm39 PDF

    ECJ-1VB1H102K

    Abstract: RMPA0966
    Text: PRELIMINARY RMPA0966 i-Lo WCDMA Band V Power Amplifier Module tm Features General Description • 42% CDMA/WCDMA efficiency at +28dBm Pout The RMPA0966 Power Amplifier Module PAM is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting Cellular CDMA/WCDMA/HSDPA,


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    RMPA0966 28dBm ECJ-1VB1H102K PDF

    Untitled

    Abstract: No abstract text available
    Text: RMPA1967 US-PCS CDMA, CDMA2000-1X and WDCMA Power Edge Power Amplifier Module Features General Description • Single positive-supply operation and low power and shutdown modes The RMPA1967 power amplifier module PAM is designed for CDMA, CDMA2000-1X, WCDMA and HSDPA personal communications system (PCS) applications. The 2-stage PAM is internally matched to 50 Ohms to minimize the use of external


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    RMPA1967 CDMA2000-1X CDMA2000-1XRTT/WCDMA RMPA1965 CDMA2000-1X, PDF

    Untitled

    Abstract: No abstract text available
    Text: RMPA1967 US-PCS CDMA, CDMA2000-1X and WDCMA Power Edge Power Amplifier Module Features General Description • Single positive-supply operation and low power and shutdown modes ■ 40% CDMA/WCDMA efficiency at +28 dBm average output power ■ Compact lead-free compliant, LCC package 3.0 x 3.0 x 1.0 mm nominal


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    RMPA1967 CDMA2000-1X CDMA2000-1XRTT/WCDMA RMPA1965 PDF

    Untitled

    Abstract: No abstract text available
    Text: RMPA0967 Cellular CDMA, CDMA2000-1X and WCDMA Power Edge Power Amplifier Module Features General Description • Single positive-supply operation with low power and shutdown modes ■ 39% CDMA/WCDMA efficiency at +28 dBm average output power ■ 52% AMPS mode efficiency at +31 dBm output power


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    RMPA0967 CDMA2000-1X CDMA2000-1XRTT/WCDMA RMPA0965 PDF

    CDMA2000-1X

    Abstract: ECJ-1VB1H102K RMPA1765
    Text: RMPA1765 K-PCS, CDMA, CDMA2000-1X and WCDMA Power Edge Power Amplifier Module Features General Description • Single positive-supply operation and low power and The RMPA1765 power amplifier module PAM is designed for Korean CDMA, CDMA2000-1X, WCDMA,


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    RMPA1765 CDMA2000-1X RMPA1765 CDMA2000-1X, ECJ-1VB1H102K PDF

    tamura tlf-206-93f

    Abstract: SAC387 IPC-7711 Tamura kaken TLF-206-93F tamura solder paste tamura tlf tamura No clean solder paste S131CL-5-RMM-2450S TLF 206-93F lead free
    Text: MATRIX TRANSCEIVER MODULES ZMXM-400 Series Integrated Transceiver Module for ZigBee / IEEE 802.15.4 Evaluation Kits available DESCRIPTION The Matrix module is a 2.4 GHz IEEE 802.15.4 RF transceiver providing a cost- effective solution for data links and wireless networks. The module design is


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    ZMXM-400 100mW, tamura tlf-206-93f SAC387 IPC-7711 Tamura kaken TLF-206-93F tamura solder paste tamura tlf tamura No clean solder paste S131CL-5-RMM-2450S TLF 206-93F lead free PDF

    GRX-1525

    Abstract: Sn63pB37 temp profile DRS-22 omega 600smd Vitronics xpm2 programming smt machine ABC-2400 heller PCB monitor spc DRS22
    Text: Circuit Card Assembly Major Process Equipment Overview Component Prep Lead Forming Equipment: – Fancort Universal Lead Forming System – Fancort Pneumatic Presses – GPD Presses – Assorted Dedicated Die Sets – Streckfuss & Manix Transistor Formers


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    600SMD ABC-2400 GRX-1525 Sn63pB37 temp profile DRS-22 omega 600smd Vitronics xpm2 programming smt machine heller PCB monitor spc DRS22 PDF

    relay power door 24V 582D24-Y

    Abstract: 582D24-Y 582D24 y
    Text: COMPACT POWER RELAY 1 POLE X 2—12A 28VDC (FOR 24V BATTERY AUTOMOTIVE APPLICATIONS) FBR572, 582 SERIES RoHS compliant n FEATURES Two independent relays mounted in a single package (43% of the volume of the two FRL-270 relays) l High current contact capacity


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    28VDC) FBR572, FRL-270 FBR572: FBR582: FBR572 FBR582 relay power door 24V 582D24-Y 582D24-Y 582D24 y PDF

    Untitled

    Abstract: No abstract text available
    Text: RMPA1967 US-PCS CDMA, CDMA2000-1X and WDCMA Power Edge Power Amplifier Module Features General Description • Single positive-supply operation and low power and shutdown modes The RMPA1967 power amplifier module PAM is designed for CDMA, CDMA2000-1X, WCDMA and HSDPA personal communications system (PCS) applications. The 2-stage PAM is internally matched to 50 Ohms to minimize the use of external


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    RMPA1967 CDMA2000-1X CDMA2000-1XRTT/WCDMA RMPA1965 CDMA2000-1X, PDF

    SSG 23 TRANSISTOR

    Abstract: CDMA2000-1X ECJ-1VB1H102K RMPA1965 grm39
    Text: RMPA1965 US-PCS CDMA, CDMA2000-1X and WCDMA PowerEdge Power Amplifier Module Features General Description • Single positive-supply operation with low power and shutdown modes The RMPA1965 power amplifier module PAM is designed for CDMA, CDMA2000-1X, WCDMA and HSDPA personal communications system (PCS) applications. The 2 stage PAM is internally matched to 50Ω to minimize the use of external


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    RMPA1965 CDMA2000-1X RMPA1965 CDMA2000-1X, SSG 23 TRANSISTOR ECJ-1VB1H102K grm39 PDF

    p10 LED matrix single color module

    Abstract: tamura tlf-206-93f ZMXM-400 SAC-387
    Text: MATRIX Transceiver Modules ZMXM-400 Series Integrated Transceiver Module for ZigBee / IEEE 802.15.4 N O T FO R R EC N O EW M M D EN ES D IG ED N Evaluation Kits available DESCRIPTION The Matrix module is a 2.4 GHz IEEE 802.15.4 RF transceiver providing a cost-


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    ZMXM-400 100mW, p10 LED matrix single color module tamura tlf-206-93f SAC-387 PDF

    CDMA2000-1X

    Abstract: ECJ-1VB1H102K RMPA1965 PAM 120
    Text: RMPA1965 US-PCS CDMA, CDMA2000-1X and WCDMA PowerEdge Power Amplifier Module Features General Description • Single positive-supply operation with low power and The RMPA1965 power amplifier module PAM is designed for CDMA, CDMA2000-1X, WCDMA and HSDPA personal communications system (PCS) applications. The 2 stage PAM is internally matched to 50Ω to


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    RMPA1965 CDMA2000-1X RMPA1965 CDMA2000-1X, ECJ-1VB1H102K PAM 120 PDF