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    SOLDER PASTE SENJU SNPB Search Results

    SOLDER PASTE SENJU SNPB Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    SOLDER PASTE SENJU SNPB Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    senju solder paste

    Abstract: senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux Senju soldering paste solder powder 62Sn36Pb2Ag
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.3 SOLDER SUPPLY PROCESS 2.3.1 SOLDER PASTE 1 Material Composition Soldering paste is mainly made from soldering powder and flux. Soldering powder makes up approximately 80-95wt% of soldering paste


    Original     		PDF 80-95wt% 63Sn/37Pb) 62Sn/36Pb/2Ag) senju solder paste senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux Senju soldering paste solder powder 62Sn36Pb2Ag

    56QN50T18080

    Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
    Text: Application Report SCEA032 - March 2003 56-Pin Quad Flatpack No-Lead Logic Package Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages


    Original     		PDF SCEA032 56-Pin 56-terminal MO-220, 56QN50T18080 Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb

    Solder bar of Senju M705

    Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
    Text: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold


    Original     		PDF SCBA017D 14/16/20-terminal MO-241, Solder bar of Senju M705 senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100

    rdl 117

    Abstract: SENJU SOLDER PASTE rdl 117-a wcsp reliability IPC9701 MO-211 solder paste senju snpb wcsp package reliability
    Text: Application Report SBVA016 – September 2003 NanoStar Wafer Chip-Scale Package Design Ray Crampton, Jim Rosson High-Performance Analog Products ABSTRACT To satisfy market demand for an ultra-small, staggered 5-ball wafer-level chip-scale WCSP package, Texas Instruments has introduced the 170µm NanoStar™ YEQ


    Original     		PDF SBVA016 MO-211 rdl 117 SENJU SOLDER PASTE rdl 117-a wcsp reliability IPC9701 MO-211 solder paste senju snpb wcsp package reliability

    marking code SMD Transistor 2ak

    Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


    Original     		PDF C10535EJ9V0IF00 marking code SMD Transistor 2ak smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste

    M9627

    Abstract: uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire
    Text: SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL 1989 Document No. C10535EJ8V0IF00 8th edition Date Published February 1997 N Printed in Japan No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in


    Original     		PDF C10535EJ8V0IF00 M9627 uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire

    BGA reflow guide

    Abstract: Senju Sn3.0Ag0.5Cu land pattern for TSOP 2 86 PIN 52-pin TSOP ED-7404A senju solder paste vapor phase printer component wiring diagram for float switch with pressure tank TSOP 66 Package thermal resistance land pattern for TSOP 2 54 pin
    Text: Renesas Surface Mount Package Rev.2.00 2003.12.1 Renesas Surface Mount Package User's Manual REJ11K0001-0200Z Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is


    Original     		PDF REJ11K0001-0200Z BGA reflow guide Senju Sn3.0Ag0.5Cu land pattern for TSOP 2 86 PIN 52-pin TSOP ED-7404A senju solder paste vapor phase printer component wiring diagram for float switch with pressure tank TSOP 66 Package thermal resistance land pattern for TSOP 2 54 pin

    GE4F

    Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


    Original     		PDF C10535EJ9V0IF00 GE4F UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00

    WLCSP stencil design

    Abstract: ja 16201 WLCSP smt Texas SBVA017 wcsp wcsp reliability A104B IPC-7525 JESD22 S2062
    Text: Application Report SBVA017 - February 2004 NanoStart & NanoFreet 300mm Solder Bump Wafer Chip-Scale Package Application Jim Rosson High Performance Analog—MAKE Packaging ABSTRACT The NanoStartWafer Chip-Scale Package WCSP is a family of bare die packages


    Original     		PDF SBVA017 300mm MO-211 WLCSP stencil design ja 16201 WLCSP smt Texas wcsp wcsp reliability A104B IPC-7525 JESD22 S2062

    jesd 51-7

    Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
    Text: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs


    Original     		PDF SZZA040 54BGA 54-ball MO-205, 16-bit jesd 51-7 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000

    sharp lsi pc 2002

    Abstract: AXS628319C P28GM-50-450A1-2 FRAME32
    Text: AXS6 SOP SOCKETS AXS6 µSOCKET SERIES IC SOCKETS FOR SMALL OUTLINE PACKAGE 3. Space saving The socket occupies an area only 1.25 times the size of the IC. High density mounting is possible even if the socket is used. 4. Automated mounting compatible The socket has an open flat construction


    Original     		PDF

    SMD 8PIN IC MARKING CODE 251

    Abstract: No abstract text available
    Text: User’s Manual Renesas Semiconductor Package Mount Manual www.renesas.com Rev.2.00 Mar 2012 Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please


    Original     		PDF R50ZZ0003EJ0200 REJ11K0001-0900) SMD 8PIN IC MARKING CODE 251

    LGA 2011 Socket diagram

    Abstract: senju laser solder wire transistors catalog HLQFP 176 Package drawing FeNi42 national marking code senju jet printer smd transistor code 314 Weibull SOP EIAJ TYPE II ED-7402-1 microfocus x-ray
    Text: User’s Manual Renesas Semiconductor Package Mount Manual www.renesas.com Rev.1.01 Mar 2011 Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please


    Original     		PDF propert8175-9600, R50ZZ0003EJ0101 REJ11K0001-0900) LGA 2011 Socket diagram senju laser solder wire transistors catalog HLQFP 176 Package drawing FeNi42 national marking code senju jet printer smd transistor code 314 Weibull SOP EIAJ TYPE II ED-7402-1 microfocus x-ray

    SN74LVC1G157

    Abstract: SN74LVC1g P13A125 ti little logic land pattern for vsop 40 pins SN74LVC2G342 LVC2T45 NC7SZ112 1g125 high speed land pattern for vsop 60 pins
    Text: R E L I A B L E. L O G I C. TM I N N O V A T I O N. LITTLE LOGIC SELECTION GUIDE CBT DBV AHCT DCK CBTD CBTLV DBV DBV DCK DCK AHC DBV DCK DBV AUC DBV 5 LVC DBV(6) DCK(5) DCT DCK DBV(5) DCT DCK(5) YEP DCK(6) DCU DBV(6) YEP YZP DCK(6) DCU YZP AUP DBV(5) DBV(6)


    Original     		PDF A111103 SCYT129A SN74LVC1G157 SN74LVC1g P13A125 ti little logic land pattern for vsop 40 pins SN74LVC2G342 LVC2T45 NC7SZ112 1g125 high speed land pattern for vsop 60 pins